ROHM R5009FNX

Data Sheet
10V Drive Nch MOSFET
R5009FNX
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
TO-220FM
φ3.2
10.0
4.5
2.5
8.0
15.0
Features
1)Fast reverse recovery time (trr)
12.0
2.8
14.0
2) Low on-resistance.
3) Fast switching speed.
4) Gate-source voltage
VGSS garanteed to be ±30V .
1.2
1.3
0.8
2.54
2.54
2.6
0.75
(1) (2) (3)
5) Drive circuits can be simple.
6) Parallel use is easy.
 Application
Switching
Inner circuit
 Packaging specifications
Type
Package
Basic ordering unit (pieces)
R5009FNX
∗1
Bulk
500

(1) Gate
(2) Drain
(3) Souce
(1)
 Absolute maximum ratings (Ta  25C)
Symbol
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body Diode)
VDSS
VGSS
*3
Limits
Unit
500
30
9
V
V
A
ID
IDP
*1
36
A
Continuous
IS *3
*1
I
9
36
4.5
A
A
A
SP
*2
Avalanche Current
Avalanche Energy
IAS
EAS
Power dissipation (Tc=25℃)
PD
5.4
50
mJ
W
Channel temperature
Range of storage temperature
Tch
Tstg
150
55 to +150
C
C
Symbol
Rth (ch-c)
Limits
2.5
Unit
C / W
*2
(3)
*1 Body Diode
Continuous
Pulsed
Pulsed
(2)
*1 Pw10s, Duty cycle1%
*2 L 500μH, VDD=50V, Rg=25,starting Tch=25C
*3 Limited only by maximum temperature allowed.
 Thermal resistance
Parameter
Channel to Case
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© 2011 ROHM Co., Ltd. All rights reserved.
1/5
2011.07 - Rev.A
Data Sheet
R5009FNX
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
IGSS
Drain-source breakdown voltage V(BR)DSS
Zero gate voltage drain current
Min.
Typ.
Max.
Unit
-
-
100
nA
VGS=±30V, VDS=0V
500
-
-
V
ID=1mA, VGS=0V
Conditions
IDSS
-
-
100
uA
VDS=500V, VGS=0V
VGS (th)
2.0
-
4.0
V
VDS=10V, ID=1mA
RDS (on)*
-
0.65
0.84

