SKM 150GB128D

SKM 150GB128D
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Absolute Maximum Ratings
Symbol Conditions
IGBT
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.
3***
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SPT IGBT Modules
SKM 150GB128D
#** 8 6 9 )* 8
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6
SEMITRANS® 3
Values
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Inverse Diode
%<
/ 1-* .
%<45
%<45)$%<
%<5
1* 8 =
/ 1-* .
Module
%>45?
/
Features
!" # $ %
Typical Applications*
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Characteristics
Symbol Conditions
IGBT
6>?
6 " % 3 &
%
6 * " *
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6 1- 6 2 @)*
46
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46 2 B
46
2 B
4>/?
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max.
Units
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typ.
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E
2*
3*
1*
3#*
#-
F
A
F
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GB
1
11-09-2006 SEN
© by SEMIKRON
SKM 150GB128D
Characteristics
Symbol Conditions
Inverse Diode
< %< 1** &8 6 * <*
min.
typ.
max.
Units
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)
)"-
/ 1)- .=
1"2
)"C
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1"1
1"3-
1")-
1C
B
11
B
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<
®
SEMITRANS 3
SPT IGBT Modules
/ )- .
A
/ 1)- .
%445
D
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6 1- 8 #** 4>/?K
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;
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F
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HIJ
Module
SKM 150GB128D
Features
L
4M@M
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*"C-
B
1)- .
*"-
B
4>?
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5
+ 5#
C
5
5#
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*"*C2
HIJ
-
N
-
N
C)-
!" # $ %
Typical Applications*
& '
(
' )*
+ ,
This is an electrostatic discharge sensitive device (ESDS), international standard
IEC 60747-1, Chapter IX.
* The specifications of our components may not be considered as an assurance of
component characteristics. Components have to be tested for the respective
application. Adjustments may be necessary. The use of SEMIKRON products in
life support appliances and systems is subject to prior specification and written
approval by SEMIKRON. We therefore strongly recommend prior consultation of
our staff.
GB
2
11-09-2006 SEN
© by SEMIKRON
SKM 150GB128D
SEMITRANS® 3
Zth
Symbol
Zth(j-c)l
Conditions
Values
Units
4
4
4
4
1
)
C
3
1
)
C
11#
)2
-"3
*"#
*"*-O#
*"**OC
*"*)C
+IJ
+IJ
+IJ
+IJ
3
*"*)
4
4
4
4
1
)
C
3
1
)
C
1A*
2)1"C"*"*CC1
*"*11C
*"**1)
+IJ
+IJ
+IJ
+IJ
3
*"**1
Zth(j-c)D
SPT IGBT Modules
SKM 150GB128D
Features
!" # $ %
Typical Applications*
& '
(
' )*
+ ,
GB
3
11-09-2006 SEN
© by SEMIKRON
SKM 150GB128D
Fig. 1 Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2 Rated current vs. temperature IC = f (TC)
Fig. 3 Typ. turn-on /-off energy = f (IC)
Fig. 4 Typ. turn-on /-off energy = f (RG)
Fig. 5 Typ. transfer characteristic
Fig. 6 Typ. gate charge characteristic
4
11-09-2006 SEN
© by SEMIKRON
SKM 150GB128D
Fig. 7 Typ. switching times vs. IC
Fig. 8 Typ. switching times vs. gate resistor RG
Fig. 9 Transient thermal impedance
Fig. 10 CAL diode forward characteristic
Fig. 11 Typ. CAL diode peak reverse recovery current
Fig. 12 Typ. CAL diode peak reverse recovery charge
5
11-09-2006 SEN
© by SEMIKRON
SKM 150GB128D
UL Recognized
File no. 63 532
K -#
6G
6
K -#
11-09-2006 SEN
© by SEMIKRON