TSL2671

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The technical content of this TAOS datasheet is still valid.
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TSL2671
DIGITAL PROXIMITY DETECTOR
r
r
TAOS118 − JANUARY 2011
Features
PACKAGE FN
DUAL FLAT NO-LEAD
(TOP VIEW)
D Proximity Detection with an Integrated LED
Driver in a Single Device
D
D
Description
6 SDA
SCL 2
5 INT
GND 3
4 LDR
Package Image Not Actual Size
Applications
D
D
D
D
Cell Phone Touch Screen Disable
Notebook/Monitor Security
lv
D
VDD 1
Automatic Speakerphone Enable
Automatic Menu Popup
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D
− Programmable Number of IR Pulses
− Programmable Current Sink for the IR
LED — No Limiting Resistor Needed
− Programmable Interrupt Function with
Upper and Lower Threshold
− Covers a 2000:1 Dynamic Range
Programmable Wait Timer
− Programmable from 2.72 ms
to > 8 Seconds
− Wait State — 65 mA Typical Current
I2C Interface Compatible
− Up to 400 kHz (I2C Fast Mode)
− Dedicated Interrupt Pin
Small 2 mm 2 mm ODFN Package
Sleep Mode — 2.5 mA Typical Current
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D Proximity Detection
The TSL2671 family of devices provides a complete proximity detection system and digital interface logic in a
single 6-pin package. The device includes a digital proximity sensor with integrated LED driver for the required
external IR LED. The proximity function offers a wide range of performance, with four programmable LED drive
currents and a pulse repetition range of 1 to 32 pulses. The proximity detection circuitry compensates for
ambient light, allowing it to operate in environments ranging from bright sunlight to dark rooms. This wide
dynamic range also allows operation in short-distance detection applications behind dark glass, such as cell
phones. An internal state machine provides the ability to put the device into a low-power mode for very low
average power consumption.
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The proximity function specifically targets near-field proximity applications. In cell phones, for example, the
proximity detection function can detect when the user positions the phone close to their ear. The device is fast
enough to provide proximity information at the high repetition rate needed when answering a phone call. This
provides both improved green power saving capability and the added security to lock the screen when the user
may accidently deploy a touch.
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Communication with the device is accomplished through a simple two-wire I2C interface with data rates up to
400 kHz. An interrupt output pin is provided for connection to the host processor. This interrupt pin can be used
to eliminate the need to poll the device on a repetitive basis. There is also a digital filter that compares the
proximity ADC results to programmed values so that an interrupt is generated only upon a proximity event.
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The TSL2671 is supplied in a very small form factor 2-mm × 2-mm, 6-pin optical package, requiring very little
PCB area. Also, the package height is only 0.65 mm high, which makes the TSL2671 suitable for very thin
mechanical applications.
The LUMENOLOGY r Company
Copyright E 2011, TAOS Inc.
r
Texas Advanced Optoelectronic Solutions Inc.
1001 Klein Road S Suite 300 S Plano, TX 75074 S (972)
r 673-0759
www.taosinc.com
1
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Functional Block Diagram
Interrupt
Prox
Integration
Prox
ADC
Upper Limit
Prox
Data
Lower Limit
Wait Control
GND
CH0
CH1
SDA
lv
Detailed Description
SCL
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Prox Control
VDD
INT
I2C Interface
IR LED Constant
Current Sink
LDR
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The TSL2671 light-to-digital device provides on-chip photodiodes, integrating amplifiers, ADCs, accumulators,
clocks, buffers, comparators, a state machine, and an I2C interface. Each device combines a Channel 0
photodiode (CH0), which is responsive to both visible and infrared light, and a channel 1 photodiode (CH1),
which is responsive primarily to infrared light. Proximity detection can occur using either or both photodiodes.
Two integrating ADCs simultaneously convert the amplified photodiode currents into a digital value providing
up to 16 bits of resolution. Upon completion of the conversion cycle, the conversion result is transferred to the
data registers.
Proximity detection requires only a single external IR LED. An internal LED driver can be configured to provide
a constant current sink of 12.5 mA, 25 mA, 50 mA, or 100 mA of current. No external current limiting resistor
is required. The number of proximity LED pulses can be programmed from 1 to 255 pulses. Each pulse has a
16-μs period. This LED current, coupled with the programmable number of pulses, provides a 2000:1
contiguous dynamic range.
Communication to the device is accomplished through a fast (up to 400 kHz), two-wire I2C serial bus for easy
connection to a microcontroller or embedded controller. The digital output of the device is inherently more
immune to noise when compared to an analog interface.
