The following document contains information on Cypress products. Although the document is marked with the name “Spansion”, the company that originally developed the specification, Cypress will continue to offer these products to new and existing customers. Continuity of Specifications There is no change to this document as a result of offering the device as a Cypress product. Any changes that have been made are the result of normal document improvements and are noted in the document history page, where supported. Future revisions will occur when appropriate, and changes will be noted in a document history page. Continuity of Ordering Part Numbers Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed in this document. For More Information Please contact your local sales office for additional information about Cypress products and solutions. About Cypress Cypress (NASDAQ: CY) delivers high-performance, high-quality solutions at the heart of today’s most advanced embedded systems, from automotive, industrial and networking platforms to highly interactive consumer and mobile devices. With a broad, differentiated product portfolio that includes ® NOR flash memories, F-RAM™ and SRAM, Traveo™ microcontrollers, the industry’s only PSoC ® programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense ® capacitive touch-sensing controllers, and Wireless BLE Bluetooth Low-Energy and USB connectivity solutions, Cypress is committed to providing its customers worldwide with consistent innovation, bestin-class support and exceptional system value. MB9D560 Series 32-bit Microcontroller Spansion® TraveoTM Family MB9DF564MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE MB9DF565MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE MB9DF566MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE Data Sheet (Full Production) Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur. Publication Number MB9D560_DS708-00001 CONFIDENTIAL Revision 3.0 Issue Date May 15, 2015 D a t a S h e e t Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: “This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.” Combination Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page. Full Production (No Designation on Document) When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local sales office. 2 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 MB9D560 Series 32-bit Microcontroller Spansion® TraveoTM Family MB9DF564MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE MB9DF565MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE MB9DF566MAE/MGE/MLE/MQE/LAE/LGE/LLE/LQE Data Sheet (Full Production) 1. Description MB9D560 series has SPANSION 32-bit microcontrollers for automobile motor control. They use the ® ARM Cortex-R5 MPCore TM CPU that is compatible with the ARM family. Notes: − − ARM, Cortex, Thumb are the registered trademarks of ARM Limited in the EU and other countries. MPCore, CoreSight are the trademarks of ARM Limited in the EU and other countries. Publication Number MB9D560_DS708-00001 Revision 3.0 Issue Date May 15, 2015 This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur. CONFIDENTIAL D a t a S h e e t Table of Contents 1. 2. 3. 4. 5. 6. 7. Description ............................................................................................................................................... 3 Features .................................................................................................................................................... 5 Product Lineup ...................................................................................................................................... 11 Pin Assignment...................................................................................................................................... 12 Pin Description ...................................................................................................................................... 16 I/O Circuit Type ...................................................................................................................................... 34 Handling Precautions ............................................................................................................................ 37 7.1 Precautions for Product Design .................................................................................................... 37 7.2 Precautions for Package Mounting ............................................................................................... 38 7.3 Precautions for Use Environment ................................................................................................. 40 8. Handling Devices ................................................................................................................................... 41 9. Block Diagram........................................................................................................................................ 44 10. Memory Map ........................................................................................................................................... 46 11. I/O Map.................................................................................................................................................... 49 12. Pin Statuses in CPU Status................................................................................................................... 54 13. Electrical Characteristics ...................................................................................................................... 56 13.1 Absolute Maximum Ratings .......................................................................................................... 56 13.2 Recommended Operating Conditions........................................................................................... 58 13.3 DC Characteristics........................................................................................................................ 60 13.4 AC Characteristics ........................................................................................................................ 69 13.5 A/D Converter ............................................................................................................................... 96 13.6 4 Channels Same Time Sampling A/D Converter......................................................................... 97 13.7 Flash Memory ............................................................................................................................. 100 13.8 R/D Converter............................................................................................................................. 101 14. Ordering Information ........................................................................................................................... 102 15. Part Number Option............................................................................................................................. 102 16. Package Dimensions ........................................................................................................................... 103 17. Major Changes ..................................................................................................................................... 105 4 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 2. Features Function Technology Description − CMOS 90nm technology − ARM Cortex®-R5F − 32-bit ARM architecture − 2-instruction issuance super scalar − 8-stage pipeline − ARMv7 / Thumb®-2 instruction set − Floating-Point Unit (FPU) Double precision − Memory protection Unit (MPU) − ECC support for the TCM port 16 area 1-bit error correction, 2-bit error detection ECC (SEC-DED) − TCM port 2 TCM ports CPU − ATCM port − BTCM 2 ports (B0TCM, B1TCM) − VIC port Low latency interrupt − AXI master interface 64-bit AXI interface (instruction / data access) 32-bit AXI interface (I/O access) − AXI slave interface 64-bit AXI interface (accessible to TCM port) − CPU configuration − Operating frequency 2 CPUs (AMP operation) Maximum 200 MHz − Trace with ETM-R5 − ARM CoreSightTM Technology − Debugging interface Each CPU embedded Embedded Trace Macro (ETM), trace support of CPU operation JTAG (5 pin ) Debugging Support clock : maximum 20 MHz − Debugging security support 128-bit security key (Device security key) − Wakeup function on JTAG − User mode Operation mode Normal mode (internal memory activation) − Serial writer mode − Internal clock source Fast-CR oscillation (8 MHz) Slow-CR oscillation (100 kHz) − Clock control External oscillation input Main clock input − Embedded PLL − Oscillator stabilized timer Main PLL (Multiplying clock of main oscillation ) Support oscillator stabilized timer for all clock source independently After a lapse of oscillator stabilized time, it is able to use source clock timer (Except PLL for FlexRay/RDC) May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 5 D a t a S h e e t Function Description − Reset level Hardware reset (system initialization) Software reset (programing initialization) − Reset factor (Hardware reset ) Power-on reset (PONR), external reset input (RSTX, NMIX+RSTX), clock stop waiting with time-out reset, Reset control low-voltage detection reset (internal low-voltage detection reset, 5V external low-voltage detection reset ), watchdog reset (hardware watchdog reset, software watchdog reset ), clock supervisor reset (main clock monitor, PLL clock monitor), software trigger hardware reset , profile error reset − Reset factor (software reset ) − Device state Software reset RUN (Run State, CPU is operation status) PSS (Power Saving State, CPU wait event from WFI) Low power consumption control − Setting parameter of each devise state Clock (clock source enable, clock source selection, clock divider, clock domain enable) Clock monitor Low-voltage detection − Memory protection as master except processor − Target master Memory protection unit (MPU) Timing protection unit (TPU) DMA controller − 8 area − NMI generation when violation detection − TPU 1 unit as CPU 1 unit − 24-bit timer x 8 channels per unit − Support execution time protection, locking time protection, inter-arrival time protection, deadline protection − Support normal mode and over flow mode − Prescaler of each channels Timer clock divider (1/1 to 1/64) − Independent prescaler of each channels Timer clock divider (1/1, 1/2, 1/4, 1/16) − Monitor target clock − Monitor method Main oscillation input , main PLL output Clock supervisor (CSV) Monitor of frequency range − Operation after error detection Reset or NMI − Watchdog timer embedded Hardware watchdog timer Software watchdog timer − Hardware watchdog timer 1 unit per system 32-bit watchdog timer with window function Clock source: fast-CR or slow-CR Watchdog timer (WDT) Set by boot program (BootROM maker) Not set by user program − Software watchdog timer 1 unit per CPU 32-bit watchdog timer with window function Clock source: fast-CR, slow-CR, main clock One time set on user program (not set again) 6 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Function Description − Select voltage monitor External low-voltage detection (5V power line monitor): 3.9V, 4.1V, 4.3V Internal low-voltage detection (1.2V power line monitor): 0.9V Low-voltage detection (LVD) − Internal low-voltage detection: always valid − External low-voltage detection: valid/invalid set − External low-voltage detection: set threshold voltage independently on RUN / PSS − Output when low-voltage detection External low-voltage detection: reset or NMI Internal low-voltage detection: reset − Cortex-R5F ATCM connection 1 Main Flash memory as CPU 1 unit Main Flash memory (TCFLASH) − HPM connection with 64-bit AXI − Flash memory configuration Interleave with 64-bit Flash 2 units − 2 address areas TCM (read only) AXI (read / write) − Work Flash memory (WorkFLASH) Parallel programming support − Flash security − 2 Work Flash memories − ECC support (SEC-DED) − Parallel programming support − Flash security − BTCM connection of Cortex-R5F 1 Work Flash memory as CPU 1 unit 1 main SRAM as CPU 1 unit Main SRAM (TCRAM) BootROM ECC support (SEC-DED) − Interleave with 2 ports of B0TCM and B1TCM − ECC support (SEC-DED) − Size: 16K byte − Boot operation support − Serial writer program support − 16 channels − Transfer mode Block transfer, Burst transfer DMA controller (DMAC) − Addressing mode Fixed, increment − Priority between channels Fixed, Dynamic, Round robin − Support normal interrupt (IRQ) and non-maskable interrupt (NMI) − Normal interrupt (IRQ) Use Interrupt Request (IRQ) of Cortex-R5F 512 channels 32 level for priority Interrupt control (IRC) − Support low latency interrupt response from VIC port of Cortex-R5F − Non-maskable interrupt (NMI) Use fast interrupt request (FIQ) of Cortex-R5F 32 channels 16 level for priority − May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL Support software interrupt generation 7 D a t a S h e e t Function Description − Input Normal interrupt (IRQ): 8 input External interrupt (EXT-IRQ) Non-maskable interrupt (NMI): 1 input − Detection method H level , L level , rise edge, fall edge, both edge Inter-processor communications unit − (IPCU) Exclusion access memory (EAM) Bit-band unit (BBU) CRC Mailbox function Data communication for CPU core communication by 8 Mailbox Support of interrupt between CPU core − Small size memory to support exclusion control on exclusion access instruction − Use for semaphore − Size: 48 byte − The bit operation of specified register bit on Bit band area, it is mapping 1 bit of bit band area to support bit − Output to register of CRC code according real time writing to input register − 16-bit timer band alias area for 1 byte. The target of bit band access is specified register bit on I/O area Base timer Any of four PWM/PPG/reload/PWC timer functions can be selected and used. A 32-bit timer can be used in 2 channels of cascade mode as reload/PWC timer. 16-bit free-run timer (FRT) − 16 bit up/down counter (2 channels for motor control only) 32-bit free-run timer − 32 bit up/down counter − Input capture 16-bit capture register that detects rise edge, Fall edge, both edge 16-bit input capture (ICU) Generate interrupt request after latch of counter number of 16 bit Free-run timer with edge detection of pin input − Input capture 32-bit capture register that detects rise edge, fall edge, both edge Generate interrupt request after latch of counter number of 32 bit Free-run timer with edge detection of pin input 32-bit input capture − LIN sync break/sync field relation is following. Input capture ch.0 → Multi-function serial interface ch.0 Input capture ch.1 → Multi-function serial interface ch.1 Input capture ch.2 → Multi-function serial interface ch.2 Input capture ch.3 → Multi-function serial interface ch.3 Input capture ch.4 → Multi-function serial interface ch.4 16-bit output compare (OCU) 8 CONFIDENTIAL − Output interrupt signal when compare with 16-bit free-run timer MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Function Description − Generate variable output Real time output 16-bit PPG waveform output PPG uses 16-bit PPG timer of base timer The relation is following WFG(ch.0 to ch.5) Base timer ch.0 → PPG0 Base timer ch.2 → PPG2 Base timer ch.4 → PPG4 Waveform generator (WFG) WFG(ch.6 to ch.11) Base timer ch.6 → PPG6 Base timer ch.8 → PPG8 Base timer ch.10 → PPG10 Non overlap three-phase waveform output (inverter control) DC chopper waveform output A/D converter (ADC) 4ch sample-hold A/D converter − Dead time timer function − GATE function − DTTI function − 12-bit resolution A/D converter: 1 unit (32 channels) − Sampling analog value from input port of 32 channels − Conversion time: 1 µs − External trigger activation (ADTG) − Activation from internal timer (base timer) − 12 bit resolution A/D converter: 2 units (8 channels ) − UART / CSIO / LIN interface (v2.1) communication available by selecting the function − Transmission FIFO: 64 Byte, reception FIFO: 64 Byte − Reception interrupt factor (3 types) Reception error detection (parity, over run, frame error) Reception to FIFO for data of setting value Multi-function serial interface (MFS) Reception data under setting value in FIFO, idle term detection of over 8 clocks with baud rate clock − Transmission interrupt factor (2 types) No transmission operation Transmission FIFO empty (contain transmission operation) Up/Down counter (UDC) CAN interface FlexRay controller − SPI (serial peripheral interface) support − LIN protocol revision 2.1 support − 8/16-bit up/down counter (2 channels uses for R/D converter) − The CAN is based on the CAN protocol ver. 2.0A/B − 64 message buffers x 3 channels − An identification mask is applied to each message object − Up to 1Mbps support − Clock support CAN prescaler − CAN wakeup functions − Supports FlexRay protocol specification v2.1 − Maximum 128 message buffers − 8K Byte message RAM − Variable length of message buffers − Each message buffer can be allocated as a part of reception buffer, transmission buffer or reception FIFO − Host access to the message buffer via input and output buffers − Filtering for slot counter, cycle counter and channels − Maskable interrupts are supported R/D converter (RDC) − Connect to resolver interface D/A converter (DAC) − 10-bit resolution May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 9 D a t a S h e e t Function Description − Motor vector operation accelerator (MVA) Assist for three-phase current normalizing, three-phase to two-phase DC conversion / two-phase to threephase AC conversion, angler calculation, PID control calculation. − Error detection in processing (overflow/under flow/non normalizing error of FLOP) − Amplitude diagnosis /angle diagnosis function of R/D converter − Error current diagnosis function − Key code supports A part of General-purpose I/O (GPIO) register Key code Port pin configuration (PPC) register Analog input control register (ADER) 4ch ADC analog input control register (ADER4CH_1, ADER4CH_0) Analog output control register (DAC00_DAER, DAC01_DAER) 10 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 3. Product Lineup Memory Size Parameter FLASH size (program) MB9DF564 MB9DF565 MB9DF566 (512KB+128KB)2 (768KB+128KB)2 (1024KB+128KB)2 FLASH size (Work) 64KB2 64KB2 64KB2 RAM size 64KB2 96KB2 128KB2 Functions Pin number System clock 208 pin 176 pin On-chip PLL clock multiplication system Minimum instruction execution time :5 ns (200 MHz) CR oscillator (fast/slow) Yes DMAC Base timer 16 channels 12 channels (0 to 11) 6 channels (0 to 3, 6, 7) 32-bit free-run timer 5 channels 32-bit input capture 3 units (6 channels) 16-bit free-run timer 20 channels*1 16-bit input capture 16-bit output compare Waveform generator External interrupt 8 units (0 to 7) 7 units (0 to 6) (15 channels (0 to 14)) (13 channels (0 to 12)) 12 units (0 to 11) 9 units (0 to 5, 9 to 11) (24 channels (0 to 23)) (18 channels (0 to 11, 18 to 23)) 4 units (0 to 3) 3 units (0, 1, 3) (24 channels (0 to 23)) (18 channels (0 to 11, 18 to 23)) 8 channels (0 to 7) 6 channels (0 to 4, 7) A/D converter 1 unit (32 channels) 4ch sample-hold A/D converter 2 units (8 channels) R/D converter 2 units*2 D/A converter 2 channels*2 Up/Down counter 4 channels Motor vector operation accelerator Multi-function serial interface 2 units 5 channels (0 to 4) CAN FlexRay 3 channels (0, 1, 4) 3 channels 128 msb x 1 unit (ch.A / ch.B)*2 Inter-processor communications unit Yes Exclusive access memory Yes Software watchdog timer Yes Hardware watchdog timer Yes CRC 2 channels Internal power supply low-voltage Yes detection External power supply low-voltage Yes detection Yes*2 Key code Package Debugging interface LER208 LEP176 JTAG interface *1: 2 channels for motor control *2: The function is different according to the part number. See "15. Part Number Option". May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 11 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 4AN0 4AN1 4AN2 4AN3 ZIN0 BIN0 AIN0 ZIN1 BIN1 AIN1 FRCK12 FRCK13 FRCK14 FRCK15 RDC_W0 RDC_V0 RDC_U0 RDC_Z0 RDC_B0 RDC_A0 P026 ERDS0 DTTI2 RTO12 RTO13 RTO14 VSS VCC12 P305 P306 P000 P001 P002 P003 P004 P005 P006 VCC5 VSS P007 P008 P009 P010 AVRH0 AVRL0 AVR0 AVSS0 AVCC0 P011 P012 P013 P014 P015 P016 AREF2 0 SIN_IN0 COS_IN0 SIN_OUT0 SIN_MINUS0 SIN_PLUS0 COS_PLUS0 COS_MINUS0 COS_OUT0 RVRH0 RVRL0 RVR0 RVSS0 RVCC0 RDC_ACT0 MAG_MINUS0 MAG_PLUS0 MAG_OUT0 P430 P030 P031 P309 P310 VCC5 12 CONFIDENTIAL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 IN16 IN17 IN18 IN19 IN20 IN21 V SS V CC1 2 P3 1 1 P3 1 2 P3 1 3 P3 1 4 P3 1 5 P3 1 6 P3 1 7 P3 1 8 P3 1 9 P3 2 0 P3 2 1 P3 2 2 P3 2 3 V CC1 2 V SS IN6 STOPWT P3 2 4 IN7 RXDA P3 2 5 IN8 TXDA P3 2 6 IN9 TXE NA P3 2 7 IN10 RXDB P3 2 8 IN11 TXDB P3 2 9 IN12 TXE NB P3 3 0 NMIX RSTX MD1 MD0 X0 X1 V SS TRSTX TCK TDO TDI TMS n SRST INT4 SIN1 P4 0 6 SOT1 P4 0 7 SCK1 P4 0 8 INT0 RX0 P4 0 9 TX0 P4 1 0 INT1 RX1 P4 1 1 TX1 P4 1 2 INT2 RX2 P4 1 3 TX2 P4 1 4 TIOA 4 P4 1 5 TIOB4 P4 1 6 TIOA 5 P4 1 7 TIOB5 P4 1 8 V CC1 2 V SS RTO1 5 RTO1 6 RTO1 7 DTTI3 RTO1 8 RTO1 9 RTO2 0 RTO2 1 RTO2 2 RTO2 3 INT3 SIN0 SOT0 SCK0 4ADTG0 FRCK0 FRCK1 DTTI0 RTO0 RTO1 RTO2 RTO3 RTO4 RTO5 TIOA 0 TIOB0 TIOA 1 TIOB1 TIOA 2 TIOB2 TIOA 3 TIOB3 FRCK1 6 FRCK1 7 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 V CC5 P3 0 4 P3 0 3 P3 0 2 P3 0 1 P3 0 0 P2 3 1 P2 3 0 P2 2 9 P2 2 8 P2 2 7 P2 2 6 P2 2 5 P2 2 4 V SS V CC1 2 P2 2 3 P2 2 2 P2 2 1 P2 2 0 P2 1 9 P2 1 8 P2 1 7 P2 1 6 A V RH2 A V RL2 A V SS2 A V CC2 P2 1 5 P2 1 4 P2 1 3 P2 1 2 P2 1 1 P2 1 0 P2 0 9 P2 0 8 V CC1 2 V SS P2 0 7 P2 0 6 P2 0 5 P2 0 4 P2 0 3 P2 0 2 P2 0 1 P2 0 0 P4 2 9 P4 2 8 P4 2 7 P4 2 6 P4 2 5 V CC5 A N7 A N6 A N5 A N4 A N3 A N2 A N1 A N0 MONCLK TIOB9 TIOA 9 TIOB8 TIOA 8 A N1 5 A N1 4 A N1 3 A N1 2 A N1 1 A N1 0 A N9 A N8 A N2 3 A N2 2 A N2 1 A N2 0 A N1 9 A N1 8 A N1 7 A N1 6 TIOB11 TIOA 11 TIOB10 TIOA 10 A DTG0 A N3 1 A N3 0 A N2 9 A N2 8 A N2 7 A N2 6 A N2 5 A N2 4 MM TIOB7 TIOA 7 TIOB6 TIOA 6 SCS4 3 SCS4 2 SCS4 1 SCS4 0 SCK4 SOT4 SIN4 FRCK7 FRCK6 FRCK5 FRCK4 IN5 IN4 IN3 IN2 IN1 IN0 INT7 D a t a S h e e t 4. Pin Assignment 208 Pin Part Number with RDC TOP VIEW LER208 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 VSS VCC12 P423 P422 P421 P100 P101 P102 P103 P104 P105 P106 VCC5 VSS P107 P108 P109 P110 AVRH1 AVRL1 AVR1 AVSS1 AVCC1 P111 P112 P113 P114 P115 P116 AREF2 1 SIN_IN1 COS_IN1 SIN_OUT1 SIN_MINUS1 SIN_PLUS1 COS_PLUS1 COS_MINUS1 COS_OUT1 RVRH1 RVRL1 RVR1 RVSS1 RVCC1 RDC_ACT1 MAG_MINUS1 MAG_PLUS1 MAG_OUT1 P431 P131 P420 P419 VCC5 SCK3 SOT3 SIN3 DTTI1 RTO6 RTO7 RTO8 RTO9 RTO10 RTO11 FRCK10 IN14 FRCK9 IN13 INT6 FRCK8 4ADTG1 4AN4 4AN5 4AN6 4AN7 RDC_W1 ZIN2 RDC_V1 BIN2 RDC_U1 AIN2 RDC_Z1 ZIN3 RDC_B1 BIN3 RDC_A1 AIN3 P126 ERDS1 SCK2 SOT2 SIN2 INT5 MB9D560_DS708-00001-3v0-E, May 15, 2015 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 4AN0 4AN1 4AN2 4AN3 ZIN0 BIN0 AIN0 ZIN1 BIN1 AIN1 FRCK12 FRCK13 FRCK14 FRCK15 DAOUT0 ERDS0 DTTI2 RTO12 RTO13 RTO14 CONFIDENTIAL VSS VCC12 P305 P306 P000 P001 P002 P003 P004 P005 P006 VCC5 VSS P007 P008 P009 P010 AVRH0 AVRL0 AVR0 AVSS0 AVCC0 P011 P012 P013 P014 P015 P016 P017 P018 P019 P020 P021 P022 P023 P024 P025 RVRH0 RVRL0 RVR0 RVSS0 RVCC0 P026 P027 P028 P029 P430 P030 P031 P309 P310 VCC5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 May 15, 2015, MB9D560_DS708-00001-3v0-E IN1 6 IN1 7 IN1 8 IN1 9 IN2 0 IN2 1 V SS V CC1 2 P3 1 1 P3 1 2 P3 1 3 P3 1 4 P3 1 5 P3 1 6 P3 1 7 P3 1 8 P3 1 9 P3 2 0 P3 2 1 P3 2 2 P3 2 3 V CC1 2 V SS IN6 STOPWT P3 2 4 IN7 RXDA P3 2 5 IN8 TXDA P3 2 6 IN9 TXE NA P3 2 7 IN1 0 RXDB P3 2 8 IN1 1 TXDB P3 2 9 IN1 2 TXE NB P3 3 0 NMIX RSTX MD1 MD0 X0 X1 V SS TRSTX TCK TDO TDI TMS n SRST INT4 SIN1 P4 0 6 SOT1 P4 0 7 SCK1 P4 0 8 INT0 RX0 P4 0 9 TX0 P4 1 0 INT1 RX1 P4 1 1 TX1 P4 1 2 INT2 RX2 P4 1 3 TX2 P4 1 