ROHM R5005CNJ

Data Sheet
10V Drive Nch MOSFET
R5005CNJ
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
LPTS
10.1
1.3
13.1
9.0
Features
1) Low on-resistance.
2) High-speed switching.
3) Wide range of SOA.
4) Drive circuits can be simple.
5) Parallel use is easy.
4.5
2.54
(1) Gate
(2) Drain
(3) Source
0.4
0.78
2.7
5.08
(1)
(2)
1.2
3.0
1.0
1.24
(3)
 Application
Switching
 Packaging specifications
Type
Package
Code
Basic ordering unit (pieces)
R5005CNJ
 Inner circuit
Taping
TL
1000

∗1
∗2
 Absolute maximum ratings (Ta = 25C)
Symbol
Parameter
Drain-source voltage
VDSS
Gate-source voltage
Continuous
VGSS
ID
Pulsed
Continuous
IDP
IS
*1
Pulsed
ISP
*1
Avalanche current
Avalanche energy
IAS
EAS
*2
Power dissipation
Channel temperature
Range of storage temperature
PD
Tch
Tstg
*4
Drain current
Source current
(Body Diode)
*3
*3
*2
(1) Gate
(2) Drain
(3) Source
Limits
Unit
500
30
5
V
V
A
20
5
A
A
20
2.5
1.6
A
A
mJ
40
150
55 to 150
W
C
C
Limits
3.125
Unit
C / W
(1)
(2)
(3)
1 ESD PROTECTION DIODE
2 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 L
500H, VDD=50V, RG=25, T ch=25C
*3 Limited only by maximum temperature allowed.
*4 TC=25C
 Thermal resistance
Parameter
Channel to Case
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Symbol
Rth (ch-c)
1/5
2011.10 - Rev.A
Data Sheet
R5005CNJ
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
Min.
Max.
Unit
-
-
10
A
VGS=25V, VDS=0V
500
-
-
V
ID=1mA, VGS=0V
IGSS
Drain-source breakdown voltage V(BR)DSS
Conditions
Typ.
IDSS
-
-
100
A
VDS=500V, VGS=0V
VGS (th)
2.5
-
4.5
V
VDS=10V, ID=1mA
RDS (on)*
-
1.3
1.6