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The device provides a separate pin for level-style interrupts. When interrupts are enabled and a pre-set value
is exceeded, the interrupt pin is asserted and remains asserted until cleared by the controlling firmware. The
interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a proximity
value. An interrupt is generated when the value of a proximity conversion exceeds either an upper or lower
threshold. In addition, a programmable interrupt persistence feature allows the user to determine how many
consecutive exceeded thresholds are necessary to trigger an interrupt.
Copyright E 2011, TAOS Inc.
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Terminal Functions
TERMINAL
TYPE
DESCRIPTION
NAME
NO.
GND
3
INT
5
O
Interrupt — open drain.
LDR
4
O
LED driver for proximity emitter — up to 100 mA, open drain.
SCL
2
I
I2C serial clock input terminal — clock signal for I2C serial data.
SDA
6
I/O
VDD
1
Power supply ground. All voltages are referenced to GND.
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I2C serial data I/O terminal — serial data I/O for I2C .
Supply voltage.
DEVICE
ADDRESS
PACKAGE − LEADS
lv
Available Options
INTERFACE DESCRIPTION
ORDERING NUMBER
TSL26711
0x39
FN−6
I2C
TSL26713
0x39
FN−6
I2C Vbus = 1.8 V Interface
TSL26715
0x29
FN−6
I2C Vbus = VDD Interface
TSL26715FN
FN−6
I2C
TSL26717FN
TSL26711FN
TSL26713FN
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Vbus = VDD Interface
TSL26717
0x29
Vbus = 1.8 V Interface
Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 V
Digital output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.8 V
Digital output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1 mA to 20 mA
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
ESD tolerance, human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
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Recommended Operating Conditions
NOM
MAX
2.6
3
3.6
−3
3
%
Operating free-air temperature, TA
−30
70
°C
UNIT
V
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MIN
Supply voltage, VDD
Supply voltage accuracy, VDD total error including transients
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Operating Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Active — LDR pulse off
Supply current
VOL
INT SDA output low voltage
INT,
I LEAK
Leakage current, SDA, SCL, INT pins
I LEAK
Leakage current, LDR pin
VIH
SCL SDA input high voltage
SCL,
VIL
SCL SDA input low voltage
SCL,
MAX
175
250
Wait mode
65
Sleep mode
2.5
μA
4
3 mA sink current
0
0.4
6 mA sink current
0
0.6
−5
5
± 10
TSL26711, TSL26715
0.7 VDD
TSL26713, TSL26717
1.25
V
μA
μA
V
0.3 VDD
TSL26711, TSL26715
0.54
V
lv
TSL26713, TSL26717
UNIT
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IDD
TYP
PARAMETER
IDD
Supply current
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Proximity Characteristics, VDD = 3 V, TA = 25C, PEN = 1 (unless otherwise noted)
TEST CONDITIONS
CONDITION
Pulse period
Pulse — LED on time
PTIME = 0xFF
PDRIVE=0
ISINK sink current @ 600 mV,
LDR pin
LED Drive
2.58
2.72
MAX
3
PTIME = 0xFF
ADC number of integration steps
IR LED pulse count
TYP
LDR pulse on
ADC conversion time step size
ADC counts per step
MIN
2.9
UNIT
mA
ms
1
256
steps
0
1023
counts
0
255
pulses
75
16.3
μs
7.2
μs
100
PDRIVE=1
50
PDRIVE=2
25
PDRIVE=3
12.5
Operating distance (See note 1)
125
18
mA
inches
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NOTE 1: Proximity Operating Distance is dependent upon emitter properties and the reflective properties of the proximity surface. The nominal
value shown uses an IR emitter with a peak wavelength of 850 nm and a 20° half angle. The proximity surface used is 90% reflective
(white surface) 16 × 20-inch Kodak Gray Card. 60 mw/SR, 100 mA, 64 pulses, open view (no glass). Note: Greater distances are
achievable with appropriate system considerations.