4 TIOA 4 P4 1 5 TIOB4 P4 1 6 TIOA 5 P4 1 7 TIOB5 P4 1 8 V CC1 2 V SS RTO1 5 RTO1 6 RTO1 7 DTTI3 RTO1 8 RTO1 9 RTO2 0 RTO2 1 RTO2 2 RTO2 3 INT3 SIN0 SOT0 SCK0 4ADTG0 FRCK0 FRCK1 DTTI0 RTO0 RTO1 RTO2 RTO3 RTO4 RTO5 TIOA 0 TIOB0 TIOA 1 TIOB1 TIOA 2 TIOB2 TIOA 3 TIOB3 FRCK1 6 FRCK1 7 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 V CC5 P3 0 4 P3 0 3 P3 0 2 P3 0 1 P3 0 0 P2 3 1 P2 3 0 P2 2 9 P2 2 8 P2 2 7 P2 2 6 P2 2 5 P2 2 4 V SS V CC1 2 P2 2 3 P2 2 2 P2 2 1 P2 2 0 P2 1 9 P2 1 8 P2 1 7 P2 1 6 A V RH2 A V RL2 A V SS2 A V CC2 P2 1 5 P2 1 4 P2 1 3 P2 1 2 P2 1 1 P2 1 0 P2 0 9 P2 0 8 V CC1 2 V SS P2 0 7 P2 0 6 P2 0 5 P2 0 4 P2 0 3 P2 0 2 P2 0 1 P2 0 0 P4 2 9 P4 2 8 P4 2 7 P4 2 6 P4 2 5 V CC5 TIOB7 TIOA 7 TIOB6 TIOA 6 SCS43 SCS42 SCS41 SCS40 SCK4 SOT4 SIN4 FRCK7 FRCK6 FRCK5 FRCK4 A N7 A N6 A N5 A N4 A N3 A N2 A N1 A N0 MONCLK MM TIOB9 TIOA 9 TIOB8 TIOA 8 A N1 5 A N1 4 A N1 3 A N1 2 A N1 1 A N1 0 A N9 A N8 A N2 3 A N2 2 A N2 1 A N2 0 A N1 9 A N1 8 A N1 7 A N1 6 TIOB11 TIOA 11 TIOB10 TIOA 10 A DTG0 A N3 1 A N3 0 A N2 9 A N2 8 A N2 7 A N2 6 A N2 5 A N2 4 IN5 IN4 IN3 IN2 IN1 IN0 INT7 D a t a S h e e t 208 Pin Part Number without RDC TOP VIEW LER208 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 VSS VCC12 P423 P422 P421 P100 P101 P102 P103 P104 P105 P106 VCC5 VSS P107 P108 P109 P110 AVRH1 AVRL1 AVR1 AVSS1 AVCC1 P111 P112 P113 P114 P115 P116 P117 P118 P119 P120 P121 P122 P123 P124 P125 RVRH1 RVRL1 RVR1 RVSS1 RVCC1 P126 P127 P128 P129 P431 P131 P420 P419 VCC5 SCK3 SOT3 SIN3 DTTI1 RTO6 RTO7 RTO8 RTO9 RTO10 RTO11 INT6 4ADTG1 FRCK10 FRCK9 FRCK8 IN14 IN13 4AN4 4AN5 4AN6 4AN7 ZIN2 BIN2 AIN2 ZIN3 BIN3 AIN3 DAOUT1 ERDS1 SCK2 SOT2 SIN2 INT5 13 V SS P3 1 4 P3 1 5 P3 1 6 P3 1 7 P3 1 8 P3 1 9 P3 2 0 P3 2 1 P3 2 2 P3 2 3 V CC12 V SS IN6 STOPWT P3 2 4 IN7 RXDA P3 2 5 IN8 TXDA P3 2 6 IN9 TXE NA P3 2 7 IN1 0 RXDB P3 2 8 IN1 1 TXDB P3 2 9 IN1 2 TXE NB P3 3 0 NMIX RSTX MD1 MD0 X0 X1 V SS TRSTX TCK TDO TDI TMS nSRST INT4 SIN1 P4 0 6 SOT1 P4 0 7 SCK1 P4 0 8 INT0 RX0 P4 0 9 TX0 P4 1 0 INT1 RX1 P4 1 1 TX1 P4 1 2 INT2 RX2 P4 1 3 TX2 P4 1 4 V CC12 V SS DTTI3 RTO1 8 RTO1 9 RTO2 0 RTO2 1 RTO2 2 RTO2 3 INT3 SIN0 SOT0 SCK0 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 4ADTG0 ZIN0 BIN0 AIN0 ZIN1 BIN1 AIN1 DTTI0 RTO0 RTO1 RTO2 RTO3 RTO4 RTO5 4 AN0 4 AN1 4 AN2 4 AN3 RDC_W0 RDC_V0 RDC_U0 RDC_Z0 RDC_B0 RDC_A0 P0 2 6 ERDS0 14 CONFIDENTIAL VSS VCC12 P000 P001 P002 P003 P004 P005 P006 P007 P008 P009 P010 AVRH0 AVRL0 AVR0 AVSS0 AVCC0 P011 P012 P013 P014 P015 P016 AREF2 0 SIN_IN0 COS_IN0 SIN_OUT0 SIN_MINUS0 SIN_PLUS0 COS_PLUS0 COS_MINUS0 COS_OUT0 RVRH0 RVRL0 RVR0 RVSS0 RVCC0 RDC_ACT0 MAG_MINUS0 MAG_PLUS0 MAG_OUT0 P430 VCC5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 IN1 6 IN1 7 IN1 8 IN1 9 IN2 0 IN2 1 TIOA 0 TIOB0 TIOA 1 TIOB1 TIOA 2 TIOB2 TIOA 3 TIOB3 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 V CC5 P3 0 0 P2 3 1 P2 3 0 P2 2 9 P2 2 8 P2 2 7 P2 2 6 P2 2 5 P2 2 4 V SS V CC1 2 P2 2 3 P2 2 2 P2 2 1 P2 2 0 P2 1 9 P2 1 8 P2 1 7 P2 1 6 A V RH2 A V RL2 A V SS2 A V CC2 P2 1 5 P2 1 4 P2 1 3 P2 1 2 P2 1 1 P2 1 0 P2 0 9 P2 0 8 V CC1 2 V SS P2 0 7 P2 0 6 P2 0 5 P2 0 4 P2 0 3 P2 0 2 P2 0 1 P2 0 0 P4 2 9 V CC5 A N7 A N6 A N5 A N4 A N3 A N2 A N1 A N0 MONCLK A N1 5 A N1 4 A N1 3 A N1 2 A N1 1 A N1 0 A N9 A N8 A N2 3 A N2 2 A N2 1 A N2 0 A N1 9 A N1 8 A N1 7 A N1 6 A DTG0 A N3 1 A N3 0 A N2 9 A N2 8 A N2 7 A N2 6 A N2 5 A N2 4 MM TIOB7 TIOA 7 TIOB6 TIOA 6 SCS4 3 SCS4 2 SCS4 1 SCS4 0 SCK4 SOT4 SIN4 IN5 IN4 IN3 IN2 IN1 IN0 INT7 D a t a S h e e t 176 Pin Part Number with RDC TOP VIEW LEP176 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 VSS VCC12 P1 0 0 P1 0 1 P1 0 2 P1 0 3 P1 0 4 P1 0 5 P1 0 6 P1 0 7 P1 0 8 P1 0 9 P1 1 0 AVRH1 AVRL1 AVR1 AVSS1 AVCC1 P1 1 1 P1 1 2 P1 1 3 P1 1 4 P1 1 5 P1 1 6 AREF2 1 SIN_IN1 COS_IN1 SIN_OUT1 SIN_MINUS1 SIN_PLUS1 COS_PLUS1 COS_MINUS1 COS_OUT1 RVRH1 RVRL1 RVR1 RVSS1 RVCC1 RDC_ACT1 MAG_MINUS1 MAG_PLUS1 MAG_OUT1 P4 3 1 VCC5 DTTI1 RTO6 RTO7 RTO8 RTO9 RTO1 0 RTO1 1 4AN4 4AN5 4AN6 4AN7 4 ADTG1 RDC_W1 RDC_V1 RDC_U1 RDC_Z1 RDC_B1 RDC_A1 ZIN2 BIN2 AIN2 ZIN3 BIN3 AIN3 P1 2 6 ERDS1 MB9D560_DS708-00001-3v0-E, May 15, 2015 DAOUT0 ERDS0 May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL INT2 INT1 ZIN0 BIN0 AIN0 ZIN1 BIN1 AIN1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 INT0 VSS VCC12 P000 P001 P002 P003 P004 P005 P006 P007 P008 P009 P010 AVRH0 AVRL0 AVR0 AVSS0 AVCC0 P011 P012 P013 P014 P015 P016 P017 P018 P019 P020 P021 P022 P023 P024 P025 RVRH0 RVRL0 RVR0 RVSS0 RVCC0 P026 P027 P028 P029 P430 VCC5 INT4 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 DTTI0 RTO0 RTO1 RTO2 RTO3 RTO4 RTO5 4AN0 4AN1 4AN2 4AN3 IN6 IN7 IN8 IN9 IN1 0 IN1 1 IN1 2 V SS P3 1 4 P3 1 5 P3 1 6 P3 1 7 P3 1 8 P3 1 9 P3 2 0 P3 2 1 P3 2 2 P3 2 3 V CC1 2 V SS STOPWT P3 2 4 RXDA P3 2 5 TXDA P3 2 6 TXE NA P3 2 7 RXDB P3 2 8 TXDB P3 2 9 TXE NB P3 3 0 NMIX RSTX MD1 MD0 X0 X1 V SS TRSTX TCK TDO TDI TMS n SRST SIN1 P4 0 6 SOT1 P4 0 7 SCK1 P4 0 8 RX0 P4 0 9 TX0 P4 1 0 RX1 P4 1 1 TX1 P4 1 2 RX2 P4 1 3 TX2 P4 1 4 V CC1 2 V SS DTTI3 RTO1 8 RTO1 9 RTO2 0 RTO2 1 RTO2 2 RTO2 3 SIN0 SOT0 SCK0 4ADTG0 IN1 6 IN1 7 IN1 8 IN1 9 IN2 0 IN2 1 TIOA 0 TIOB0 TIOA 1 TIOB1 TIOA 2 TIOB2 TIOA 3 TIOB3 INT3 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 V CC5 P3 0 0 P2 3 1 P2 3 0 P2 2 9 P2 2 8 P2 2 7 P2 2 6 P2 2 5 P2 2 4 V SS V CC1 2 P2 2 3 P2 2 2 P2 2 1 P2 2 0 P2 1 9 P2 1 8 P2 1 7 P2 1 6 A V RH2 A V RL2 A V SS2 A V CC2 P2 1 5 P2 1 4 P2 1 3 P2 1 2 P2 1 1 P2 1 0 P2 0 9 P2 0 8 V CC1 2 V SS P2 0 7 P2 0 6 P2 0 5 P2 0 4 P2 0 3 P2 0 2 P2 0 1 P2 0 0 P4 2 9 V CC5 A N7 A N6 A N5 A N4 A N3 A N2 A N1 A N0 MONCLK A N1 5 A N1 4 A N1 3 A N1 2 A N1 1 A N1 0 A N9 A N8 A N2 3 A N2 2 A N2 1 A N2 0 A N1 9 A N1 8 A N1 7 A N1 6 A DTG0 A N3 1 A N3 0 A N2 9 A N2 8 A N2 7 A N2 6 A N2 5 A N2 4 MM TIOB7 TIOA 7 TIOB6 TIOA 6 SCS43 SCS42 SCS41 SCS40 SCK4 SOT4 SIN4 IN5 IN4 IN3 IN2 IN1 IN0 INT7 D a t a S h e e t 176 Pin Part Number without RDC TOP VIEW LEP176 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 VSS VCC12 P100 P101 P102 P103 P104 P105 P106 P107 P108 P109 P110 AVRH1 AVRL1 AVR1 AVSS1 AVCC1 P111 P112 P113 P114 P115 P116 P117 P118 P119 P120 P121 P122 P123 P124 P125 RVRH1 RVRL1 RVR1 RVSS1 RVCC1 P126 P127 P128 P129 P431 VCC5 DTTI1 RTO6 RTO7 RTO8 RTO9 RTO10 RTO11 4AN4 4AN5 4AN6 4AN7 4ADTG1 ZIN2 BIN2 AIN2 ZIN3 BIN3 AIN3 DAOUT1 ERDS1 15 D a t a S h e e t 5. Pin Description Pin Number Part Number with RDC 208 pin 176 pin 3 - 4 - 5 3 Pin Name P305 FRCK0 P306 FRCK1 I/O Circuit Type E E P000 DTTI0 4 7 5 8 6 9 7 10 8 11 9 14 10 15 11 16 12 17 13 23 19 P001 RTO0 P002 RTO1 P003 RTO2 P004 RTO3 P005 RTO4 P006 RTO5 P007 4AN0 P008 4AN1 P009 4AN2 P010 4AN3 E E E E E E F F F F RDC_V0 26 27 22 23 RDC_U0 29 25 CONFIDENTIAL Waveform generator ch.3 output pin General-purpose I/O port Waveform generator ch.4 output pin General-purpose I/O port Waveform generator ch.5 output pin General-purpose I/O port 4ch sample-hold A/D converter unit0 analog 0 input pin General-purpose I/O port 4ch sample-hold A/D converter unit0 analog 1 input pin General-purpose I/O port 4ch sample-hold A/D converter unit0 analog 2 input pin General-purpose I/O port 4ch sample-hold A/D converter unit0 analog 3 input pin R/D converter unit0 W-phase output pin R/D converter unit0 V-phase output pin R/D converter unit0 U-phase output pin Up/Down counter ch.0 AIN input pin P014 General-purpose I/O port RDC_Z0 E R/D converter unit0 Z-phase output pin ZIN1 Up/Down counter ch.1 ZIN input pin P015 General-purpose I/O port RDC_B0 E RDC_A0 AREF20 R/D converter unit0 B-phase output pin Up/Down counter ch.1 BIN input pin General-purpose I/O port E AIN1 16 General-purpose I/O port AIN0 P016 24 General-purpose I/O port Waveform generator ch.2 output pin General-purpose I/O port E BIN1 28 General-purpose I/O port Waveform generator ch.1 output pin Up/Down counter ch.0 BIN input pin P013 21 General-purpose I/O port Waveform generator ch.0 output pin General-purpose I/O port E BIN0 25 Waveform generator output stop signal input pin 0 Up/Down counter ch.0 ZIN input pin P012 20 General-purpose I/O port 16-bit free-run timer ch.1 external clock input pin General-purpose I/O port E ZIN0 24 16-bit free-run timer ch.0 external clock input pin 4ch sample-hold A/D converter unit0 external trigger input pin P011 RDC_W0 General-purpose I/O port General-purpose I/O port E 4ADTG0 6 Functions R/D converter unit0 A-phase output pin Up/Down counter ch.1 AIN input pin L R/D converter unit0 Aref output pin(RVCC0/2) MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Number Pin Name I/O Circuit Type Functions 208 pin 176 pin 30 26 SIN_IN0 K R/D converter unit0 SIN coil earth leakage detection input pin 31 27 COS_IN0 K R/D converter unit0 COS coil earth leakage detection input pin 32 28 SIN_OUT0 L R/D converter unit0 SIN output pin 33 29 SIN_MINUS0 K R/D converter unit0 SIN input pin- 34 30 SIN_PLUS0 K R/D converter unit0 SIN input pin+ 35 31 COS_PLUS0 K R/D converter unit0 COS input pin+ 36 32 COS_MINUS0 K R/D converter unit0 COS input pin- 37 33 COS_OUT0 L R/D converter unit0 COS output pin RDC_ACT0 39 44 40 MAG_MINUS0 K R/D converter unit0 excitation external input pin- 45 41 MAG_PLUS0 K R/D converter unit0 excitation external input pin+ 46 42 MAG_OUT0 L 47 43 P026 P430 ERDS0 E R/D converter unit0 operation status output pin 43 E P030 48 - 49 - 50 - DTTI2 E 16-bit free-run timer ch.12 external clock input pin General-purpose I/O port RTO12 E 16-bit free-run timer ch.13 external clock input pin P309 General-purpose I/O port RTO13 E RTO14 RTO15 General-purpose I/O port E RTO16 General-purpose I/O port E - P313 RTO17 General-purpose I/O port E 46 DTTI3 E E RTO18 General-purpose I/O port E TIOB0 48 RTO19 General-purpose I/O port E TIOA1 49 RTO20 General-purpose I/O port E TIOB1 50 RTO21 TIOA2 May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL Waveform generator ch.20 output pin Base timer ch.1 TIOB input pin P318 62 Waveform generator ch.19 output pin Base timer ch.1 TIOA I/O pin P317 61 Waveform generator ch.18 output pin Base timer ch.0 TIOB input pin P316 60 Waveform generator output stop signal input pin 3 Base timer ch.0 TIOA output pin P315 47 General-purpose I/O port Waveform generator ch.17 output pin General-purpose I/O port TIOA0 59 Waveform generator ch.16 output pin 16-bit free-run timer ch.17 external clock input pin P314 58 Waveform generator ch.15 output pin 16-bit free-run timer ch.16 external clock input pin FRCK17 57 Waveform generator ch.14 output pin 16-bit free-run timer ch.15 external clock input pin P312 - Waveform generator ch.13 output pin 16-bit free-run timer ch.14 external clock input pin FRCK16 56 Waveform generator ch.12 output pin FRCK13 P311 - Waveform generator output stop signal input pin 2 P031 FRCK15 55 Error detection output pin ch.0 FRCK12 P310 - R/D converter unit0 excitation signal output pin General-purpose I/O port General-purpose I/O port FRCK14 51 General-purpose I/O port General-purpose I/O port E Waveform generator ch.21 output pin Base timer ch.2 TIOA output pin 17 D a t a S h e e t Pin Number 208 pin 176 pin 63 51 Pin Name I/O Circuit Type P319 RTO22 General-purpose I/O port E TIOB2 52 RTO23 General-purpose I/O port E TIOA3 65 53 54 67 55 70 71 72 58 59 60 Base timer ch.3 TIOA I/O pin General-purpose I/O port SIN0 Multi-function serial interface ch.0 serial data input pin INT3 E P322 SOT0 P323 SCK0 61 E E 62 63 General-purpose I/O port FlexRay stop watch input pin IN6 E 32-bit input capture ch.0 external pulse input pin P325 General-purpose I/O port RXDA IN7 H FlexRay ch.A data input pin 16-bit input capture ch.7 external pulse input pin IN17 32-bit input capture ch.1 external pulse input pin P326 General-purpose I/O port TXDA IN8 H FlexRay ch.A data output pin 16-bit input capture ch.8 external pulse input pin 32-bit input capture ch.2 external pulse input pin P327 General-purpose I/O port TXENA FlexRay ch.A operation enable output pin IN9 H 16-bit input capture ch.9 external pulse input pin 32-bit input capture ch.3 external