ROHM RSJ10HN06

Data Sheet
4V Drive Nch MOSFET
RSJ10HN06
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
LPTS
10.1
1.3
13.1
9.0
Features
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) High power Package
4.5
2.54
0.4
0.78
2.7
5.08
(1)
(2)
1.2
3.0
1.0
1.24
(3)
 Application
Switching
 Packaging specifications
 Inner circuit
Package
Type
Code
Basic ordering unit (pieces)
RSJ10HN06
Taping
TL
1000

∗1
∗2
(1)
(1) Gate
(2) Drain
(3) Source
(2)
(3)
1 ESD PROTECTION DIODE
2 BODY DIODE
Absolute maximum ratings (Ta = 25°C)
Parameter
Symbol
Limits
Unit
VDSS
60
20
V
V
100
A
200
100
A
A
200
100
A
W
Tch
Tstg
150
55 to 150
C
C
Symbol
Rth (ch-c)*
Limits
1.25
Unit
C / W
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body Diode)
VGSS
ID *3
Continuous
Pulsed
Continuous
IDP
IS
*1
Pulsed
ISP
PD
*1
Power dissipation
Channel temperature
Range of storage temperature
*3
*2
*1 Pw10s, Duty cycle1%
*2 TC=25C
*3 Limited only by maximum channel temperature allowed.
 Thermal resistance
Parameter
Channel to Case
* T C=25°C
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1/6
2011.09 - Rev.A
Data Sheet
RSJ10HN06
Electrical characteristics (Ta = 25°C)
Parameter
Gate-source leakage
Symbol
Min.
IGSS
Drain-source breakdown voltage V(BR)DSS
Typ.
Max.
Unit
-
-
10
A
VGS=20V, VDS=0V
60
-
-
V
ID=1mA, VGS=0V
Conditions
IDSS
-
-
1
A
VDS=60V, VGS=0V
Gate threshold voltage
VGS (th)
1.0
-
2.5
V
VDS=10V, ID=1mA
Static drain-source on-state
resistance
RDS (on)*
-
3.0
4.2
-
3.5
4.9
Forward transfer admittance
l Yfs l *
60
-
-
Input capacitance
Ciss
-
11000
-
pF
VDS=10V
Output capacitance
Coss
-
2000
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
1050
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
50
-
ns
VDD 30V, ID=50A
tr *
-
470
-
ns
VGS=10V
td(off) *
-
420
-
ns
RL=0.6
tf *
-
710
-
ns
RG=10
Total gate charge
Qg *
-
202
-
nC
VDD 30V, ID=50A
Gate-source charge
Gate-drain charge
Qgs *
Qgd *
-
35
42
-
nC
nC
VGS=10V
Min.
Typ.
Max.