Wait Characteristics, VDD = 3 V, TA = 25C, WEN = 1 (unless otherwise noted)
TEST CONDITIONS
CHANNEL
ni
PARAMETER
Wait step size
WTIME = 0xFF
TYP
2.58
2.72
1
MAX
UNIT
2.9
ms
256
steps
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Wait number of integration steps
MIN
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
AC Electrical Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted)
PARAMETER†
TEST CONDITIONS
MIN
0
MAX
UNIT
400
kHz
f(SCL)
Clock frequency
t(BUF)
Bus free time between start and stop condition
1.3
μs
t(HDSTA)
Hold time after (repeated) start condition. After
this period, the first clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
t(SUDAT)
Data setup time
100
t(LOW)
SCL clock low period
1.3
t(HIGH)
SCL clock high period
0.6
tF
Clock/data fall time
tR
Clock/data rise time
Ci
Input pin capacitance
μs
ns
μs
μs
lv
0
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only)
TYP
300
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†
(I2C
ns
300
ns
10
pF
Specified by design and characterization; not production tested.
PARAMETER MEASUREMENT INFORMATION
t(LOW)
VIH
SCL
VIL
t(R)
t(F)
t(HDSTA)
t(BUF)
t(HIGH)
t(HDDAT)
t(SUSTA)
t(SUSTO)
t(SUDAT)
VIH
SDA
VIL
S
S
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P
Start
Condition
Start
P
Stop
t(LOWSEXT)
SCLACK
SCLACK
t(LOWMEXT)
t(LOWMEXT)
ni
Stop
Condition
t(LOWMEXT)
SDA
Figure 1. Timing Diagrams
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SCL
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
TYPICAL CHARACTERISTICS
LDR OUTPUT COMPLIANCE
SPECTRAL RESPONSIVITY
112.5
1
Ch 0
0.6
0.4
Ch 1
75
62.5
50 mA
50
lv
Load Current — mA
87.5
37.5
25 mA
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25
0.2
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100
0.8
Normalized Responsivity
100 mA
12.5 mA
12.5
0
300
400
500
600
700
800
900 1000 1100
0
0
0.3
0.6
0.9
1.2
VOL − Output Low Voltage − V
λ − Wavelength − nm
Figure 2
Figure 3
NORMALIZED IDD
vs.
VDD and TEMPERATURE
110%
108%
104%
50C
25C
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102%
100%
0C
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98%
96%
ch
IDD Normalized @ 3 V, 25C
75C
106%
94%
2.8
Te
92%
2.7
Copyright E 2011, TAOS Inc.
2.9
3
3.1
3.2
3.3
VDD — V
Figure 4
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
PRINCIPLES OF OPERATION
System State Machine
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The device provides control of proximity detection and power management functionality through an internal
state machine. After a power-on-reset, the device is in the sleep mode. As soon as the PON bit is set, the device
will move to the start state. It will then cycle through the Proximity and Wait states. If these states are enabled,
the device will execute each function. If the PON bit is set to a 0, the state machine will continue until the current
conversion is complete and then go into a low-power sleep mode.
Sleep
PON = 1
(r0x00:b0)
PON = 0
(r0x00:b0)
Prox
lv
Start
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Wait
Figure 5. Simplified State Diagram
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NOTE: In this document, the nomenclature uses the bit field name in italics followed by the register number and
bit number to allow the user to easily identify the register and bit that controls the function. For example, the
power on (PON) is in register 0x00, bit 0. This is represented as PON (r0x00:b0).
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Proximity Detection
Proximity sensing uses an external light source (generally an infrared emitter) to emit light, which is then viewed
by the integrated light detector to measure the amount of reflected light when an object is in the light path
(Figure 6). The amount of light detected from a reflected surface can then be used to determine an object’s
proximity to the sensor.
Distance (D)
IR LED
2771
Optical Crosstalk (OC)
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Background Energy (BGE)
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Glass Attenuation (GA)
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Surface Reflectivity (SR)
Figure 6. Proximity Detection
The device has controls for the number of IR pulses (PPCOUNT), the integration time (PTIME), the LED drive
current (PDRIVE), and the photodiode configuration (PDIODE) (Figure 7). The photodiode configuration can
be set to CH1 diode (recommended), CH0 diode, or a combination of both diodes. At the end of the integration
cycle, the results are latched into the proximity data (PDATAx) registers.
IR
LED
VDD
PDRIVE(r0x0F, b7:6)
PTIME(r0x02)
IR LED Constant
Current Sink
Prox Control
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Prox
Integration
CH0
Prox
ADC
CH1
Prox
Data
PDATAH(r0x19), PDATAL(r0x18)
PPCOUNT(r0x0E)
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Figure 7. Proximity Detection Operation
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The LED drive current is controlled by a regulated current sink on the LDR pin. This feature eliminates the need
to use a current limiting resistor to control LED current. The LED drive current can be configured for 12.5 mA,
25 mA, 50 mA, or 100 mA. For higher LED drive requirements, an external P type transistor can be used to
control the LED current.