pulse input pin P328 General-purpose I/O port RXDB FlexRay ch.B data input pin IN10 H 16-bit input capture ch.10 external pulse input pin 32-bit input capture ch.4 external pulse input pin P329 General-purpose I/O port TXDB FlexRay ch.B data output pin IN11 H TXENB 16-bit input capture ch.11 external pulse input pin 32-bit input capture ch.5 external pulse input pin P330 64 16-bit input capture ch.6 external pulse input pin IN16 IN21 76 General-purpose I/O port Multi-function serial interface ch.0 clock I/O pin STOPWT IN20 75 General-purpose I/O port Multi-function serial interface ch.0 serial data output pin P324 IN19 74 INT3 external interrupt input pin Base timer ch.3 TIOB input pin IN18 73 Waveform generator ch.23 output pin P321 TIOB3 66 Waveform generator ch.22 output pin Base timer ch.2 TIOB input pin P320 64 Functions General-purpose I/O port H IN12 FlexRay ch.B operation enable output pin 16-bit input capture ch.12 external pulse input pin 77 65 NMIX B Non-maskable interrupt input pin 78 66 RSTX B External reset input pin 79 67 MD1 C Mode pin 1 (with high-voltage control) 80 68 MD0 C Mode pin 0 (with high-voltage control) 81 69 X0 82 70 X1 84 72 TRSTX J JTAG test reset input 85 73 TCK J JTAG test clock input 86 74 TDO I JTAG test data output 18 CONFIDENTIAL A Main clock oscillation input pin Main clock oscillation output pin MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Number Pin Name I/O Circuit Type Functions 208 pin 176 pin 87 75 TDI J JTAG test data input 88 76 TMS J JTAG test mode status input 89 77 nSRST J System reset input for debugger P406 90 78 SIN1 General-purpose I/O port E INT4 91 79 92 80 P407 SOT1 P408 SCK1 INT4 external interrupt input pin E E P409 93 81 RX0 94 82 TX0 E 83 RX1 E 84 P412 TX1 85 RX2 E 98 86 99 - 100 - 101 - 102 - TX2 P415 TIOA4 P416 TIOB4 P417 TIOA5 P418 TIOB5 E - SIN2 E E E E E General-purpose I/O port CAN ch.1 transmission data output pin CAN ch.2 reception data input pin General-purpose I/O port CAN ch.2 transmission data output pin General-purpose I/O port Base timer ch.4 TIOA output pin General-purpose I/O port Base timer ch.4 TIOB input pin General-purpose I/O port Base timer ch.5 TIOA I/O pin General-purpose I/O port Base timer ch.5 TIOB input pin General-purpose I/O port E INT5 P420 CAN ch.1 reception data input pin INT2 external interrupt input pin P419 106 CAN ch.0 transmission data output pin General-purpose I/O port INT2 P414 General-purpose I/O port INT1 external interrupt input pin P413 97 CAN ch.0 reception data input pin General-purpose I/O port E INT1 96 General-purpose I/O port Multi-function serial interface ch.1 clock I/O pin INT0 external interrupt input pin P411 95 General-purpose I/O port Multi-function serial interface ch.1 serial data output pin General-purpose I/O port INT0 P410 Multi-function serial interface ch.1 serial data input pin Multi-function serial interface ch.2 serial data input pin INT5 external interrupt input pin - 108 - 109 90 110 91 MAG_OUT1 L R/D converter unit1excitation signal output pin 111 92 MAG_PLUS1 K R/D converter unit1excitation external input pin+ 112 93 MAG_MINUS1 K R/D converter unit1excitation external input pin- 113 94 SOT2 P131 SCK2 P431 ERDS1 RDC_ACT1 P126 E General-purpose I/O port 107 E E E Multi-function serial interface ch.2 serial data output pin General-purpose I/O port Multi-function serial interface ch.2 clock I/O pin General-purpose I/O port Error detection output pin ch.1 R/D converter unit1 operation status output pin General-purpose I/O port 119 100 COS_OUT1 L R/D converter unit1 COS output pin 120 101 COS_MINUS1 K R/D converter unit1 COS input pin- 121 102 COS_PLUS1 K R/D converter unit1 COS input pin+ May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 19 D a t a S h e e t Pin Number Pin Name I/O Circuit Type Functions 208 pin 176 pin 122 103 SIN_PLUS1 K R/D converter unit1 SIN input pin+ 123 104 SIN_MINUS1 K R/D converter unit1 SIN input pin- 124 105 SIN_OUT1 L R/D converter unit1 SIN output pin 125 106 COS_IN1 K R/D converter unit1 COS coil earth leakage detection input pin 126 107 SIN_IN1 K R/D converter unit1 SIN coil earth leakage detection input pin 127 108 AREF21 L R/D converter unit1 Aref output pin(RVCC1/2) P116 128 109 RDC_A1 General-purpose I/O port E AIN3 Up/Down counter ch.3 AIN input pin P115 129 110 RDC_B1 General-purpose I/O port E BIN3 111 RDC_Z1 General-purpose I/O port E ZIN3 112 RDC_U1 General-purpose I/O port E AIN2 113 RDC_V1 General-purpose I/O port E BIN2 114 RDC_W1 General-purpose I/O port E ZIN2 139 120 140 121 141 122 142 123 145 124 146 125 147 126 148 127 149 128 150 129 P110 4AN7 P109 4AN6 P108 4AN5 P107 4AN4 P106 RTO11 P105 RTO10 P104 RTO9 P103 RTO8 P102 RTO7 P101 RTO6 130 DTTI1 4ADTG1 20 CONFIDENTIAL R/D converter unit1 W phase output pin Up/Down counter ch.2 ZIN input pin F F F F E E E E E E P100 151 R/D converter unit1 V phase output pin Up/Down counter ch.2 BIN input pin P111 133 R/D converter unit1 U phase output pin Up/Down counter ch.2 AIN input pin P112 132 R/D converter unit1 Z phase output pin Up/Down counter ch.3 ZIN input pin P113 131 R/D converter unit1 B phase output pin Up/Down counter ch.3 BIN input pin P114 130 R/D converter unit1 A phase output pin General-purpose I/O port 4ch sample-hold A/D converter unit1 analog 7 input pin General-purpose I/O port 4ch sample-hold A/D converter unit1 analog 6 input pin General-purpose I/O port 4ch sample-hold A/D converter unit1 analog 5 input pin General-purpose I/O port 4ch sample-hold A/D converter unit1 analog 4 input pin General-purpose I/O port Waveform generator ch.11 output pin General-purpose I/O port Waveform generator ch.10 output pin General-purpose I/O port Waveform generator ch.9 output pin General-purpose I/O port Waveform generator ch.8 output pin General-purpose I/O port Waveform generator ch.7 output pin General-purpose I/O port Waveform generator ch.6 output pin General-purpose I/O port E Waveform generator output stop signal input pin1 4ch sample-hold A/D converter unit1 external trigger input pin MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Number 208 pin 176 pin 152 - Pin Name I/O Circuit Type P421 General-purpose I/O port SIN3 Multi-function serial interface ch.3 serial data input pin INT6 E FRCK8 153 - 154 - - 159 - 160 - 161 - 16-bit free-run timer ch.8 external clock input pin General-purpose I/O port SOT3 Multi -function serial interface ch.3 serial data output pin FRCK9 E 134 16-bit input capture ch.13 external pulse input pin P423 General-purpose I/O port SCK3 FRCK10 E P425 TIOA8 P426 TIOB8 P427 TIOA9 P428 TIOB9 MONCLK 135 164 136 165 137 166 138 167 139 168 140 169 141 170 142 173 145 174 146 175 147 176 148 177 149 P200 AN0 P201 AN1 P202 AN2 P203 AN3 P204 AN4 P205 AN5 P206 AN6 P207 AN7 P208 AN8 P209 AN9 P210 AN10 P211 AN11 P212 AN12 May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL Multi-function serial interface ch.3 clock I/O pin 16-bit free-run timer ch.10 external clock input pin 16-bit input capture ch.14 external pulse input pin E E E E General-purpose I/O port Base timer ch.8 TIOA output pin General-purpose I/O port Base timer ch.8 TIOB input pin General-purpose I/O port Base timer ch.9 TIOA I/O pin General-purpose I/O port Base timer ch.9 TIOB input pin General-purpose I/O port E MM 163 16-bit free-run timer ch.9 external clock input pin IN13 P429 162 INT6 external interrupt input pin P422 IN14 158 Functions Clock monitor output pin Clock supervisor main clock error detection output pin F F F F F F F F F F F F F General-purpose I/O port A/D converter analog 0 input pin General-purpose I/O port A/D converter analog 1 input pin General-purpose I/O port A/D converter analog 2 input pin General-purpose I/O port A/D converter analog 3 input pin General-purpose I/O port A/D converter analog 4 input pin General-purpose I/O port A/D converter analog 5 input pin General-purpose I/O port A/D converter analog 6 input pin General-purpose I/O port A/D converter analog 7 input pin General-purpose I/O port A/D converter analog 8 input pin General-purpose I/O port A/D converter analog 9 input pin General-purpose I/O port A/D converter analog 10 input pin General-purpose I/O port A/D converter analog 11 input pin General-purpose I/O port A/D converter analog 12 input pin 21 D a t a S h e e t Pin Number 208 pin 176 pin 178 150 179 151 180 152 185 157 186 158 187 159 188 160 Pin Name P213 AN13 P214 AN14 P215 AN15 P216 AN16 P217 AN17 P218 AN18 P219 AN19 I/O Circuit Type F F F F F F F P220 189 190 161 162 AN20 F 196 167 168 AN21 F 169 AN22 170 171 AN23 172 P224 AN24 CONFIDENTIAL A/D converter analog 21 input pin A/D converter analog 22 input pin A/D converter analog 23 input pin Base timer ch.7 TIOB input pin F General-purpose I/O port A/D converter Analog 24 input pin P225 General-purpose I/O port AN25 A/D converter analog 25 input pin SIN4 F Multi-function serial interface ch.4 serial data input pin INT7 external interrupt input pin P226 General-purpose I/O port AN26 A/D converter analog 26 input pin SOT4 F Multi-function serial interface ch.4 serial data output pin 16-bit input capture ch.0 external pulse input pin P227 General-purpose I/O port AN27 A/D converter analog 27 input pin SCK4 F Multi-function serial interface ch.4 clock I/O pin 16-bit input capture ch.1 external pulse input pin P228 General-purpose I/O port AN28 A/D converter analog 28 input pin SCS40 F Multi-function serial interface ch.4 serial chip select 0 I/O pin 16-bit input capture ch.2 external pulse input pin P229 General-purpose I/O port AN29 A/D converter analog 29 input pin SCS41 IN3 22 A/D converter analog 20 input pin General-purpose I/O port F IN2 200 General-purpose I/O port A/D converter analog 19 input pin Base timer ch.7 TIOA I/O pin IN1 199 General-purpose I/O port A/D converter analog 18 input pin General-purpose I/O port F IN0 198 General-purpose I/O port A/D converter analog 17 input pin Base timer ch.6 TIOB input pin INT7 197 General-purpose I/O port A/D converter analog 16 input pin General-purpose I/O port TIOB7 195 A/D converter analog 15 input pin Base timer ch.6 TIOA output pin P223 164 General-purpose I/O port P221 TIOA7 192 General-purpose I/O port A/D converter analog 14 input pin TIOA6 P222 163 General-purpose I/O port A/D converter analog 13 input pin General-purpose I/O port TIOB6 191 Functions F Multi-function serial interface ch.4 serial chip select 1 I/O pin 16-bit input capture ch.3 external pulse input pin MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Number 208 pin 201 176 pin 173 Pin Name I/O Circuit Type P230 General-purpose I/O port AN30 A/D converter analog 30 input pin SCS42 F IN4 202 174 175 P231 General-purpose I/O port AN31 A/D converter analog 31 input pin SCS43 F P300 ADTG0 - TIOA10 E TIOB10 TIOA11 General-purpose I/O port E FRCK6 Base timer ch.11 TIOA I/O pin 16-bit free-run timer ch.6 external clock input pin P304 TIOB11 Base timer ch.10 TIOB input pin 16-bit free-run timer ch.5 external clock input pin P303 - Base timer ch.10 TIOA output pin General-purpose I/O port E FRCK5 206 A/D converter external trigger input pin 16-bit free-run timer ch.4 external clock input pin P302 - General-purpose I/O port General-purpose I/O port E FRCK4 205 Multi-function serial interface ch.4 serial chip select 3 I/O pin 16-bit input capture ch.5 external pulse input pin P301 204 Multi-function serial interface ch.4 serial chip select 2 I/O pin 16-bit input capture ch.4 external pulse input pin IN5 203 Functions General-purpose I/O port 207 - E 18 14 AVRH0 19 15 AVRL0 - 4ch sample-hold A/D converter unit0 lower limit reference voltage 20 16 AVR0 - 4ch sample-hold A/D converter unit0 reference voltage 21 17 AVSS0 - 4ch sample-hold A/D converter unit0 analog GND 22 18 AVCC0 - 4ch sample-hold A/D converter unit0 analog power supply 134 115 AVCC1 - 4ch sample-hold A/D converter unit1 analog power supply 135 116 AVSS1 - 4ch sample-hold A/D converter unit1 analog GND 136 117 AVR1 - 