Dual N-channel MOSFET ELM14822AA-N ■General description ■Features ELM14822AA-N uses advanced trench technology to provide excellent Rds(on) and low gate charge. • • • • Vds=30V Id=8.5A (Vgs=10V) Rds(on) < 16mΩ (Vgs=10V) Rds(on) < 26mΩ (Vgs=4.5V) ■Maximum absolute ratings Parameter Ta=25°C. Unless otherwise noted. Limit Unit Note Symbol Drain-source voltage Gate-source voltage Vds Vgs Ta=25°C Continuous drain current Id Ta=70°C Pulsed drain current Tc=25°C Tc=70°C Power dissipation 30 ±20 8.5 Junction and storage temperature range V V 6.6 A 1 2 Idm 30 A Pd 2.00 1.28 W Tj, Tstg -55 to 150 °C ■Thermal characteristics Parameter Maximum junction-to-ambient Symbol t≤10s Maximum junction-to-ambient Maximum junction-to-lead Steady-state Steady-state Rθja Rθjl ■Pin configuration Typ. 48.0 Max. 62.5 Unit °C/W 74.0 35.0 110.0 40.0 °C/W °C/W Note 1 3 ■Circuit SOP-8(TOP VIEW) 1 8 2 7 3 6 4 5 Pin No. Pin name 1 2 SOURCE2 GATE2 3 4 5 SOURCE1 GATE1 DRAIN1 6 7 8 DRAIN1 DRAIN2 DRAIN2 4-1 D2 D1 G2 G1 S1 S2 Dual N-channel MOSFET ELM14822AA-N ■Electrical characteristics Parameter STATIC PARAMETERS Drain-source breakdown voltage Zero gate voltage drain current Symbol Ta=25°C. Unless otherwise noted. Min. Typ. Max. Unit Condition BVdss Id=250μA, Vgs=0V Idss 30 1 Vds=24V, Vgs=0V Ta=55°C 5 Gate-body leakage current Gate threshold voltage Igss Vds=0V, Vgs=±20V Vgs(th) Vds=Vgs, Id=250μA 1.0 On state drain current Id(on) Vgs=10V, Vds=5V 30 Static drain-source on-resistance Rds(on) Forward transconductance Diode forward voltage Max. body-diode continuous current DYNAMIC PARAMETERS Gfs Vsd Is Input capacitance Output capacitance Ciss Coss Reverse transfer capacitance Gate resistance SWITCHING PARAMETERS Total gate charge (10V) Crss Rg Total gate charge (4.5V) Qg Qgs Qgd Gate-source charge Gate-drain charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Body diode reverse recovery time Body diode reverse recovery charge V 1.8 100 3.0 μA nA V A Vgs=4.5V, Id=6A 13.4 20.0 21.0 Vds=5V, Id=8.5A Is=1A, Vgs=0V 23 0.76 Vgs=0V, Vds=15V, f=1MHz 1040 180 Vgs=0V, Vds=0V, f=1MHz 110 0.70 0.85 pF Ω 19.20 23.00 nC 9.36 2.60 4.20 11.20 nC nC nC 5.2 4.4 17.3 7.5 6.5 25.0 ns ns ns 5.0 21.0 ns ns 10.0 nC Vgs=10V, Id=8.5A Ta=125°C Qg Vgs=10V, Vds=15V, Id=8.5A td(on) tr Vgs=10V, Vds=15V td(off) RL=1.8Ω, Rgen=3Ω tf trr If=8.5A, dIf/dt=100A/μs 3.3 16.7 Qrr If=8.5A, dIf/dt=100A/μs 6.7 16.0 25.0 26.0 1.00 3 1250 mΩ S V A pF pF NOTE : 1. The value of Rθja is measured with the device mounted on 1in² FR-4 board of 2oz. Copper, in still air environment with Ta=25°C. The value in any given applications depends on the user’s specific board design, The current rating is based on the t ≤ 10s themal resistance rating. 2. Repetitive rating, pulse width limited by junction temperature. 3. The Rθja is the sum of the thermal impedance from junction to lead Rθjl and lead to ambient. 4. The static characteristics in Figures 1 to 6 are obtained using 80μs pulses, duty cycle 0.5%max. 5. These tests are performed with the device mounted on 1in² FR-4 board with 2oz. Copper, in a still air environment with Ta=25°C. The SOA curve provides a single pulse rating. 4-2 Dual N-channel MOSFET ELM14822AA-N ■Typical electrical and thermal characteristics 30 20 4V 10V 25 3.5V Id (A) 20 Id (A) Vds=5V 16 4.5V 15 10 12 125°C 8 13.4 Vgs=3V 4 5 0 22 0 0 1 2 3 4 5 1.5 2 Vds (Volts) Fig 1: On-Region Characteristics 26 0.76 3 2.5 16 3.5 4 Vgs (Volts) Figure 2: Transfer Characteristics 26 1.6 24 Vgs=4.5V 22 Normalized On-Resistance Rds(on) (m� ) 25°C 20 18 16 Vgs=10V 14 12 Vgs=10V Id=8.5A 1.4 Vgs=4.5V 1.2 1 10 0 5 10 15 0.8 20 0 Id (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage 25 50 75 100 125 150 175 Temperature (°C) Figure 4: On-Resistance vs. Junction Temperature 50 1.0E+01 1.0E+00 Id=8.5A 1.0E-01 30 Is (A) Rds(on) (m� ) 40 125°C 125°C 1.0E-02 25°C 1.0E-03 20 1.0E-04 25°C 1.0E-05 10 2 4 6 8 0.0 10 0.2 0.4 0.6 0.8 Vsd (Volts) Figure 6: Body-Diode Characteristics Vgs (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage 4-3 1.0 Dual N-channel MOSFET ELM14822AA-N 10 1250 Capacitance (pF) 8 Vgs (Volts) 1500 Vds=15V Id=8.5A 6 4 2 Ciss 1000 750 500 Coss 0 0 16 22 26 4 8 12 16 Crss 0 20 0 5 15 20 25 0.76 Vds (Volts) Figure 8: Capacitance Characteristics Qg (nC) Figure 7: Gate-Charge Characteristics 100.0 100�s 1ms 10.0 10�s 0.1s 1s Tj(max)=150°C Ta=25°C DC 1 0.1 10 D=T on/T Tj,pk=T a+Pdm.Z�ja.R�ja R�ja=62.5°C/W 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note 5) Figure 9: Maximum Forward Biased Safe Operating Area (Note 5) Z�ja Normalized Transient Thermal Resistance 20 0 0.001 100 Vds (Volts) 10 30 10 10s 0.1 30 Tj(max)=150°C Ta=25°C 40 10ms 1.0 10 50 Rds(on) limited Power (W) Id (Amps) 13.4 250 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 1 Pd 0.1 Ton Single Pulse 0.01 0.00001 0.0001 0.001 0.01 0.1 1 T 10 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance 4-4 100 1000