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
The number of LED pulses can be programmed to any value between 1 and 255 pulses as needed. Increasing
the number of LED pulses at a given current will increase the sensor sensitivity. Sensitivity grows by the square
root of the number of pulses. Each pulse has a 16-μs period.
Add IR +
Background
Subtract
Background
LED Off
16 ms
IR LED Pulses
lv
Figure 8. Proximity IR LED Waveform
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LED On
The proximity integration time (PTIME) is the period of time that the internal ADC converts the analog signal
to a digital count. It is recommend that this be set to a minimum of PTIME = 0xFF or 2.72 ms.
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The combination of LED power and number of pulses can be used to control the distance at which the sensor
can detect proximity. Figure 9 shows an example of the distances covered with settings such that each curve
covers 2× the distance. Counts up to 64 pulses provide a 16× range.
PROXIMITY ADC COUNT
vs.
RELATIVE DISTANCE
1000
25 mA,
1 Pulse
100 mA,
16 Pulses
600
400
100 mA,
1 Pulse
ni
200
100 mA,
4 Pulses
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Proximity ADC Count
800
100 mA,
64 Pulses
0
8
16
Relative Distance
ch
1 2 4
Te
Figure 9
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Interrupts
The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for
a proximity value. The interrupt mode is determined by the state of the PIEN field in the ENABLE register.
Two 16-bit-wide interrupt threshold registers allow the user to define upper and lower threshold limits. An
interrupt can be generated when the proximity data (PDATA) exceeds the upper threshold value (PIHTx) or falls
below the lower threshold (PILTx).
Upper Limit
Prox Persistence
Prox
Data
Lower Limit
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CH0
Prox
ADC
PPERS(r0x0C, b7:4)
lv
Prox
Integration
PIHTH(r0x0B), PIHTL(r0x0A)
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To further control when an interrupt occurs, the device provides an interrupt persistence feature. This feature
allows the user to specify a number of conversion cycles for which an event exceeding the proximity interrupt
threshold must persist (PPERS) before actually generating an interrupt. See the register descriptions for details
on the length of the persistence.
CH1
PILTH(r0x09), PILTL(r0x08)
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Figure 10. Programmable Interrupt
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
State Diagram
The following state diagram shows a more detailed flow for the state machine. The device starts in the sleep
mode. The PON bit is written to enable the device. A 2.72-ms Start Delay will occur before entering the start
state. If the PEN bit is set, the state machine will step through the proximity accumulate, then proximity ADC
conversion states. As soon as the conversion is complete, the state machine will move to the Wait Check state.
Start
Delay
PON = 0
Start
2.72 ms
5.44 ms
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1 to 255 LED Pulses
Pulse Frequency: 62.5 kHz
Time: 16.3 ms − 4.2 ms
PEN = 1
Sleep
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PON = 1
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If the WEN bit is set, the state machine will then cycle through the wait state. If the WLONG bit is set, the wait
cycles are extended by 12× over normal operation. When the wait counter terminates, the state machine will
move to the 2.72-ms Wait Delay state before returning to the Start state.
Prox
Check
Wait
Delay
PEN = 0
WEN = 0
Prox
Accum
Wait
Check
WEN = 1
1 to 256 steps
Prox
Step: 2.72 ms
ADC
Time: 2.72 ms − 696 ms
Recommended − 2.72 ms 1023 Counts
Wait
WLONG = 0
1 to 256 steps
Step: 2.72 ms
Time: 2.72 ms − 696 ms
WLONG = 1
1 to 256 steps
Step: 32.6 ms
Time: 32.6 ms − 8.35 s
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Figure 11. Expanded State Diagram
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Power Management
Power consumption can be controlled through the use of the wait state timing because the wait state consumes
only 65 μA of power. Figure 14 shows an example of using the power management feature to achieve an
average power consumption of 138 μA current with four 100-mA pulses of proximity detection.
