Formosa MS Low Capacitance Integrated ESD Protection array L054BT26 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-221810 2008/02/10 2010/11/16 Revision B Page. 7 Formosa MS Low Capacitance Integrated ESD Protection array L054BT26 Package outline 4-Line SMD Tranisent Voltage Suppressor Array- 5.0V SOT-23-6 .122(3.10) .107(2.70) Features • Low Voltage Clamping Due To Integrated Zener Diode • ESD IEC 61000-4-2 Level 4, ± 8 kV Contact Discharge .024(0.60) .012(0.30) • • .116(2.95) .104(2.65) Compliant Protection • Four Ultra-Low Input Capacitance (1 pF typ.) ESD .067(1.70) .059(1.50) Rail-to-Rail Protection Diodes Lead-free parts meet RoHS requirments. Suffix "-H" indicates Halogen-free parts, ex. L054BT26-H. .029(0.74) .014(0.35) .020(0.50) .012(0.30) Applications General-purpose downstream ESD protection high frequency analog signals and high-speed serial data transmission for ports inside : • PDAs • DVI Interfaces • Cordless Telephones • PC-/Notebook USB2.0/IEEE 1394 Ports • Wireless Data (WAN/LAN) Systems • Cellular And PCS Moblie Handsets .008(0.20) .037(0.95)Typ. .004(0.10) .004(0.10) .001(0.01) .049(1.25) .035(0.90) .022(0.55)Typ. Dimensions in inches and (millimeters) Mechanical data • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOT-23-6 • Terminals :Plated terminals, solderable per MIL-STD-750, Fig. 1A 6 Fig. 1B 5 4 5 1 3 4 6 Method 2026 • Mounting Position : Any • Weight : Approximated 0.013 gram 1 2 3 2 Maximum ratings PARAMETER Peak Pulse Power CONDITIONS 8/20us Waveform DC Input Voltage Range Electrostatic Discharge,all pins IEC 61000-4-2, Level 4, Contact Operating Temperature Range Storage Temperature Range Value UNIT PPK 80 W VI/O 5.5 V ESD ±8.0 kV TJ - 55 to + 125 -55 to +125 Tstg Electrical Characteristics (AT PARAMETER o C o C T A=25 oC unless otherwise noted) CONDITIONS SYMBOL Pin Capacitance to Ground, Pins 1,3,4,6 Vdc=0V, f=1MHz Pin 5=3V CI/O Diode Reverse Leakage Current, Pins 1,3,4,6 to Ground V=3V Ilkg Zener Diode Capacitance to Ground, Vdc=0V, f=1MHz Pin 5 to 2 Pin 5=3V Zener Diode Breakdown Voltage, I=1mA Pin 5 to 2 MIN. MAX. nA pF 40 V 9.0 6.0 0.7 VF UNIT pF 100 VBR I/O Page 2 TYP. 1.0 Czener Forward Voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SYMBOL V Document ID Issued Date Revised Date DS-221810 2008/02/10 2010/11/16 Revision B Page. 7 Rating and characteristic curves (L054BT26) Peak Pulse Power, Ppk(W) Percentage of Rated Power or Ipp Fig.1 - Non-Repetitive Peak Pulse Power Fig. 2 - Power Derating Curve 100 80 60 40 20 0 0 25 50 75 100 125 150 Ambient Temperature, T A (°C) Pulse Duration ,tp (us) Fig. 4 - Clamping Voltage vs Peak Pulse Current Fig. 3 - Pulse Waveform 110 waveform parameters tr=8us, td=20us Clamping Voltage, Vc (Volts) Percent of Ipp, % 90 80 70 e-t 60 50 40 waveform parameters tr=8us, td=20us 25 100 td=Ipp/2 30 20 20 15 10 5 10 0 0 0 5 10 15 20 25 30 0 2 Time, t (us) 6 8 10 12 Fig. 6 - Typical Forward Characteristics Fig. 5 - Typical Junction Capacitance 5.0 Forward Current, VF (Volts) 5 Junction Capacitance,( pF) 4 Peak Pulse Current, Ipp (A) 4 3 2 1 waveform parameters tr=8us, td=20us 4.0 3.0 2.0 1.0 0 0 1 2 3 4 5 0 Reverse Voltage, VR (Volts) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 2 4 6 8 10 12 Forward Current, IF (A) Page 3 Document ID Issued Date Revised Date DS-221810 2008/02/10 2010/11/16 Revision B Page. 7 Formosa MS Low Capacitance Integrated ESD Protection array L054BT26 Pinning information Simplified outline 6 5 Symbol 4 5 1 1 4 6 2 3 2 3 Marking Type number Marking code (Νοtes) L054BT26 KS05V4 F Notes: 1. 1st line:Marking code 2. 2nd line:date code Suggested solder pad layout C E C D F B A Dimensions in inches and (millimeters) PACKAGE A B C D E F SOT-23-6 0.024 (0.60) 0.043 (1.10) 0.037(0.95) 0.098(2.50) 0.063(1.60) 0.142(3.60) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-221810 2008/02/10 2010/11/16 Revision B Page. 7 Formosa MS Low Capacitance Integrated ESD Protection array L054BT26 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23-6 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.05 0.1 0.1 0.05 0.1 0.3 max 3.35 3.35 1.25 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 14.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-221810 2008/02/10 2010/11/16 Revision B Page. 7 Formosa MS Low Capacitance Integrated ESD Protection array L054BT26 Reel packing PACKAGE SOT-23-6 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 3,000 4.0 30,000 REEL DIA, (m/m) INNER BOX (m/m) 183*183*123 CARTON SIZE (m/m) 178 382*262*387 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 9.50 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date DS-221810 2008/02/10 2010/11/16 Revision B Page. 7 Formosa MS Low Capacitance Integrated ESD Protection array L054BT26 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V RWM=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Pressure Cooker 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 5. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 6. Thermal Shock 7. Humidity 8. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date DS-221810 2008/02/10 2010/11/16 Revision B Page. 7