Eon Silicon Solution Inc. Application Note EON EN29GL256 (Version : F) vs MXIC MX29GL256E (Version : 1.1) This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 1 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. 1. INTRODUCTION The application note introduces how to implement a system design from MXIC MX29GL256E Flash to Eon EN29GL256 Flash. 2. GENERAL FUNCTION COMPARISON TABLE: 2.1 The following table highlights the major features of these two devices. Features Voltage range Pin to pin compatible EN29GL256 2.7 ~ 3.6V 56-pin TSOP 64-ball BGA (11 x 13 mm) Access time 90ns @ 2.7 ~ 3.6V Secured silicon sector region 256 byte 256 byte Sector architecture Uniform 256 sectors of 128K byte Uniform 256 sectors of 128K byte Minimum endurance cycle 100K 100K Package 56-pin TSOP 64-ball BGA (11 x 13 mm) 56-pin TSOP 64-ball FBGA (10 x 13 mm) 64-ball LFBGA (11 x 13 mm) 70-pin SSOP This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 2 MX29GL256E 2.7 ~ 3.6V 56-pin TSOP 64-ball LFBGA (11 x 13 mm) 100ns @ 2.7 ~ 3.6V 90ns @ 3.0 ~ 3.6V ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. 3. HARDWARE CONSIDERATIONS 3.1 ICC comparison The ICC performance of EN29GL256 is better than MX29GL256E. EN29GL256 MX29GL256E Read ICC1 Max 45 Max 100 Program / Erase ICC3 30 30 mA Standby ICC4 10 100 A Current Unit mA 3.2 Device operating modes EN29GL256 This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 3 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. MX29GL256E EN29GL256 does not support Sector Lock Status Verification, Read Manufacturer ID, and Read Device ID in autoselect mode. This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 4 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 5 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. 4. SOFTWARE CONSIDERATIONS 4.1. Instruction set comparison EN29GL256 The manufacturer ID and Device ID of EN29GL256 and MX29GL256E are different. For Read Lock Register instruction, the address of 1st cycle of EN29GL256 is 00 while that of MX29GL256E is don’t care. This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 6 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 7 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. MX29GL256E EN29GL256 does not support Factory Protect Verify, Deep power down, and Password Protection. This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 8 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 9 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 10 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. 4.3 Different sector protection bits combination The combination of sector protection bits are different. EN29GL256 MX29GL256E This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 11 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. 4.4 Different Lock Register bit definition The definition of Lock Register bits are different except for DQ0 and DQ1. EN29GL256 MX29GL256E This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 12 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. 5. PERFORMANCE DIFFERENCES The erasing and programming performance of EN29GL256 is better than MX29GL256E except for TOE and TDS. 5.1 ERASE AND PROGRAM PERFORMANCE EN29GL256 Parameter MX29GL256E Unit Typ Max Typ Max Sector erase time 0.1 2 0.6 5 sec Chip erase time 60 240 128 300 sec Byte programming time 8 200 N/A N/A us Word programming time 8 200 11 360 us 268.8 806.4 134.4 403.2 100 350 sec Chip programming Byte time Word Total write buffer time 160 200 us ACC total write buffer time 60 100 us 5.2 KEY AC PARAMETER PERFORMANCE Parameter EN29GL256 MX29GL256E TACC (address to output delay) Max @ 90ns Max @ 110ns TCE (chip enable to output delay) Max @ 90ns Max @ 110ns TPACC (page access time) Max @ 25ns Max @ 30ns TOE (output enable to output delay) Max @ 35ns Max @ 30ns TAS (address setup time) Min @ 0ns Min @ 0ns TDS (data setup time) Min @ 40ns Min @ 30ns TVCS (Vcc setup time) Min @ 50us Min @ 500us This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 13 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com Eon Silicon Solution Inc. Revisions List Revision No Description Date A 2010/07/12 Initial Release This Application Note may be revised by subsequent versions or modifications due to changes in technical specifications. 14 ©2005 Eon Silicon Solution Inc. Rev. A, Issue Date: 2010/ 07/12 www.eonssi.com