Prox ADC
65 ms (29 ms LED On Time)
2.72 ms
Example: ~49 ms Cycle TIme
Wait
State
Duration (ms)
Current (mA)
Prox Accum
LED On
Prox ADC
Wait
Wait Delay
0.065 (Note 1)
0.029 (Note 2)
2.72
43.52
5.44
100.0
0.175
0.065
0.175
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43.52 ms
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Prox Accum
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4 IR LED Pulses
Wait
Delay
5.44 ms
Average Current = ((0.029 100) + (2.72 0.175) + (43.52 0.065) + (5.44 0.175)) / 52 = 138 mA
Note 1: Prox Accum = 16.3 ms per pulse 4 pulses = 65 ms = 0.065 ms
Note 2: LED On = 7.2 ms per pulse 4 pulses = 29 ms = 0.029 ms
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Figure 12. Power Consumption Calculations
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
I2C Protocol
Interface and control are accomplished through an I2C serial compatible interface (standard or fast mode) to
a set of registers that provide access to device control functions and output data. The devices support the 7-bit
I2C addressing protocol. Devices TSL26711 and TSL26713 are at slave address 0x39, while the TSL26715 and
TSL26717 devices are at slave address 0x29.
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The I2C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 13).
During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the
first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the
register address from the previous command will be used for data access. Likewise, if the MSB of the command
is not set, the device will write a series of bytes at the address stored in the last valid command with a register
address. The command byte contains either control information or a 5-bit register address. The control
commands can also be used to clear interrupts.
...
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
Continuation of protocol
Master-to-Slave
Slave-to-Master
1
S
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A
N
P
R
S
S
W
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The I2C bus protocol was developed by Philips (now NXP). For a complete description of the I2C protocol, please
review the NXP I2C design specification at http://www.i2c−bus.org/references/.
7
1
Slave Address
W
1
A
8
1
Command Code
8
A
1
Data Byte
A
8
1
1
...
P
I2C Write Protocol
1
S
7
1
Slave Address
R
1
A
8
1
Data
A
Data
A
1
...
P
1
7
1
1
8
1
1
8
1
1
Slave Address
W
A
Command Code
A
S
Data
R
A
8
Data
1
8
A
Data
1
1
A
...
P
I2C Read Protocol — Combined Format
Figure 13. I2C Protocols
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I2C Read Protocol
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Register Set
The device is controlled and monitored by data registers and a command register accessed through the serial
interface. These registers provide for a variety of control functions and can be read to determine results of the
ADC conversions. The register set is summarized in Table 1.
Table 1. Register Address
ADDRESS
RESISTER NAME
R/W
−−
COMMAND
W
REGISTER FUNCTION
0x00
ENABLE
R/W
Enables states and interrupts
0x02
PTIME
R/W
Proximity ADC time
0x03
WTIME
R/W
Wait time
0x08
PILTL
R/W
Proximity interrupt low threshold low byte
0x09
PILTH
R/W
Proximity interrupt low threshold high byte
0x0A
PIHTL
R/W
Proximity interrupt high threshold low byte
RESET VALUE
0x00
al
id
Specifies register address
0x00
0xFF
0xFF
0x00
lv
0x00
0x00
PIHTH
R/W
Proximity interrupt high threshold high byte
PERS
R/W
Interrupt persistence filter
0x00
0x0D
CONFIG
R/W
Configuration
0x00
0x0E
PPCOUNT
R/W
Proximity pulse count
0x00
0x0F
CONTROL
R/W
Control register
0x00
0x12
ID
R
Device ID
0x13
STATUS
R
Device status
0x00
0x18
PDATAL
R
Proximity ADC low data register
0x00
0x19
PDATAH
R
Proximity ADC high data register
0x00
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0x0B
0x0C
0x00
ID
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The mechanics of accessing a specific register depends on the specific protocol used. See the section on I2C
protocols on the previous pages. In general, the COMMAND register is written first to specify the specific
control/status register for following read/write operations.
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Command Register
The command registers specifies the address of the target register for future write and read operations.
Table 2. Command Register
6
COMMAND
COMMAND
FIELD
BITS
COMMAND
7
TYPE
6:5
5
4
3
2
TYPE
1
0
−−
ADD
DESCRIPTION
al
id
7
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
DESCRIPTION
00
Repeated byte protocol transaction
01
Auto-increment protocol transaction
10
Reserved — Do not use
11
Special function — See description below
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FIELD VALUE
Transaction type 00 will repeatedly read the same register with each data access.
Transaction type 01 will provide an auto-increment function to read successive register bytes.
ADD
4:0
Address register/special function register. Depending on the transaction type, see above, this field either
specifies a special function command or selects the specific control-status-register for following write and
read transactions:
FIELD VALUE
DESCRIPTION
00000
Normal — no action
00101
Proximity interrupt clear
Proximity Interrupt Clear clears any pending proximity interrupt. This special function is self clearing.
Enable Register (0x00)
The ENABLE register is used to power the device on/off, enable functions, and interrupts.