4ch sample-hold A/D converter unit1 reference voltage 137 118 AVRL1 - 4ch sample-hold A/D converter unit1 lower limit reference voltage 138 119 AVRH1 - 4ch sample-hold A/D converter unit1 upper limit reference voltage 38 34 RVRH0 - R/D converter unit0 upper limit reference voltage 39 35 RVRL0 - R/D converter unit0 lower limit reference voltage 40 36 RVR0 - R/D converter unit0 reference voltage 41 37 RVSS0 - R/D converter unit0 analog GND R/D converter unit0 analog power supply FRCK7 Base timer ch.11 TIOB input pin 16-bit free-run timer ch.7 external clock input pin - 4ch sample-hold A/D converter unit0 upper limit reference voltage 42 38 RVCC0 - 114 95 RVCC1 - R/D converter unit1 analog power supply 115 96 RVSS1 - R/D converter unit1 analog GND 116 97 RVR1 - R/D converter unit1 reference voltage 117 98 RVRL1 - R/D converter unit1 lower limit reference voltage 118 99 RVRH1 - R/D converter unit1 upper limit reference voltage 181 153 AVCC2 - A/D converter analog power supply 182 154 AVSS2 - A/D converter analog GND 183 155 AVRL2 - A/D converter lower limit reference voltage 184 156 AVRH2 - A/D converter upper limit reference voltage May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 23 D a t a S h e e t Pin Number 208 pin 176 pin 2 54 68 103 155 172 193 Pin Name I/O Circuit Type Functions 2 56 87 131 VCC12 - 1.2V power supply VCC5 - 5.0V power supply VSS - GND 144 165 12 52 44 105 89 144 133 157 176 208 1 13 1 53 45 69 57 83 71 104 88 143 132 156 143 171 166 194 24 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Number Part Number without RDC 208pin 176pin 3 - 4 - 5 3 Pin Name I/O Circuit Type P305 FRCK0 P306 FRCK1 E E P000 DTTI0 6 4 7 5 8 6 9 7 10 8 11 9 14 10 15 11 16 12 17 13 23 19 24 20 RTO0 P002 RTO1 P003 RTO2 P004 RTO3 P005 RTO4 P006 RTO5 P007 4AN0 P008 4AN1 P009 4AN2 P010 4AN3 P011 ZIN0 P012 BIN0 P013 General-purpose I/O port 16-bit free-run timer ch.0 external clock input pin General-purpose I/O port 16-bit free-run timer ch.1 external clock input pin General-purpose I/O port E 4ADTG0 P001 Functions Waveform generator output stop signal input pin 0 4ch sample-hold A/D converter unit0 external trigger input pin E E E E E E F F F F E E Waveform generator ch.0 output pin General-purpose I/O port Waveform generator ch.1 output pin General-purpose I/O port Waveform generator ch.2 output pin General-purpose I/O port Waveform generator ch.3 output pin General-purpose I/O port Waveform generator ch.4 output pin General-purpose I/O port Waveform generator ch.5 output pin General-purpose I/O port 4ch sample-hold A/D converter unit0 analog 0 input pin General-purpose I/O port 4ch sample-hold A/D converter unit0 analog 1 input pin General-purpose I/O port 4ch sample-hold A/D converter unit0 analog 2 input pin General-purpose I/O port 4ch sample-hold A/D converter unit0 analog 3 input pin General-purpose I/O port Up/Down counter ch.0 ZIN input pin General-purpose I/O port Up/Down counter ch.0 BIN input pin General-purpose I/O port 25 21 26 22 27 23 28 24 29 25 P017 E General-purpose I/O port 30 26 P018 E General-purpose I/O port 31 27 P019 E General-purpose I/O port 32 28 P020 E General-purpose I/O port 33 29 P021 E General-purpose I/O port 34 30 P022 E General-purpose I/O port 35 31 P023 E General-purpose I/O port 36 32 P024 E General-purpose I/O port 37 33 P025 E General-purpose I/O port 43 39 P026 E General-purpose I/O port AIN0 P014 ZIN1 P015 BIN1 P016 AIN1 May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL E General-purpose I/O port E E E Up/Down counter ch.0 AIN input pin General-purpose I/O port Up/Down counter ch.1 ZIN input pin General-purpose I/O port Up/Down counter ch.1 BIN input pin General-purpose I/O port Up/Down counter ch.1 AIN input pin 25 D a t a S h e e t Pin Number Pin Name I/O Circuit Type Functions 208pin 176pin 44 40 P027 E General-purpose I/O port 45 41 P028 E General-purpose I/O port 46 42 47 43 P029 DAOUT0 P430 ERDS0 G E P030 48 - DTTI2 RTO12 RTO13 General-purpose I/O port E FRCK14 - RTO14 General-purpose I/O port E FRCK15 - 56 - RTO15 General-purpose I/O port E - 16-bit free-run timer ch.16 external clock input pin P312 General-purpose I/O port RTO16 E P313 RTO17 46 DTTI3 E RTO18 RTO19 General-purpose I/O port E TIOA1 62 63 64 49 50 51 52 RTO20 CONFIDENTIAL General-purpose I/O port E Waveform generator ch.20 output pin TIOB1 Base timer ch.1 TIOB input pin P318 General-purpose I/O port RTO21 E Waveform generator ch.21 output pin TIOA2 Base timer ch.2 TIOA output pin P319 General-purpose I/O port RTO22 E Waveform generator ch.22 output pin TIOB2 Base timer ch.2 TIOB input pin P320 General-purpose I/O port RTO23 TIOA3 26 Waveform generator ch.19 output pin Base timer ch.1 TIOA I/O pin P317 61 Waveform generator ch.18 output pin Base timer ch.0 TIOB input pin P316 48 Waveform generator output stop signal input pin 3 General-purpose I/O port E TIOB0 60 Waveform generator ch.17 output pin Base timer ch.0 TIOA output pin P315 47 General-purpose I/O port General-purpose I/O port E TIOA0 59 Waveform generator ch.16 output pin 16-bit free-run timer ch.17 external clock input pin P314 58 Waveform generator ch.15 output pin FRCK16 FRCK17 57 Waveform generator ch.14 output pin 16-bit free-run timer ch.15 external clock input pin P311 55 Waveform generator ch.13 output pin 16-bit free-run timer ch.14 external clock input pin P310 51 Waveform generator ch.12 output pin 16-bit free-run timer ch.13 external clock input pin P309 - Waveform generator output stop signal input pin 2 General-purpose I/O port E FRCK13 50 Error detection output pin ch.0 16-bit free-run timer ch.12 external clock input pin P031 - General-purpose I/O port General-purpose I/O port E FRCK12 49 General-purpose I/O port D/A converter ch.0 analog output pin E Waveform generator ch.23 output pin Base timer ch.3 TIOA I/O pin MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Number 208pin 65 176pin 53 Pin Name I/O Circuit Type P321 General-purpose I/O port SIN0 Multi-function serial interface ch.0 serial data input pin INT3 E TIOB3 66 67 54 55 P322 SOT0 P323 SCK0 58 STOPWT IN6 E E 59 E 60 61 62 63 16-bit input capture ch.6 external pulse input pin General-purpose I/O port FlexRay ch.A data input pin IN7 H 16-bit input capture ch.7 external pulse input pin 32-bit input capture ch.1 external pulse input pin P326 General-purpose I/O port TXDA FlexRay ch.A data output pin IN8 H 16-bit input capture ch.8 external pulse input pin 32-bit input capture ch.2 external pulse input pin P327 General-purpose I/O port TXENA FlexRay ch.A operation enable output pin IN9 H 16-bit input capture ch.9 external pulse input pin 32-bit input capture ch.3 external pulse input pin P328 General-purpose I/O port RXDB FlexRay ch.B data input pin IN10 H IN20 75 FlexRay stop watch input pin RXDA IN19 74 General-purpose I/O port Multi-function serial interface ch.0 clock I/O pin P325 IN18 73 Multi-function serial interface ch.0 serial data output pin 32-bit input capture ch.0 external pulse input pin IN17 72 General-purpose I/O port General-purpose I/O port IN16 71 INT3 external interrupt input pin Base timer ch.3 TIOB input pin P324 70 Functions 16-bit input capture ch.10 external pulse input pin 32-bit input capture ch.4 external pulse input pin P329 General-purpose I/O port TXDB FlexRay ch.B data output pin IN11 H IN21 32-bit input capture ch.5 external pulse input pin P330 TXENB 16-bit input capture ch.11 external pulse input pin General-purpose I/O port 76 64 H 77 65 NMIX 78 66 RSTX B External reset input pin 79 67 MD1 C Mode pin 1 (with high-voltage control) 80 68 MD0 C Mode pin 0 (with high-voltage control) 81 69 X0 82 70 X1 84 72 TRSTX J JTAG test reset input 85 73 TCK J JTAG test clock input 86 74 TDO I JTAG test data output 87 75 TDI J JTAG test data input 88 76 TMS J JTAG test mode status input 89 77 nSRST J System reset input for debugger 90 78 E Multi-function serial interface ch.1 serial data input pin IN12 16-bit input capture ch.12 external pulse input pin B A P406 SIN1 INT4 May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL FlexRay ch.B operation enable output pin Non-maskable interrupt input pin Main clock oscillation input pin Main clock oscillation output pin General-purpose I/O port INT4 external interrupt input pin 27 D a t a S h e e t Pin Number 208pin 176pin 91 79 92 80 Pin Name P407 SOT1 P408 SCK1 I/O Circuit Type E E P409 93 81 RX0 94 82 95 83 TX0 E E 84 P412 TX1 85 RX2 E 98 86 99 - 100 - 101 - 102 - TX2 P415 TIOA4 P416 TIOB4 P417 TIOA5 P418 TIOB5 E - SIN2 E E E E E 107 - 108 - 109 90 110 91 SOT2 P131 SCK2 P431 ERDS1 P129 DAOUT1 CAN ch.2 reception data input pin General-purpose I/O port CAN ch.2 transmission data output pin General-purpose I/O port Base timer ch.4 TIOA output pin General-purpose I/O port Base timer ch.4 TIOB input pin General-purpose I/O port Base timer ch.5 TIOA I/O pin General-purpose I/O port Base timer ch.5 TIOB input pin General-purpose I/O port E INT5 P420 General-purpose I/O port CAN ch.1 transmission data output pin INT2 external interrupt input pin P419 106 CAN ch.1 reception data input pin General-purpose I/O port INT2 P414 General-purpose I/O port CAN ch.0 transmission data output pin INT1 external interrupt input pin P413 97 CAN ch.0 reception data input pin General-purpose I/O port E INT1 96 General-purpose I/O port Multi-function serial interface ch.1 clock I/O pin INT0 external interrupt input pin P411 RX1 General-purpose I/O port Multi-function serial interface ch.1 serial data output pin General-purpose I/O port INT0 P410 Functions Multi-function serial interface ch.2 serial data input pin INT5 external interrupt input pin E E E G General-purpose I/O port Multi-function serial interface ch.2 serial data output pin General-purpose I/O port Multi-function serial interface ch.2 clock I/O pin General-purpose I/O port Error detection output pin ch.1 General-purpose I/O port D/A converter ch.1 analog output pin 111 92 P128 E General-purpose I/O port 112 93 P127 E General-purpose I/O port 113 94 P126 E General-purpose I/O port 119 100 P125 E General-purpose I/O port 120 101 P124 E General-purpose I/O port 121 102 P123 E General-purpose I/O port 122 103 P122 E General-purpose I/O port 123 104 P121 E General-purpose I/O port 124 105 P120 E General-purpose I/O port 125 106 P119 E General-purpose I/O port 126 107 P118 E General-purpose I/O port 127 108 P117 E General-purpose I/O port 28 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Number 208pin 176pin 128 109 129 110 130 111 131 112 132 113 133 114 139 120 140 121 141 122 142 123 145 124 146 125 147 126 148 127 149 128 150 129 Pin Name I/O Circuit Type P116 AIN3 P115 BIN3 P114 ZIN3 P113 AIN2 P112 BIN2 P111 ZIN2 P110 4AN7 P109 4AN6 P108 4AN5 P107 4AN4 P106 RTO11 P105 RTO10 P104 RTO9 P103 RTO8 P102 RTO7 P101 RTO6 E E E E E E F F F F E E E E E E P100 151 130 DTTI1 - - - - General-purpose I/O port Up/Down counter ch.2 AIN input pin General-purpose I/O port Up/Down counter ch.2 BIN input pin General-purpose I/O port Up/Down counter ch.2 ZIN input pin General-purpose I/O port 4ch sample-hold A/D converter unit1 analog 7 input pin General-purpose I/O port 4ch sample-hold A/D converter unit1 analog 6 input pin General-purpose I/O port 4ch sample-hold A/D converter unit1 analog 5 input pin General-purpose I/O port 4ch sample-hold A/D converter unit1 analog 4 input pin General-purpose I/O port Waveform generator ch.11 output pin General-purpose I/O port Waveform generator ch.10 output pin General-purpose I/O port Waveform generator ch.9 output pin General-purpose I/O port Waveform generator ch.8 output pin General-purpose I/O port Waveform generator ch.7 output pin General-purpose I/O port Waveform generator ch.6 output pin Waveform generator output stop signal input pin 1 General-purpose I/O port Multi-function serial interface ch.3 serial data input pin INT6 E INT6 external interrupt input pin 16-bit free-run timer ch.8 external clock input pin P422 General-purpose I/O