ID=2.5A, VGS=10V
l Yfs l*
1.5
2.7
-
S
VDS=10V, ID=2.5A
Input capacitance
Ciss
-
320
-
pF
VDS=25V
Output capacitance
Coss
-
180
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
15
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
20
-
ns
VDD 250V, ID=2.5A
tr
*
td(off) *
tf *
-
25
-
ns
VGS=10V
-
40
-
ns
RL=100
-
20
-
ns
RG=10
Total gate charge
Qg *
-
10.8
-
nC
VDD 250V
Gate-source charge
Gate-drain charge
Qgs *
Qgd *
-
3.2
4.4
-
nC
nC
ID=5.0A
VGS=10V
Min.
-
Typ.
-
Max.
1.5
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Rise time
Turn-off delay time
Fall time
*Pulsed
Body diode characteristics (Source-Drain)
Parameter
Forward Voltage
Symbol
VSD *
Conditions
Unit
V IS=5.0A, VGS=0V
*Pulsed
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© 2011 ROHM Co., Ltd. All rights reserved.
2/5
2011.10 - Rev.A
Data Sheet
R5005CNJ
Electrical characteristic curves
Fig.1 Typical Output Characteristics (Ⅰ)
0.4
VGS=5.0V
0.2
3
VGS=6.5V
VGS=6.0V
Ta=25℃
pulsed
2
VGS=5.5V
VGS=5.0V
1
VGS=4.5V
0
0.2
0.4
0.6
0.8
2
0.1
0.01
4
6
8
0
10
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current
6
3
2
1
0
0
50
100
10
1
Ta=125℃
Ta= 75℃
Ta= 25℃
Ta= -25℃
0.1
0.01
0.001
150
Fig.7 Static Drain-Source On-State
Resistance vs. Channel Temperature
4
3
ID= 5.0A
2
ID= 2.5A
1
0
-50
0
50
100
150
CHANNEL TEMPERATURE: Tch (℃)
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© 2011 ROHM Co., Ltd. All rights reserved.
6
7
4
3
ID= 5.0A
2
ID= 2.5A
1
0.1
1
10
0
100
5
10
15
GATE-SOURCE VOLTAGE : VGS (V)
Fig.8 Forward Transfer Admittance
vs. Drain Current
FORWARD TRANSFER ADMITTANCE : |Yfs| (S)
VGS= 10V
Pulsed
5
Ta=25℃
pulsed
DRAIN CURRENT : ID (A)
CHANNEL TEMPERATURE: Tch (℃)
5
4
0
0.01
Fig.9 Reverse Drain Current vs.
Sourse-Drain Voltage
10
10
VDS= 10V
Pulsed
VGS= 0V
Pulsed
SOURCE CURRENT : IS (A)
-50
3
5
VGS= 10V
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) (Ω)
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) (Ω)
4
2
Fig.6 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
100
VDS= 10V
ID= 1mA
1
GATE-SOURCE VOLTAGE : VGS (V)
Drain-Source Voltage : VDS [V]
Fig.4 Gate Threshold Voltage
vs. Channel Temperature
5
Ta=125℃
Ta= 75℃
Ta= 25℃
Ta= -25℃
0.001
0
1
Drain-Source Voltage : VDS [V]
GATE THRESHOLD VOLTAGE: VGS(th) (V)
1
VGS=4.5V
0
0
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) (Ω)
DRAIN CURRENT : ID (A)
0.6
VDS= 10V
Pulsed
VGS=10V
VGS=9.0V
VGS=8.0V
VGS=7.5V
VGS=7.0V
4
Drain Current : ID [A]
Drain Current : ID [A]
0.8
10
5
Ta=25℃
pulsed
VGS=10.0V
VGS=9.0V
VGS=8.0V
VGS=7.5V
VGS=7.0V
VGS=6.5V
VGS=6.0V
Fig.3 Typical Transfer Characteristics
Fig.2 Typical Output Characteristics (Ⅱ)
1
1
0.1
Ta=125℃
Ta= 75℃
Ta= 25℃
Ta= -25℃
0.01
0.001
0.001
1
0.1
Ta=125℃
Ta= 75℃
Ta= 25℃
Ta= -25℃
0.01
0.001
0.01
0.1
1
DRAIN CURRENT : ID (A)
3/5
10
0
0.5
1
1.5
SOURCE-DRAIN VOLTAGE : VSD (V)
2011.10 - Rev.A
Fig.11 Reverse Recovery Time
vs.Source Current
Fig.10 Typical Capacitance vs.
Drain-Source Voltage
10000
Fig.12 Switching Characteristics
1000
1000
Ciss
100
Coss
10
Ta= 25℃
f= 1MHz
VGS= 0V
Crss
1
10000
SWITCHING TIME : t (ns)
REVERSE RECOVERY TIME: trr (ns)
CAPACITANCE : C (pF)
Data Sheet
R5005CNJ
100
Ta= 25℃
di / dt= 100A / μs
VGS= 0V
Pulsed
0.1
1
10
100
1000
DRAIN-SOURCE VOLTAGE : VDS (V)
1000
td(off)
100
10
tr
td(on)
1
10
0.01
Ta= 25℃
VDD= 250V
VGS= 10V
RG= 10Ω
Pulsed
tf
0.1
1
10
SOURCE CURRENT : IS (A)
100
0.01
0.1
1
10
DRAIN CURRENT : ID (A)
Fig.13 Dynamic Input Characteristics
GATE-SOURCE VOLTAGE : VGS (V)
15
Ta= 25℃
VDD= 250V
ID= 5A
RG= 10Ω
Pulsed
10
5
0
0
5
10
15
TOTAL GATE CHARGE : Qg (nC)
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© 2011 ROHM Co., Ltd. All rights reserved.
4/5
2011.10 - Rev.A
Data Sheet
R5005CNJ
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
ton
Fig.1-1 Switching Time Measurement Circuit
90%
td(off)
tr
tf
toff
Fig.1-2 Switching Waveforms
VG
VGS
ID
VDS
RL
Qg
VGS
D.U.T.
IG(Const.)
Qgs
Qgd
VDD
Charge
Fig.2-2 Gate Charge Waveform
Fig.2-1 Gate Charge Measurement Circuit
VGS
IAS
VDS
V(BR)DSS
D.U.T.
RG
L
VDD
IAS
VDD
EAS =
Fig.3-1 Avalanche Measurement Circuit
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© 2011 ROHM Co., Ltd. All rights reserved.
1
2
L IAS
2
V(BR)DSS
V(BR)DSS - VDD
Fig.3-2 Avalanche Waveform
5/5
2011.10 - Rev.A
Notice
Notes
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R1120A