Table 3. Enable Register
7
6
BITS
Reserved
7:6
PIEN
5
Reserved
3
PIEN
Resv
Reserved
WEN
2
1
PEN
0
PON
Address
0x00
DESCRIPTION
Reserved. Write as 0.
Proximity interrupt mask. When asserted, permits proximity interrupts to be generated.
ni
FIELD
4
ca
Reserved
ENABLE
5
4
Reserved. Write as 0.
3
Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer. Writing a 0 disables the
wait timer.
PEN
2:1
Proximity enable. These bits activate the proximity function. Writing a 11b enables proximity. Writing a 00b
disables proximity. The Wait Time register should be configured before asserting proximity enable.
PON 1, 2
0
Power ON. This bit activates the internal oscillator to permit the timers and ADC channel to operate. Writing
a 1 activates the oscillator. Writing a 0 disables the oscillator.
Te
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WEN
NOTES: 1. See Power Management section for more information.
2. A minimum interval of 2.72 ms must pass after PON is asserted before proximity can be initiated. This required time is enforced
by the hardware in cases where the firmware does not provide it.
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Proximity Time Control Register (0x02)
The proximity timing register controls the integration time of the proximity ADC in 2.72 ms increments. It is
recommended that this register be programmed to a value of 0xFF (1 integration cycle).
Table 4. Proximity Time Control Register
BITS
7:0
DESCRIPTION
VALUE
INTEG_CYCLES
TIME
0xFF
1
2.72 ms
MAX COUNT
al
id
FIELD
PTIME
1023
Wait Time Register (0x03)
lv
Wait time is set 2.72 ms increments unless the WLONG bit is asserted, in which case the wait times are 12×
longer. WTIME is programmed as a 2’s complement number.
FIELD
BITS
WTIME
7:0
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Table 5. Wait Time Register
DESCRIPTION
REGISTER VALUE
WAIT TIME
TIME (WLONG = 0)
TIME (WLONG = 1)
0xFF
1
2.72 ms
0.032 sec
0xB6
74
201 ms
2.4 sec
0x00
256
696 ms
8.3 sec
NOTE: The Wait Time register should be configured before PEN is asserted.
Proximity Interrupt Threshold Registers (0x08 − 0x0B)
The proximity interrupt threshold registers provide the values to be used as the high and low trigger points for
the comparison function for interrupt generation. If the value generated by proximity channel crosses below the
lower threshold specified, or above the higher threshold, an interrupt is signaled to the host processor.
Table 6. Proximity Interrupt Threshold Registers
0x08
PILTH
0x09
PIHTL
0x0A
PIHTH
0x0B
BITS
DESCRIPTION
7:0
Proximity low threshold lower byte
7:0
Proximity low threshold upper byte
7:0
Proximity high threshold lower byte
7:0
Proximity high threshold upper byte
ca
ADDRESS
PILTL
Te
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ni
REGISTER
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Persistence Register (0x0C)
The persistence register controls the filtering interrupt capabilities of the device. Configurable filtering is
provided to allow interrupts to be generated after each ADC integration cycle or if the ADC integration has
produced a result that is outside of the values specified by threshold register for some specified amount of time.
Table 7. Persistence Register
6
PERS
5
4
3
2
PPERS
FIELD
BITS
PPERS
7:4
Address
0x0C
DESCRIPTION
Proximity interrupt persistence. Controls rate of proximity interrupt to the host processor.
MEANING
0000
−−−
INTERRUPT PERSISTENCE FUNCTION
0001
1
1 proximity value out of range
2
2 consecutive proximity values out of range
lv
FIELD VALUE
Every proximity cycle generates an interrupt
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3:0
0
Reserved
0010
Reserved
1
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7
...
...
...
1111
15
15 consecutive proximity values out of range
Default setting is 0x00.
Configuration Register (0x0D)
The configuration register sets the wait long time.
Table 8. Configuration Register
7
6
CONFIG
5
4
3
2
Reserved
FIELD
BITS
Reserved
7:2
WLONG
1
Reserved
0
1
0
WLONG
Reserved
Address
0x0D
DESCRIPTION
Reserved. Write as 0.
Wait Long. When asserted, the wait cycles are increased by a factor 12× from that programmed in the
WTIME register.
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Reserved. Write as 0.
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Proximity Pulse Count Register (0x0E)
The proximity pulse count register sets the number of proximity pulses that will be transmitted. PPULSE defines
the number of pulses to be transmitted at a 62.5-kHz rate.
While the value can be programmed up to 255 pulses, the practical limit of the device is 32 pulses. It is
recommended that 32 or fewer pulses be used to achieve maximum signal-to-noise ratio.