Unit
-
-
1.5
V
Zero gate voltage drain current
Rise time
Turn-off delay time
Fall time
m
S
ID=50A, VGS=10V
ID=50A, VGS=4V
VDS=10V, ID=50A
*Pulsed
Body diode characteristics (Source-Drain)
Parameter
Forward Voltage
Symbol
VSD *
Conditions
Is=100A, VGS=0V
*Pulsed
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2/6
2011.09 - Rev.A
Data Sheet
RSJ10HN06
Electrical characteristic curves (Ta=25C)
Fig.2 Typical Output Characteristics (Ⅱ)
Fig.1 Typical Output Characteristics (Ⅰ)
50
50
VGS=10.0V
VGS=4.5V
VGS=4.0V
40
VGS=10.0V
VGS=3.5V
30
Ta=25℃
pulsed
VGS=3.0V
Drain Current : ID [A]
40
Drain Current : ID [A]
Ta=25°C
Pulsed
VGS=3.0V
20
VGS=4.5V
VGS=4.0V
30
VGS=3.5V
20
VGS=2.5V
10
10
VGS=2.5V
0
0
0
0.2
0.4
0.6
0.8
1
0
4
8
10
Fig.3 Static Drain-Source On-State Resistance vs. Drain Current
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current
100
VGS=10V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [mW]
Ta=25°C
Pulsed
VGS=4.0V
VGS=10V
10
1
0.1
0.01
0.1
1
10
10
1
0.1
0.01
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
Drain Current : ID [A]
1
10
100
Drain Current : ID [A]
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
100
100
VGS=4.5V
pulsed
VGS=4V
pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
Static Drain-Source On-State Resistance
RDS(on) [mW]
Static Drain-Source On-State Resistance
RDS(on) [mW]
6
Drain-Source Voltage : VDS [V]
100
Static Drain-Source On-State Resistance
RDS(on) [mW]
2
Drain-Source Voltage : VDS [V]
10
1
0.1
0.01
0.1
1
10
Drain Current : ID [A]
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10
1
0.1
0.01
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
1
10
100
Drain Current : ID [A]
3/6
2011.09 - Rev.A
Data Sheet
RSJ10HN06
Fig.7 Forward Transfer Admittance vs. Drain Current
Fig.8 Typical Transfer Characteristics
100
1000
VDS=10V
pulsed
VDS=10V
pulsed
10
Drain Currnt : ID [A]
Forward Transfer Admittance
Yfs [S]
100
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
0.01
0.1
0.01
0.01
0.001
0.1
1
10
100
0.0
1.0
2.0
2.5
3.0
3.5
Fig.9 Source Current vs. Source-Drain Voltage
Fig.10 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
20
VGS=0V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [mW]
Ta=25°C
Pulsed
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
ID=50A
15
ID=100A
10
5
0
0.01
0.0
0.5
1.0
0
1.5
2
Source-Drain Voltage : VSD [V]
4
6
8
10
Gate-Source Voltage : VGS [V]
Fig.12 Dynamic Input Characteristics
Fig.11 Switching Characteristics
100000
10
VDD≒30V
VGS=10V
RG=10Ω
Ta=25°C
Pulsed
tf
td(off)
1000
100
Ta=25°C
VDD=30V
ID=50A
Pulsed
8
Gate-Source Voltage : VGS [V]
10000
Switching Time : t [ns]
1.5
Gate-Source Voltage : VGS [V]
100
Source Current : Is [A]
0.5
Drain Current : ID [A]
tr
6
4
2
td(on)
10
0
0.01
0.1
1
10
100
0
Drain Current : ID [A]
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50
100
150
200
250
Total Gate Charge : Qg [nC]
4/6
2011.09 - Rev.A
Data Sheet
RSJ10HN06
Fig.14 Normalized Transient Thermal Resistance v.s. Pulse Width
Fig.13 Typical Capacitance vs. Drain-Source Voltage
100000
10
Normalized Transient Thermal Resistance : r(t)
Ta=25°C
f=1MHz
VGS=0V
Capacitance : C [pF]
Ciss
10000
Coss
1000
Crss
100
Ta=25°C
Single Pulse
1
0.1
0.01
Mounted on epoxy board.
(25mm × 28mm × 0.8mm)
Rth(ch-a)=70.6°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.001
0.0001
0.01
0.1
1
10
0.0001
100
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0.001
0.01
0.1
1
10
100
1000
Pulse width : Pw (s)
Drain-Source Voltage : VDS [V]
5/6
2011.09 - Rev.A
Data Sheet
RSJ10HN06
Electrical characteristics (Ta = 25°C)
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
ton
Fig.1-1 Switching Time Measurement Circuit
90%
td(off)
tr
tf
toff
Fig.1-2 Switching Waveforms
VG
VGS
ID
VDS
RL
IG(Const.)
D.U.T.
Qg
VGS
Qgs
Qgd
VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
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Fig.2-2 Gate Charge Waveform
6/6
2011.09 - Rev.A
Notice
Notes
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R1120A