ID=4.5A, VGS=10V
l Yfs l*
4.0
5.7
-
S
ID=4.5A, VDS=10V
Input capacitance
Ciss
-
630
-
pF
VDS=25V
Output capacitance
Coss
-
400
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
25
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
24
-
ns
ID=4.5A, VDD
tr *
-
20
-
ns
VGS=10V
td(off) *
-
50
-
ns
RL=55.6
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Rise time
Turn-off delay time
250V
tf *
-
40
-
ns
RG=10
Total gate charge
Qg *
-
18
-
nC
ID=9.0A, VDD 250V
Gate-source charge
Gate-drain charge
Qgs *
Qgd *
-
3.5
5.5
-
nC
nC
VGS=10V
Fall time
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage
Reverse Recovery Time
Symbol
VSD *
trr *
Min.
Typ.
Max.
Unit
48
78
1.5
108
V
ns
Conditions
Is=9.0A, VGS=0V
Is=9.0A, di/dt=100A/s
*Pulsed
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© 2011 ROHM Co., Ltd. All rights reserved.
2/5
2011.07 - Rev.A
Data Sheet
R5009FNX
Electrical characteristics curves
VGS= 10V
VGS= 6.5V
10
VGS= 6.0V
VGS= 5.5V
5
VGS= 5.0V
7
VGS= 4.5V
VGS= 7.0V
6
VGS= 6.5V
5
VGS= 6.0V
4
VGS= 5.0V
2
0.001
1
2
3
4
5
6
7
Fig.1 Typical Output Characteristics( Ⅰ)
Fig.2 Typical Output Characteristics( Ⅱ)
Fig.3 Typical Transfer Characteristics
0
50
100
150
10
1
0.1
0.1
1
1.5
ID= 9A
1
0.5
ID= 4.5A
0
100
0
ID= 9A
ID= 4.5A
0.5
0
150
CHANNEL TEMPERATURE: Tch (℃)
Fig.7 Static Drain-Source On-State
Resistance vs. Channel Temperature
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© 2011 ROHM Co., Ltd. All rights reserved.
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
1.5
100
100
10
Ta= 125°C
Ta= 75°C
Ta= 25°C
0.1
0.01
0.01
10
15
Fig.6 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
VDS= 10V
Pulsed
1
5
GATE-SOURCE VOLTAGE : VGS (V)
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current
VGS= 10V
Pulsed
100
10
Ta= 25°C
Pulsed
DRAIN-CURRENT : ID[A]
Fig.4 Gate Threshold Voltage
vs. Channel Temperature
50
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta=  25°C
CHANNEL TEMPERATURE: Tch (℃)
0
2
Ta= 25°C
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[Ω]
0.1
-50
0
GATE-SOURCE VOLTAGE : VGS[V]
1
1
0.01
DRAIN-SOURCE VOLTAGE : VDS[V]
10
2
Ta=  25°C
0.1
DRAIN-SOURCE VOLTAGE : VDS[V]
VDS= 10V
ID=1mA
-50
Ta= 125°C
Ta= 75°C
Ta= 25°C
1
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
40
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[Ω]
100
20
10
VGS= 4.5V
0
0
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[Ω]
VGS= 5.5V
Ta=25°C
Pulsed
3
VDS= 10V
Pulsed
VGS= 10V
1
0
GATE THRESHOLD VOLTAGE: VGS(th) (V)
VGS= 8.0V
SOURCE CURRENT : Is [A]
DRAIN CURRENT : ID[A]
VGS= 7.0V
100
8
Ta=25°C
Pulsed
DRAIN CURRENT : ID[A]
VGS= 8.0V
DRAIN CURRENT : ID[A]
15
Ta=  25°C
VGS=0V
Pulsed
10
1
Ta= 125°C
Ta= 75°C
Ta= 25°C
0.1
Ta=  25°C
0.01
0.1
1
10
100
0
0.5
1
1.5
DRAIN-CURRENT : ID[A]
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.8 Forward Transfer Admittance
vs. Drain Current
Fig.9 Reverse Drain Current
vs. Sourse-Drain Voltage
3/5
2011.07 - Rev.A
Data Sheet
Ta=25°C
Pulsed
100
10
td(off)
1000
tf
1
10
td(on)
10
tr
100
0.01
SOURCE-CURRENT : IS[V]
10000
DRAIN CURRENT : ID (A)
CAPACITANCE : C [pF]
1000
100
Crss
Coss
1
10
8
6
Ta=25°C
VDD=250V
ID= 9A
Pulsed
4
2
10
100
0
5
10
15
20
25
30
TOTAL GATE CHARGE : Qg [nC]
Fig.12 Dynamic Input Characteristics
Operation in this area is limited by R DS(ON)
(VGS=10V)
100
10
PW=100us
1
PW=1ms
PW =10ms
0.1
Ta = 25°C
Single Pulse
0.01
0.01
0.1
1
10
100
1000
0.1
1
10
100
1000 10000
DRAIN-SOURCE VOLTAGE : VDS[V]
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.14 Maximum Safe Operating Aera
Fig.13 Typical Capacitance
vs. Drain-Source Voltage
NORMARIZED TRANSIENT THERMAL
RESISTANCE : r (t)
12
0
1
Fig.11 Switching Characteristics
1000
Ciss
10
0.1
DRAIN-CURRENT : ID[A]
Fig.10 Reverse Recovery Time vs. Source Current
Ta=25°C
f=1MHz
VGS=0V
Ta=25°C
VDD=250V
VGS=10V
RG=10Ω
Pulsed
100
1
0.1
GATE-SOURCE VOLTAGE : VGS [V]
10000
1000
SWITCHING TIME : t [ns]
REVERSE RECOVERY TIME : trr[ns]
R5009FNX
10
1
0.1
Ta = 25°C
Single Pulse
Rth(ch-a)(t) = r(t)×Rth(ch-a)
Rth(ch-a) = 44.7 °C/W
0.01
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE WIDTH : Pw(s)
Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width
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© 2011 ROHM Co., Ltd. All rights reserved.
4/5
2011.07 - Rev.A
Data Sheet
R5009FNX
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
90%
td(off)
tr
ton
tf
toff
Fig.1-2 Switching Waveforms
Fig.1-1 Switching Time Measurement Circuit
VG
VGS
ID
VDS
Qg
RL
VGS
D.U.T.
IG(Const.)
Qgs
Qgd
VDD
Charge
Fig.2-2 Gate Charge Waveform
Fig.2-1 Gate Charge Measurement Circuit
VGS
IAS
VDS
V(BR)DSS
D.U.T.
RG
L
VDD
IAS
VDD
EAS =
Fig.3-1 Avalanche Measurement Circuit
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© 2011 ROHM Co., Ltd. All rights reserved.
1
2
2
L IAS
V(BR)DSS
V(BR)DSS - VDD
Fig.3-2 Avalanche Waveform
5/5
2011.07 - Rev.A
Notice
Notes
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