7
6
5
4
PPULSE
3
2
1
0
Address
0x0E
PPULSE
FIELD
BITS
PPULSE
7:0
al
id
Table 9. Proximity Pulse Count Register
DESCRIPTION
lv
Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
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Control Register (0x0F)
The Control register provides four bits of control to the analog block. These bits control the diode drive current
and diode selection functions.
Table 10. Control Register
7
6
CONTROL
PDRIVE
FIELD
BITS
PDRIVE
7:6
5
4
3
2
ResvPDIODE
5:4
0
Address
0x0F
Reserved
DESCRIPTION
LED Drive Strength.
FIELD VALUE
PDIODE
1
LED STRENGTH
00
100 mA
01
50 mA
10
25 mA
11
12.5 mA
Proximity Diode Select.
DIODE SELECTION
ca
FIELD VALUE
01
Proximity uses the Channel 0 diode
10
Proximity uses the Channel 1 diode
11
Proximity uses both diodes
ni
Reserved
3:0
Reserved. Write bits as 0.
Te
ch
Reserved
00
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
ID Register (0x12)
The ID Register provides the value for the part number. The ID register is a read-only register.
Table 11. ID Register
7
6
5
4
ID
3
2
1
0
Address
0x12
FIELD
BITS
ID
7:0
al
id
ID
DESCRIPTION
0x00 = TSL26711 and TSL26715
Part number identification
lv
0x09 = TSL26713 and TSL26717
Status Register (0x13)
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The Status Register provides the internal status of the device. This register is read only.
Table 12. Status Register
7
STATUS
6
5
Reserved
FIELD
BIT
Reserved
7:6
PINT
5
Reserved
4:0
4
3
PINT
Resv
2
1
Reserved
0
Address
0x13
DESCRIPTION
Reserved.
Proximity Interrupt. Indicates that the device is asserting a proximity interrupt.
Reserved.
Proximity Data Registers (0x18 − 0x19h)
ca
Proximity data is stored as a 16-bit value. To ensure the data is read correctly, a two-byte I2C read transaction
should be utilized with auto increment protocol bits set in the command register. With this operation, when the
lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a subsequent
read to the upper byte. The upper register will read the correct value even if the next ADC cycle ends between
the reading of the lower and upper registers.
Table 13. Proximity Data Registers
ADDRESS
BITS
PDATAL
0x18
7:0
Proximity data low byte
PDATAH
0x19
7:0
Proximity data high byte
DESCRIPTION
Te
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ni
REGISTER
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
APPLICATION INFORMATION: HARDWARE
LED Driver Pin with Proximity Detection
al
id
The application hardware circuit with proximity detection requires an LED connected as shown in Figure 14.
Vbat may be an independent power source. The 1-μF decoupling capacitors should be of the low-ESR type and
be placed as close as possible to the load and VDD to reduce noise. To maximize system performance, the use
of PCB power and ground planes are recommended. If mounted on a flexible circuit, the power and ground
traces back to the PCB should be sufficiently wide enough to have a low resistance, such as < 1Ω.
VBUS
VDD(digital)
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VDD(analog)
lv
The I2C bus protocol was developed by Philips (now NXP). The pull-up resistor value (RP) is a function of the
I2C bus speed, the supply voltage, and the capacitive bus loading. Users should consult the NXP I2C design
specification (http://www.i2c−bus.org/references/) for assistance. With a lightly loaded bus running at 400 kbps
and VDD = 3 V, 1.5-kΩ resistors have been found to be viable.
LED
1 mF
RP
RP
1 mF
TSL2671
RPI
LDR
INT
SCL
SDA
Figure 14. Application Hardware Circuit for Proximity Sensing with Internal LED Driver
Te
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The power supply connection — PCB routing and supply decoupling — has a significant effect on proximity
performance. Contact TAOS or see the application notes available at www.TAOSinc.com for power supply
guidance.
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
APPLICATION INFORMATION: HARDWARE
If the hardware application requires more than 100 mA of current to drive the LED, then an external transistor
should be used. Note, R2 should be sized adequately to bias the gate voltage given the LDR current mode
setting. See Figure 15.
VDD(analog)
VDD(digital)
al
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VBUS
R2
1 mF
RP
RPI
R1
TSL2671
LDR
lv
RP
1 mF
LED
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INT
SCL
SDA
Figure 15. Application Hardware Circuit for Proximity Sensing with External LED Driver Using P-FET
Transistor
PCB Pad Layout
Suggested PCB pad layout guidelines for the Dual Flat No-Lead (FN) surface mount package are shown in
Figure 16.
