CYStech Electronics Corp. Spec. No. : C338N3 Issued Date : 2010.10.05 Revised Date : 2010.10.22 Page No. : 1/6 1.2Amp. Surface Mount Schottky Barrier Diodes RB140N3 Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 • Pb-free lead plating package Equivalent Circuit Outline RB140N3 SOT-23 3 1 Cathode 2 1：Anode 2：Not Connected 3：Cathode Anode Not Connected Applications • DC-DC converters. • Strobes. • Mobile phones. • Charging circuits. • Motor control. RB140N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C338N3 Issued Date : 2010.10.05 Revised Date : 2010.10.22 Page No. : 2/6 Absolute Maximum Ratings (Rating at 25°C ambient temperature unless otherwise specified.) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Average forward rectified current Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Power Dissipation (Note) Maximum thermal resistance, Junction to ambient (Note) Operating Junction and Storage Temperature range Symbol Limits Units VRRM VRMS VR IO 40 28 40 1.2 V V V A IFSM 10 A PD 625 mW Rth,JA TJ ; Tstg 250 -50 ~ +150 ℃/W ℃ Note : For a device mounted on 25mm×25mm FR-4 PCB with high coverage of single sided 1oz copper, in still air condition. Characteristics (TA=25°C) Characteristic Symbol Reverse Breakdown Voltage Forward Voltage Reverse Leakage Current Capacitance Between Terminals V(BR)R VF 1 VF 2 VF 3 VF 4 VF 5 VF 6 VF7 IR 1 IR 3 CT Condition IR=80μA IF=50mA IF=100mA IF=250mA IF=400mA IF=750mA IF=1000mA IF=1500mA VR=30V VR=30V, TA=85°C VR=30V, f=1MHz Min. Typ Max. Unit 40 - - V - 326 350 393 420 480 520 4 100 21 340 360 410 460 500 550 630 20 - mV μA μA pF Ordering Information Device RB140N3 RB140N3 Package SOT-23 (Pb-free lead plating package) Shipping Marking 3000 pcs / Tape & Reel S14 CYStek Product Specification Spec. No. : C338N3 Issued Date : 2010.10.05 Revised Date : 2010.10.22 Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Fig. 2 Maximum Non-repetitive Peak Forward Surge Current Fig. 1 Power Derating Curve 0.7 Peak Forward Surge Current---IFSM (A) 12 Power Dissipation--PD(W) 0.6 0.5 0.4 0.3 0.2 0.1 0 10 8 6 4 2 0 0 25 50 75 100 125 150 175 1 200 10 Ambient Temperature---TA(℃) Fig 3. Forward Characteristics Fig. 4 Typical Reverse Characteristics 10000 10000 Reverse Leakage Current---I R(μA) Instantaneous Forward Current---IF(mA) 100 Number of cycles at 60Hz 1000 100 Pulse width=300μs, 1% Duty cycle 10 1000 Tj=125℃ 100 Tj=75℃ 10 1 Tj=25℃ 0.1 0 0.2 0.4 0.6 0.8 Forward Voltage---VF(V) 1 0 10 20 30 40 Reverse Voltage---VR(V) Fig. 5 Typical Junction Capacitance Junction Capacitance---CJ(pF) 1000 100 Tj=25℃, f=1.0MHz Vsig=50mVp-p 10 0.1 1 10 100 Reverse Voltage---VR (V) RB140N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C338N3 Issued Date : 2010.10.05 Revised Date : 2010.10.22 Page No. : 4/6 Reel Dimension Carrier Tape Dimension RB140N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C338N3 Issued Date : 2010.10.05 Revised Date : 2010.10.22 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. RB140N3 CYStek Product Specification Spec. No. : C338N3 Issued Date : 2010.10.05 Revised Date : 2010.10.22 Page No. : 6/6 CYStech Electronics Corp. SOT-23 Dimension Marking: A L 3 B TE S14 S 2 1 G V 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 C D Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 DIM A B C D G H K H Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 Style: Pin 1.Anode 2.Not Connected 3.Cathode J DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. RB140N3 1A CYStek Product Specification