Note: Pads can be
extended further if hand
soldering is needed.
2500
1000
1000
400
ca
650
1700
ch
ni
650
400
Te
NOTES: A. All linear dimensions are in micrometers.
B. This drawing is subject to change without notice.
The LUMENOLOGY r Company
Figure 16. Suggested FN Package PCB Layout
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
MECHANICAL DATA
PACKAGE FN
Dual Flat No-Lead
TOP VIEW
Pin 1 Marker
PIN OUT
TOP VIEW
PIN 1
2000
75
END VIEW
SCL 2
5 INT
GND 3
4 LDR
lv
al
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6 SDA
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2000 75
VDD 1
Photo-Active Area
SIDE VIEW
650 50
Seating Plane
203 8
650
300
50
BOTTOM VIEW
ni
300 50
Pb
750 150
ch
PIN 1
ca
650
Lead Free
Te
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
B. The photodiode active area is 466 μm square and its center is 140 μm above and 20 μm to the right of the package center. The die
placement tolerance is ± 75 μm in any direction.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 17. Package FN — Dual Flat No-Lead Packaging Configuration
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
MECHANICAL DATA
TOP VIEW
2.00 0.05
1.75
1.50
4.00
al
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4.00
B
+ 0.30
8.00
− 0.10
1.00
0.25
B
A
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A
lv
3.50 0.05
DETAIL B
DETAIL A
5 Max
5 Max
0.254
0.02
2.18 0.05
Ao
2.18 0.05
0.83 0.05
Bo
ni
ca
Ko
All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
Each reel is 178 millimeters in diameter and contains 3500 parts.
TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
This drawing is subject to change without notice.
Te
ch
NOTES: A.
B.
C.
D.
E.
F.
G.
The LUMENOLOGY r Company
Figure 18. Package FN Carrier Tape
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TAOS118 − JANUARY 2011
MANUFACTURING INFORMATION
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The process, equipment, and materials used in these test are detailed below.
Table 14. Solder Reflow Profile
PARAMETER
REFERENCE
DEVICE
Average temperature gradient in preheating
2 to 3 minutes
Time above 217°C (T1)
t1
Max 60 sec
Time above 230°C (T2)
t2
Max 50 sec
Time above Tpeak −10°C (T3)
t3
Max 10 sec
lv
tsoak
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Soak time
2.5°C/sec
Peak temperature in reflow
Tpeak
260°C
Temperature gradient in cooling
Tpeak
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The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Max −5°C/sec
Not to scale — for reference only
T3
T2
ca
Temperature (C)
T1
Time (sec)
ni
t3
t2
t1
Figure 19. Solder Reflow Profile Graph
Te
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tsoak
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
MANUFACTURING INFORMATION
Moisture Sensitivity
al
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Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package. To ensure the package contains
the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping.
Devices are packed in a sealed aluminized envelope called a moisture barrier bag with silica gel to protect them
from ambient moisture during shipping, handling, and storage before use.
The Moisture Barrier Bags should be stored under the following conditions:
< 40°C
< 90%
No longer than 12 months from the date code on the aluminized envelope if
unopened.
lv
Temperature Range
Relative Humidity
Total Time
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Rebaking of the reel will be required if the devices have been stored unopened for more than 12 months and
the Humidity Indicator Card shows the parts to be out of the allowable moisture region.
Opened reels should be used within 168 hours if exposed to the following conditions:
Temperature Range
Relative Humidity
< 30°C
< 60%
If rebaking is required, it should be done at 50°C for 12 hours.
Te
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The FN package has been assigned a moisture sensitivity level of MSL 3.
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
PRODUCTION DATA — information in this document is current at publication date. Products conform to
specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard
warranty. Production processing does not necessarily include testing of all parameters.
LEAD-FREE (Pb-FREE) and GREEN STATEMENT
al
id
Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current
RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous
materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified
lead-free processes.
Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and
Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
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Important Information and Disclaimer The information provided in this statement represents TAOS’ knowledge and
belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties,
and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate
information from third parties. TAOS has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and
chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thus CAS numbers and other
limited information may not be available for release.
NOTICE
Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this
document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised
to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems.
TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product
design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that
the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular
purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages.
ca
TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR
USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY
RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY
UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK.
Te
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ni
LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced
Optoelectronic Solutions Incorporated.
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