port SOT3 Multi -function serial interface ch.3 serial data output pin FRCK9 E 16-bit free-run timer ch.9 external clock input pin 16-bit input capture ch.13 external pulse input pin P423 General-purpose I/O port SCK3 Multi-function serial interface ch.3 clock I/O pin FRCK10 P425 TIOA8 May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL Up/Down counter ch.3 ZIN input pin SIN3 E IN14 158 General-purpose I/O port 4ch sample-hold A/D converter unit1 external trigger input pin IN13 154 General-purpose I/O port Up/Down counter ch.3 BIN input pin P421 FRCK8 153 General-purpose I/O port Up/Down counter ch.3 AIN input pin General-purpose I/O port E 4ADTG1 152 Functions 16-bit free-run timer ch.10 external clock input pin 16-bit input capture ch.14 external pulse input pin E General-purpose I/O port Base timer ch.8 TIOA output pin 29 D a t a S h e e t Pin Number 208pin 176pin 159 - 160 - 161 - Pin Name P426 TIOB8 P427 TIOA9 P428 TIOB9 I/O Circuit Type E E E P429 162 134 MONCLK 135 164 136 165 137 166 138 167 139 168 140 169 141 170 142 173 145 174 146 175 147 176 148 177 149 178 150 179 151 180 152 185 157 186 158 187 159 188 160 30 CONFIDENTIAL P200 AN0 P201 AN1 P202 AN2 P203 AN3 P204 AN4 P205 AN5 P206 AN6 P207 AN7 P208 AN8 P209 AN9 P210 AN10 P211 AN11 P212 AN12 P213 AN13 P214 AN14 P215 AN15 P216 AN16 P217 AN17 P218 AN18 P219 AN19 General-purpose I/O port Base timer ch.8 TIOB input pin General-purpose I/O port Base timer ch.9 TIOA I/O pin General-purpose I/O port Base timer ch.9 TIOB input pin General-purpose I/O port E MM 163 Functions Clock monitor output pin Clock supervisor main clock error detection output pin F F F F F F F F F F F F F F F F F F F F General-purpose I/O port A/D converter analog 0 input pin General-purpose I/O port A/D converter analog 1 input pin General-purpose I/O port A/D converter analog 2 input pin General-purpose I/O port A/D converter analog 3 input pin General-purpose I/O port A/D converter analog 4 input pin General-purpose I/O port A/D converter analog 5 input pin General-purpose I/O port A/D converter analog 6 input pin General-purpose I/O port A/D converter analog 7 input pin General-purpose I/O port A/D converter analog 8 input pin General-purpose I/O port A/D converter analog 9 input pin General-purpose I/O port A/D converter analog 10 input pin General-purpose I/O port A/D converter analog 11 input pin General-purpose I/O port A/D converter analog 12 input pin General-purpose I/O port A/D converter analog 13 input pin General-purpose I/O port A/D converter analog 14 input pin General-purpose I/O port A/D converter analog 15 input pin General-purpose I/O port A/D converter analog 16 input pin General-purpose I/O port A/D converter analog 17 input pin General-purpose I/O port A/D converter analog 18 input pin General-purpose I/O port A/D converter analog 19 input pin MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Number 208pin 176pin 189 161 Pin Name I/O Circuit Type P220 AN20 General-purpose I/O port F TIOA6 162 AN21 General-purpose I/O port F TIOB6 163 AN22 General-purpose I/O port F TIOA7 164 AN23 General-purpose I/O port F TIOB7 195 196 197 198 167 168 169 170 P224 AN24 171 F 172 General-purpose I/O port AN25 A/D converter analog 25 input pin SIN4 F 173 INT7 external interrupt input pin P226 General-purpose I/O port AN26 SOT4 F 174 175 204 - 16-bit input capture ch.0 external pulse input pin General-purpose I/O port AN27 SCK4 F General-purpose I/O port AN28 A/D converter analog 28 input pin SCS40 F Multi-function serial interface ch.4 serial chip select 0 I/O pin 16-bit input capture ch.2 external pulse input pin P229 General-purpose I/O port AN29 A/D converter analog 29 input pin SCS41 F Multi-function serial interface ch.4 serial chip select 1 I/O pin 16-bit input capture ch.3 external pulse input pin P230 General-purpose I/O port AN30 A/D converter analog 30 input pin SCS42 F Multi-function serial interface ch.4 serial chip select 2 I/O pin 16-bit input capture ch.4 external pulse input pin P231 General-purpose I/O port AN31 A/D converter analog 31 input pin SCS43 F P300 ADTG0 TIOA10 TIOB10 FRCK5 May 15, 2015, MB9D560_DS708-00001-3v0-E Multi-function serial interface ch.4 serial chip select 3 I/O pin 16-bit input capture ch.5 external pulse input pin E General-purpose I/O port A/D converter external trigger input pin General-purpose I/O port E Base timer ch.10 TIOA output pin 16-bit free-run timer ch.4 external clock input pin P302 CONFIDENTIAL Multi-function serial interface ch.4 clock I/O pin P228 FRCK4 - A/D converter analog 27 input pin 16-bit input capture ch.1 external pulse input pin P301 205 Multi-function serial interface ch.4 serial data output pin P227 IN5 203 A/D converter analog 26 input pin IN0 IN4 202 Multi-function serial interface ch.4 serial data input pin INT7 IN3 201 General-purpose I/O port A/D converter analog 24 input pin P225 IN2 200 A/D converter analog 23 input pin Base timer ch.7 TIOB input pin IN1 199 A/D converter analog 22 input pin Base timer ch.7 TIOA I/O pin P223 192 A/D converter analog 21 input pin Base timer ch.6 TIOB input pin P222 191 A/D converter analog 20 input pin Base timer ch.6 TIOA output pin P221 190 Functions General-purpose I/O port E Base timer ch.10 TIOB input pin 16-bit free-run timer ch.5 external clock input pin 31 D a t a S h e e t Pin Number 208pin 176pin 206 - Pin Name I/O Circuit Type P303 TIOA11 General-purpose I/O port E FRCK6 Base timer ch.11 TIOA I/O pin 16-bit free-run timer ch.6 external clock input pin P304 TIOB11 Functions General-purpose I/O port 207 - E 18 14 AVRH0 - 4ch sample-hold A/D converter unit0 upper limit reference voltage 19 15 AVRL0 - 4ch sample-hold A/D converter unit0 lower limit reference voltage 20 16 AVR0 - 4ch sample-hold A/D converter unit0 reference voltage 21 17 AVSS0 - 4ch sample-hold A/D converter unit0 analog GND 22 18 AVCC0 - 4ch sample-hold A/D converter unit0 analog power supply 134 115 AVCC1 - 4ch sample-hold A/D converter unit1 analog power supply 135 116 AVSS1 - 4ch sample-hold A/D converter unit1 analog GND 136 117 AVR1 - 4ch sample-hold A/D converter unit1 reference voltage 137 118 AVRL1 - 4ch sample-hold A/D converter unit1 lower limit reference voltage 138 119 AVRH1 - 4ch sample-hold A/D converter unit1 upper limit reference voltage 38 34 RVRH0 - *1 39 35 RVRL0 - *2 40 36 RVR0 - *2 41 37 RVSS0 - *2 42 38 RVCC0 - *1 114 95 RVCC1 - *1 115 96 RVSS1 - *2 116 97 RVR1 - *2 117 98 RVRL1 - *2 118 99 RVRH1 - *1 181 153 AVCC2 - A/D converter analog power supply 182 154 AVSS2 - A/D converter analog GND 183 155 AVRL2 - A/D converter lower limit reference voltage 184 156 AVRH2 - A/D converter upper limit reference voltage VCC12 - 1.2V power supply VCC5 - 5.0V power supply FRCK7 2 54 68 103 155 172 193 Base timer ch.11 TIOB input pin 16-bit free-run timer ch.7 external clock input pin 2 56 87 131 144 165 12 52 44 105 89 144 133 157 176 208 32 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Number 208pin 176pin Pin Name I/O Circuit Type Functions 1 13 1 53 45 69 57 83 71 104 88 143 132 156 143 171 166 VSS - GND 194 *1: The part number without RDC does not use this pin. Connect it with the VCC5 pin. *2: The part number without RDC does not use this pin. Connect it with the VSS pin. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 33 D a t a S h e e t 6. I/O Circuit Type Type Circuit Remarks X1 Clock input A X0 − Oscillation feedback resistor: Approx. 1 MΩ − CMOS hysteresis input − With 50 kΩ pull-up resistor Standby control signal Pull-up resistor B CMOS hysteresis input Mode input N-ch High withstand voltage mode input N-ch C High withstand voltage control N-ch − Schmitt input − With high withstand voltage control − CMOS level output N-ch P-ch Digital output D IOH=-1/-2 mA, IOL=1/2 mA N-ch Pull-up control P-ch P-ch Digital output N-ch − General-purpose I/O port − CMOS level output − With 50 kΩ pull-up resistor − CMOS hysteresis input (0.7Vcc/0.3Vcc) − Automotive input (0.8Vcc/0.5Vcc) IOH=-1/-2 mA, IOL=1/2 mA E R CMOS hysteresis input Automotive input Standby control 34 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Type Circuit Remarks Pull-up control P-ch P-ch Digital output N-ch F − With Analog input, General-purpose I/O port − CMOS level output − With 50 kΩ pull-up resistor − CMOS hysteresis input (0.7Vcc/0.3Vcc) IOH=-1/-2 mA, IOL=1/2 mA During standby, the input value retains the R previous value. CMOS hysteresis input − Automotive input (0.8Vcc/0.5Vcc) During standby, the input value retains the Automotive input previous value. Standby control Analog input Pull-up control P-ch P-ch − With Analog output , General-purpose I/O − CMOS level output port Digital output N-ch IOH=-1/-2 mA, IOL=1/2 mA G R − With 50 kΩ pull-up resistor − CMOS hysteresis input (0.7Vcc/0.3Vcc) During standby, the input value retains the CMOS hysteresis input previous value. − Automotive input (0.8Vcc/0.5Vcc) During standby, the input value retains the Automotive input previous value. Standby control Analog output Pull-up control P-ch P-ch Digital output N-ch H − General-purpose I/O port − CMOS level output IOH=-1/-2/-4 mA, IOL=1/2/4 mA − With 50 kΩ pull-up resistor − FlexRay input (0.7Vcc/0.3Vcc) During standby, the input value retains the previous value. R FlexRay input − Automotive input (0.8Vcc/0.5Vcc) During standby, the input value retains the Automotive input previous value. Standby control May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 35 D a t a S h e e t Type Circuit Remarks P-ch Digital output I − IOH=-5 mA, IOL=5 mA N-ch J 36 CONFIDENTIAL TTL hysteresis input CMOS level output − TTL hysteresis input (2V/0.8V) K Analog input − Analog input L Analog output − Analog output MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 7. Handling Precautions Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your Spansion semiconductor devices. 7.1 Precautions for Product Design This section describes precautions when designing electronic equipment using semiconductor devices. Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings. Recommended Operating Conditions Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their sales representative beforehand. Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output functions. (1) Preventing Over-Voltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. (2) Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. (3) Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 37 D a t a S h e e t Latch-up Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called latch-up. CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following: (1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal noise, surge levels, etc. (2) Be sure that abnormal current flows do not occur during the power-on sequence. Observance of Safety Regulations and Standards Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of products. Fail-Safe Design Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Precautions Related to Usage of Devices Spansion semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. 7.2 Precautions for Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you should only mount under Spansion’s recommended conditions. For detailed information about mount conditions, contact your sales representative. Lead Insertion Type Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or mounting by using a socket. Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Spansion recommended mounting conditions. If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified before mounting. 38 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Surface Mount Type Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges. You must use appropriate mounting techniques. Spansion recommends the solder reflow method, and has established a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Spansion ranking of recommended conditions. Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength may be reduced under some conditions of use. Storage of Semiconductor Devices Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following: (1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in locations where temperature changes are slight. (2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5 ˚C and 30 ˚C. When you open Dry Package that recommends humidity 40% to 70% relative humidity. (3) When necessary, Spansion packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. (4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust. Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Spansion recommended conditions for baking. Condition: 125 ˚C/24 h Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: (1) Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be needed to remove electricity. (2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. (3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 MΩ). Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. (4) Ground all fixtures and instruments, or protect with anti-static measures. (5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 39 D a t a S h e e t 7.3 Precautions for Use Environment Reliability of semiconductor devices depends on ambient temperature and other conditions as described above. For reliable performance, do the following: (1) Humidity Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are anticipated, consider anti-humidity processing. (2) Discharge of Static Electricity When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases, use anti-static measures or processing to prevent discharges. (3) Corrosive Gases, Dust, or Oil Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices. (4) Radiation, Including Cosmic Radiation Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide shielding as appropriate. (5) Smoke, Flame CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic gases. Customers considering the use of Spansion products in other special environmental conditions should consult with sales representatives. Please check the latest handling precautions at the following URL. http://www.spansion.com/fjdocuments/fj/datasheet/e-ds/DS00-00004.pdf 40 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 8. Handling Devices For Latch-up Prevention If a voltage higher than VCC5 or VCC12, or a voltage lower than VSS is applied to an I/O pin, or if a voltage exceeding the ratings is applied between VCC5 to VSS and VCC12 to VSS pins, a latch-up may occur in CMOS IC. If the latch-up occurs, the power supply current increases excessively and device elements may be damaged by heat. Take care to prevent any voltage from exceeding the maximum ratings in device application. Also, the analog power supplies (AVCC0, AVCC1, AVCC2, AVRH0, AVRH1, AVRH2, RVCC0, RVCC1, RVRH0, RVEH1) and analog input must not exceed the digital power supply (VCC5) when the power supply to the analog system is turned on or off. In the correct power-on sequence, turn on the digital power supply voltage (VCC5, VCC12) and analog power supply voltages (AVCC0, AVCC1, AVCC2, AVRH0, AVRH1, AVRH2, RVCC0, RVCC1, RVRH0, RVRH1) simultaneously. Alternatively, turn on the digital power supply voltage (VCC5) first, and then turn on the analog power supplies (AVCC0, AVCC1, AVCC2, AVRH0, AVRH1, AVRH2, RVCC0, RVCC1, RVRH0, RVRH1). Treatment of Unused Pins If unused input pins are left open, they may cause a permanent damage to the device due to device malfunction or latch-up. Connect a 2 kΩ or higher resistor to each of unused input pins for pull-up or pull-down processing. Also, if I/O pins are not used, they must be set to the output state for releasing or they must be set to the input state and treated in the same way as for the input pins. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 41 D a t a S h e e t Power Supply Pins The device is designed to ensure that if the device contains multiple VCC5, VCC12 and VSS pins, the pins that should be at the same potential are interconnected to prevent latch-up or other malfunctions. Further, connect these pins to an external power supply or ground to reduce unwanted radiation, prevent strobe signals from malfunctioning due to a raised ground level, and fulfill the total output current standard, etc. As shown below, all VSS power supply pins must be treated in the similar way. If multiple VCC5 or VCC12 or VSS systems are connected, the device cannot operate correctly even within the guaranteed operating range. Power Supply Input Pin VCC VDD VSS VCC5 VSS VCC12 VSS VCC5 VCC5 VCC12 VCC12 VSS VCC12 VCC5 VSS The power supply pins should be connected to VCC5, VCC12 and VSS of this device at the low impedance from the power supply source. In the area close to this device, a ceramic capacitor having the capacitance larger than the capacitor of C pin is recommended to use as a bypass capacitor between VCC5, VCC12 and VSS pins Crystal Oscillation Circuit An external noise to the X0 or X1 pin may cause a device malfunction. The printed circuit board must be designed to lay out X0 and X1 pins, crystal oscillator (or ceramic resonator), and the bypass capacitor to be grounded to the close position to the device. The printed circuit board artwork is recommended to surround the X0 and X1 pins by ground circuits. Mode Pin (MD1, MD0) Connect the MD1, MD0 mode pin to the VCC5 or VSS pin directly. To prevent an erroneous selection of test mode caused by the noise, reduce the pattern length between each mode pin and VCC5 or VSS pin on the printed circuit board. Also, use the low-impedance pin connection. Notes during PLL Clock Operation When the PLL clock is selected and if the oscillator is disconnected or if the input is stopped, this clock may continue to operate at the free running frequency of the self oscillator circuit built in the PLL. This operation is not guaranteed. 42 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Treatment of R/D Converter and A/D Converter Power Supply Pins If unuse R/D converter and A/D converter, needs connection as follows. − AVCC0 = AVCC1= AVCC2 = AVRH0= AVRH1 = AVRH2 = RVCC0 = RVCC1 = RVRH0 =RVRH1 = VCC5 − AVSS0 = AVSS1 = AVSS2 = AVRL0 = AVRL1 = AVRL2 = AVR0 = AVR1 = RVSS0 = RVSS1 = RVRL0 = RVRL1 = RVR0 = RVR1 = VSS Note on Using External Clock The external clock is unsupported. External direct clock input cannot use. Power-on Sequence of R/D Converter and A/D Converter Power Supply Analog Inputs Be sure to turn on the digital power supply (VCC5, VCC12) first, and then turn on the R/D converter and A/D *1 *2 converter power supplies and analog inputs . Also, turn off the R/D converter and A/D converter power *1 *2 supplies and analog inputs first, and then turn off the digital power supply (VCC5, VCC12). When the AVRH0, AVRH1, AVRH2, RVRH0 and RVRH1 pin voltages are turned on or off, they must not exceed AVCC0, AVCC1, AVCC2, RVCC0 and RVCC1. Even if a common analog input pin is used as an input port, its input voltage must not exceed AVCC0, AVCC1 or AVCC2. (However, the analog power supply voltage and digital power supply voltage can be turned on or off simultaneously.) *1: AVCC0, AVCC1, AVCC2, AVRH0, AVRH1, AVRH2, AVRL0, AVRL1, AVRL2, RVCC0, RVCC1, RVRH0, RVRH1, RVRL0, RVRL1 *2: MAG_PLUS0, MAG_MINUS0, COS_PLUS0, COS_MINUS0, SIN_PLUS0, SIN_MINUS0, COS_IN0, SIN_IN0, MAG_PLUS1, MAG_MINUS1, COS_PLUS1, COS_MINUS1, SIN_PLUS1, SIN_MINUS1, COS_IN1, SIN_IN1, 4AN0 to 4AN7, AN0 to AN31 Notes When Writing Data in a Register Having the Status Flag When writing data in the register that has a status flag (especially, an interrupt request flag) to control function, take care not to clear its status flag erroneously. The program must be written not to clear the flag to the status bit, and to set the control bits to have the desired value. Especially, if multiple control bits are used, the bit instruction cannot be used. (The bit instruction can access to a single bit only.) The Byte, Half-word, or Word access must be used to write data in the control bits and status flag simultaneously. During this time, take care not to clear other bits (in this case, the bits of status flag) erroneously. Note: − These points can be ignored because the bit instructions already take the points into consideration for registers that are supported by bit-band unit. These points must be considered when using the bit instruction for registers that are not supported by bit-band unit. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 43 D a t a S h e e t 9. Block Diagram Debug I/F (JTAG) JTAG_SWCLKTCK JTAG Wakeup Debug Group (CoreSightTM) DAP Security Security APB-M APB-M APB-S APB-S AHB-M AHB-M CLK_DBG Debug APB AHB2APB (Priviledge Protection) APB-32 Trace Group CLK_PERI0 CLK_ATB AHB-32 ATB ATB CLK_ATB Core Group (2-Core) Security Checker ETB (Trace Buffer) Debug APB ETM #1 ETM #0 DMAC (ch.0 to 15) Processor CLK_CPU1 CLK_CPU0 CPU #1 TCRAM #1 B0TCM B1TCM #1 TCFLASH #1 Security CPU #0 CortexTM -R5F CortexTM -R5F MPU #1 I$ #1 ATCM #1 LLPP(AXI32-M) AXI-S D$ #1 MPU #0 I$ #0 D$ #0 AHB-64 B1TCM #0 CLK_DMA AHB-32 CLK_PERI0 TCFLASH Security #0 ATCM #0 AXI-M AXI-S LLPP(AXI32-M) AXI-M AHB-M TCRAM #0 B0TCM AXI2AHB AHB2AXI MPU AHB Exclusive Access Memory (EAM) AHB2AXI AXI-S High Performance Matrix (HPM) AXI-64 AXI2AHB AXI2AHB CLK_HPM AXI2AHB AXI2AHB AXI2AHB AHB-32 CLK_PERI5 BBU Mode control AHB-32 CLK_SYSC_PD1 Security BBU AHB-64 CLK_MEMC BBU CAN (ch.0 to 2) Security RST manage Protection MPU AHB (Config, Slave) CAN Prescaler DMAC (Config, Slave) PONR TPU#0 State CR Calibration Port Pin Config (Config, Slave) CRC (ch.0 to 1) CSV TPU#1 Fast-CR Resource Input Config (Config, Slave) GPIO Slow-CR LVD IRC #0 PLL Wakeup detect RAM AHB2APB IRC #1 Clock output APB-32 RAM CLK_PERI1 NMI distribution HW-WDT IPCU SW-WDT #0 Wakeup Request #0 MFS (ch.0 to 4) AHB2RBus RDC (unit 0) RDC (unit 1) DAC (ch.0) DAC (ch.1) WFG (unit0, ch.0 to 5) WFG (unit1, ch.6 to 11) 16-bit OCU (unit0 to 2, ch.0 to 5) 16-bit OCU (unit3 to 5, ch.6 to 11) 4ch-SH ADC (unit0, ch.0 to 3) 4ch-SH ADC (unit1, ch.4 to 7) MVA (unit 0) MVA (unit 1) 16-bit ICU (unit0 to 1, ch.0 to 3) 16-bit ICU (unit2 to 3, ch.4 to 7) 8/16bit UDC (ch.0 to 1) 8/16bit UDC (ch.2 to 3) 16-bit FRT for RDC (ch.18) 16-bit FRT for RDC (ch.19) 16-bit FRT (ch.0 to 5) 16-bit FRT (ch.6 to 11) CLK_PERI7 AHB2APB FlexRay/RDC Clock Control 32-bit ICU (unit0 to 2, ch.0 to 5) Clock Monitor 12-bit A/D Converter (ch.0 to 31) TCRAM #1 (Config, Slave) Memory & Config Group 16-bit FRT (ch.12 to 17) WFG (unit2 to 3, ch.12 to 23) 16-bit ICU (unit4 to 7, ch.8 to 14) 16-bit Base Timer [PWM/PPG/RLT/PWC] (ch.0 to 11) TCFLASH #1 (Config, Slave) MCU Config Group CLK_PERI6 16bit OCU (unit6 to 11, ch.12 to 23) TCFLASH #0 (Config, Slave) TCRAM #0 (Config, Slave) EXT-IRQ (NMI) Application Specific Peripheral Group A 32-bit FRT (ch.0 to 4) Wakeup Request #1 SW-WDT #1 BBU FlexRay (A+Bch) AHB-32 CLK_PERI0 BootROM Clock AHB-32 CLK_PERI4 Application Specific Peripheral Group B BBU RAM WorkFLASH #1 System Controller (SYSC) SCT WorkFLASH #0 Common Peripheral Group Application Specific Peripheral Group Resource Input Configuration PORT MUX (Port Pin Config) I/O Note: − 44 CONFIDENTIAL In the block diagram, block name (Config, Slave) describe bus connection for register setting of control block. MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Group Group Name Description Core Group − CPU and TCM connected memory group Debug Group − CoreSight of Debugging group MCU Config Group − System control and supervision IP group Memory & Config Group _ − CPU related function and memory group Common Peripheral Group − Common peripheral IP group for vehicle application Application Specific Peripheral Group − Product specified peripheral group Independent IP Name Description − Bus matrix of AXI − Bus bridge (AXI-to-AHB, AHB-to-AXI) DMAC − DMA controller EAM − Exclusive access memory Resource input configuration − Input selection circuit of MCU peripheral Port MUX − Port MUX circuit I/O − I/O circuit HPM Note: − Each master connects to HPM. Each master has different transaction ID on AXI, Out-Of-Order for transaction completion. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 45 D a t a S h e e t 10. Memory Map Address Start Block End Overview Function 64KB: 0x0000_FFFF 0x0000_0000 96KB: 0x0001_7FFF TCRAM 128KB: 0x0001_FFFF 0x0002_0000 0x0080_0000 0x0090_0000 0x00FE_0000 0x007F_FFFF Reserved 512KB: 0x0087_FFFF TCFLASH 768KB: 0x008B_FFFF large sector area 1024KB: 0x008F_FFFF (TCM connection) 0x00FD_FFFF 0x00FF_FFFF Memory (Each CPU exclusive space) 512KB: 0x0107_FFFF 0x0100_0000 Reserved TCFLASH small sector area (TCM connection) TCFLASH 768KB: 0x010B_FFFF large sector area 1024KB: 0x010F_FFFF (AXI connection) 0x0110_0000 0x01FD_FFFF Reserved 0x01FE_0000 0x01FF_FFFF small sector area 0x0200_0000 0x027F_FFFF Reserved TCFLASH (AXI connection) 0x0280_0000 0x0280_0FFF EAM 0x0280_1000 0x03FF_FFFF Reserved 64KB: 0x0400_FFFF 0x0400_0000 96KB: 0x0401_7FFF CPU0 space TCRAM 128KB: 0x0401_FFFF 0x0402_0000 0x047F_FFFF Reserved 0x0480_0000 768KB: 0x048B_FFFF large sector area 1024KB: 0x048F_FFFF (TCM connection) 512KB: 0x0487_FFFF CPU0 space TCFLASH 0x0490_0000 0x04FD_FFFF Reserved 0x04FE_0000 0x04FF_FFFF small sector area CPU0 space TCFLASH 512KB: 0x0507_FFFF 0x0500_0000 768KB: 0x050B_FFFF 1024KB: 0x050F_FFFF Memory (Common space) (TCM connection) CPU0 space TCFLASH large sector area (AXI connection) 0x0510_0000 0x05FD_FFFF Reserved 0x05FE_0000 0x05FF_FFFF small sector area CPU0 space TCFLASH (AXI connection) 64KB: 0x0600_FFFF 0x0600_0000 96KB: 0x0601_7FFF CPU1 space TCRAM 128KB: 0x0601_FFFF 0x0602_0000 0x067F_FFFF 512KB: 0x0687_FFFF 0x0680_0000 0x0690_0000 46 CONFIDENTIAL Reserved CPU1 space TCFLASH 768KB: 0x068B_FFFF large sector area 1024KB: 0x068F_FFFF (TCM connection) 0x06FD_FFFF Reserved MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Address Block Start End 0x06FE_0000 0x06FF_FFFF Overview Function CPU1 space TCFLASH small sector area (TCM connection) 512KB: 0x0707_FFFF 0x0700_0000 CPU1 space TCFLASH 768KB: 0x070B_FFFF large sector area 1024KB: 0x070F_FFFF (AXI connection) 0x0710_0000 0x07FD_FFFF Reserved 0x07FE_0000 0x07FF_FFFF small sector area CPU1 space TCFLASH (AXI connection) 0x0800_0000 0x0DFF_FFFF 0x0E00_0000 0x0E00_FFFF 0x0E01_0000 0x0E01_FFFF 0x0E02_0000 0x0E0F_FFFF 0x0E10_0000 0x0E10_FFFF 0x0E11_0000 0x0E11_FFFF 0x0E12_0000 0x0E1F_FFFF 0x0E20_0000 0x0E20_FFFF 0x0E21_0000 0x0E21_FFFF 0x0E22_0000 0x0FFF_FFFF 0x1000_0000 0x9FFF_FFFF 0xA000_0000 0xA1FF_FFFF 0xA200_0000 0xA27F_FFFF 0xA280_0000 0xA2FF_FFFF 0xA300_0000 0xA37F_FFFF Reserved WorkFLASH0 Memory mirror area 1 (Common space) WorkFLASH1 mirror area 1 Reserved WorkFLASH0 Reserved mirror area 2 WorkFLASH1 Reserved mirror area 2 Reserved WorkFLASH0 mirror area 3 WorkFLASH1 mirror area 3 Reserved Reserved Reserved Reserved Bit band alias area (Memory & Config Group) Reserved Bit band alias area (MCU Config Group) Bit band alias area 0xA380_0000 0xA47F_FFFF (Common Peripheral Bit band alias area 0xA480_0000 0xA7FF_FFFF 0xA800_0000 0xA87F_FFFF Group) Reserved Bit band alias area (Application Specific Peripheral Group A) Bit band alias area 0xA880_0000 0xA8FF_FFFF (Application Specific 0xA900_0000 0xAFFF_FFFF Reserved 0xB000_0000 0xBFFF_FFFF 0xC000_0000 0xEFFF_FFFF Peripheral Group B) 0xF000_0000 0xFFFE_DFFF 0xFFFE_E000 0xFFFE_FFFF 0xFFFF_0000 0xFFFF_FFFF May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL I/O area (Bit band area) Reserved I/O Reserved Reserved BootROM area Error Config BootROM 47 D a t a S h e e t Notes: − − − − − 48 CONFIDENTIAL Each CPU exclusive space define memory space for each CPU specified. The other master cannot access (Reserved area). If the other master access to each CPU exclusive space, access from common space. Reserved area access cause bus error. However, following access of reserved area will be not bus error. 0x0090_0000 to 0x00FD_FFFF 0x0110_0000 to 0x01FD_FFFF 0x0490_0000 to 0x04FD_FFFF 0x0510_0000 to 0x05FD_FFFF 0x0690_0000 to 0x06FD_FFFF 0x0710_0000 to 0x07FD_FFFF 0x1000_0000 to 0x1FFF_FFFF 0x2000_0000 to 0x2FFF_FFFF The following area should be set device attribution or strongly ordered attribution as core access. 1. I/O area 2. Bit band alias area 3. Error Config (BootROM area) 4. WorkFLASH (when program) 5. TCFLASH (when program) About device attribute and Strongly Ordered attribute, see "ARM®Architecture Reference Manual ARM®v7-A and ARM®v7-R edition (ARM DDI 0406B)". TCFLASH has a TCM-connected region and an AXI-connected region. AXI-connected region is dedicated for flash memory programming/erasing. When read operation in user mode, use TCM-connected region. MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 11. I/O Map I/O Address Map (HPM, etc.) Address Area Start End Overview 0xB000_0000 0xB03F_FFFF Reserved Function Reserved I/O Address Map (Memory & Config Group) Address End 0xB040_0000 0xB040_0FFF IRC0 0xB040_1000 0xB040_1FFF IRC1 0xB040_2000 0xB040_6FFF Reserved 0xB040_7000 0xB040_73FF NMI distributor 0xB040_7400 0xB040_7FFF Reserved Overview Function 0xB040_8000 0xB040_83FF TPU0 0xB040_8400 0xB040_8FFF Reserved 0xB040_9000 0xB040_93FF TPU1 0xB040_9400 0xB040_FFFF Reserved 0xB041_0000 0xB041_03FF Memory & Config Group TCRAM0 IF 0xB041_0400 0xB041_07FF 0xB041_0800 0xB041_0FFF Reserved 0xB041_1000 0xB041_13FF TCFLASH0 IF TCRAM1 IF 0xB041_1400 0xB041_17FF TCFLASH1 IF 0xB041_1800 0xB041_1FFF Reserved 0xB041_2000 0xB041_23FF WorkFLASH0 IF 0xB041_2400 0xB041_27FF WorkFLASH1 IF 0xB041_2800 0xB041_4FFF Reserved 0xB041_5000 0xB041_5FFF IPCU 0xB041_6000 0xB04F_FFFF Reserved May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL Area Start 49 D a t a S h e e t I/O Address Map (Debug Group) Address 50 CONFIDENTIAL Area Start End 0xB050_0000 0xB050_0FFF Overview DAPROM Function 0xB050_1000 0xB050_1FFF ETB 0xB050_2000 0xB050_2FFF CTI4 0xB050_3000 0xB050_3FFF TPIU 0xB050_4000 0xB050_4FFF TRACE_FUNNEL 0xB050_5000 0xB057_FFFF Reserved 0xB058_0000 0xB058_0FFF CORTEXROM0 0xB058_1000 0xB058_FFFF Reserved 0xB059_0000 0xB059_0FFF 0xB059_1000 0xB059_1FFF 0xB059_2000 0xB059_2FFF CORE1 0xB059_3000 0xB059_7FFF Reserved 0xB059_8000 0xB059_8FFF CTI0 0xB059_9000 0xB059_9FFF CTI1 0xB059_A000 0xB059_BFFF Reserved 0xB059_C000 0xB059_CFFF ETM0 0xB059_D000 0xB059_DFFF ETM1 0xB059_E000 0xB05F_FFFF Reserved Debug Group CORE0 Reserved MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t I/O Address Map (MCU Config Group) Address Area Start End 0xB060_0000 0xB060_07FF Overview SYSC Function 0xB060_0800 0xB060_0FFF MODEC 0xB060_1000 0xB060_7FFF Reserved 0xB060_8000 0xB060_83FF SW-WDT0 0xB060_8400 0xB060_8FFF 0xB060_9000 0xB060_93FF 0xB060_9400 0xB060_BFFF Reserved 0xB060_C000 0xB060_C3FF HW-WDT 0xB060_C400 0xB061_FFFF Reserved 0xB062_0000 0xB062_03FF EXT-IRQ 0xB062_0400 0xB06F_FFFF Reserved Reserved SW-WDT1 MCU Config Group I/O Address Map (Common Peripheral Group) Address End 0xB070_0000 0xB070_3FFF DMAC 0xB070_4000 0xB070_FFFF Reserved 0xB071_0000 0xB071_0FFF MPU AHB 0xB071_1000 0xB071_7FFF Reserved 0xB071_8000 0xB071_87FF CRC (ch.0 to 1) 0xB071_8800 0xB071_FFFF Reserved Overview Function CAN (ch.0 to 2) 0xB072_0000 0xB072_0BFF 0xB072_0C00 0xB072_7FFF 0xB072_8000 0xB072_83FF Common Peripheral Group 0xB072_8400 0xB072_FFFF (AHB32) 0xB073_0000 0xB073_03FF CR calibration 0xB073_0400 0xB073_7FFF Reserved 0xB073_8000 0xB073_8FFF GPIO 0xB073_9000 0xB073_FFFF Reserved 0xB074_0000 0xB074_3FFF PPC 0xB074_4000 0xB074_7FFF Reserved 0xB074_8000 0xB074_8FFF RIC 0xB074_9000 0xB07F_FFFF Reserved 0xB080_0000 0xB080_13FF MFS (ch.0 to 4) 0xB080_1400 0xB080_7FFF Reserved 0xB080_8000 0xB080_AFFF 0xB080_B000 0xB081_FFFF Common Peripheral Group 0xB082_0000 0xB082_13FF (APB) 0xB082_1400 0xB082_7FFF Reserved 0xB082_8000 0xB080_8BFF 32-bit ICU (ch.0 to 5) 0xB082_8C00 0xB08F_FFFF Reserved May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL Area Start Reserved CAN prescaler Reserved Base timer (ch.0 to 11) Reserved 32-bit FRT (ch.0 to 4) 51 D a t a S h e e t I/O Address Map (Product Specified Peripheral Bus) Address 52 CONFIDENTIAL Area Start End Overview 0xB090_0000 0xB0FF_FFFF Reserved 0xB100_0000 0xB100_00FF 16-bit FRT (ch.6 to 11) 0xB100_0100 0xB100_01FF 16-bit OCU (ch.6 to 11) 0xB100_0200 0xB100_02FF 16-bit ICU (ch.4 to 7) 0xB100_0300 0xB100_03FF 4ch-SH ADC (unit1) 0xB100_0400 0xB100_04FF 0xB100_0500 0xB100_05FF 0xB100_0600 0xB100_07FF 0xB100_0800 0xB100_09FF 0xB100_0A00 0xB100_0BFF Reserved 0xB100_0C00 0xB100_0CFF RDC (unit1) 0xB100_0D00 0xB100_0DFF DAC (ch.1) 0xB100_0E00 0xB100_0FFF Reserved 0xB101_0000 0xB101_00FF 16-bit FRT (ch.12 to 17) 0xB101_0100 0xB101_01FF 16-bit OCU (ch.12 to 23) 0xB101_0200 0xB101_02FF 0xB101_0300 0xB101_03FF Application Specific Reserved 0xB101_0400 0xB101_05FF Peripheral Group A 12-bit ADC (ch.0 to 31) 0xB101_0600 0xB101_06FF (APB) 0xB101_0700 0xB101_0FFF Reserved 0xB101_1000 0xB101_2FFF Other (WFG) 0xB101_3000 0xB101_3FFF 0xB101_4000 0xB1FF_FFFF 0xB200_0000 0xB200_00FF 16-bit FRT (ch.0 to 5) 0xB200_0100 0xB200_01FF 16-bit OCU (ch.0 to 5) 0xB200_0200 0xB200_02FF 16-bit ICU (ch.0 to 3) 0xB200_0300 0xB200_03FF 4ch-SH ADC (unit0) 0xB200_0400 0xB200_04FF WFG (ch.0 to 5) 0xB200_0500 0xB200_05FF 0xB200_0600 0xB200_07FF Application Specific Reserved 0xB200_0800 0xB200_09FF Peripheral Group B MVA (unit0) (AHB-32) Application Specific Peripheral Group A (AHB-32) Function Reserved WFG (ch.6 to 11) UDC (ch.2 to 3) Reserved MVA (unit1) 16-bit ICU (ch.8 to 14) WFG(ch.12 to 23) Other (ADC, CSV) Reserved Reserved UDC (ch.0 to 1) 0xB200_0A00 0xB200_0BFF 0xB200_0C00 0xB200_0CFF RDC (unit0) Reserved 0xB200_0D00 0xB200_0DFF DAC (ch.0) 0xB200_0E00 0xB200_0EFF Reserved 0xB200_0F00 0xB200_0FFF Reserved 0xB200_1000 0xB200_17FF FlexRay (ch.A/ch.B) 0xB200_1800 0xB200_FFFF Reserved 0xB201_0000 0xB201_00FF 0xB201_0100 0xB201_01FF 0xB201_0200 0xBFFF_FFFF Application Specific Peripheral Group B (R-Bus) Reserved FlexRay/RDC clock control Clock monitor Reserved MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t I/O address Map (Error Config) Address Area Start End 0xFFFE_E000 0xFFFE_E3FF Overview IRC0 (NMIVASBR) 0xFFFE_E400 0xFFFE_E7FF IRC1 (NMIVASBR) Error Config Function 0xFFFE_E800 0xFFFE_F7FF 0xFFFE_F800 0xFFFE_FBFF Reserved IRC (NMIVASBR) mirror* 0xFFFE_FC00 0xFFFE_FFFF BootROM IF *: CPU0 is IRC0, CPU1 is IRC1 able to access this area. The master of excepted CPU is reserved area. Notes: − − I/O address map shows maximum area for possibility. It depends on functions. The detail information, see each address map. It causes bus error to access to reserved area. However, following reserved area access is not generation of bus error. 0xB018_0000 to 0xB018_03FF 0xB05C_0000 to 0xB05C_0FFF 0xB05E_0000 to 0xB05E_03FF 0xB05E_0400 to 0xB05E_07FF 0xB05E_0800 to 0xB05E_0BFF 0xB05E_0C00 to 0xB05E_0FFF May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 53 D a t a S h e e t 12. Pin Statuses in CPU Status Pin Statuses (1/2) 54 CONFIDENTIAL P413/RX2/INT2 98 99 100 101 102 86 - P414/TX2 P415/TIOA4 P416/TIOB4 P417/TIOA5 P418/TIOB5 106 - 107 108 109 90 Hi-Z/Input blocked Last status retained*6 Last status retained Hi-Z/Input blocked Last status retained Hi-Z/Input blocked Analog output Analog output Analog output Analog output Analog output Analog input Analog input Analog input Analog input Analog input Analog input Analog output Analog output Analog output Analog output Analog output Analog output Analog input Analog input Analog input Analog input Analog input Analog input Analog output L Analog output L Analog output L H/L Analog output H/L Analog output L Analog input Analog input Analog input Analog input Analog input Analog output Analog output Analog output Analog output Analog output Analog output Hi-Z/Input blocked Last status retained*6 Input enabled Input enabled H/L L*5 Analog output L L*5 Analog output Analog input Hi-Z/Input blocked Hi-Z/Input blocked Input enabled H/L Hi-Z/Input blocked Hi-Z/Input blocked Last status retained Hi-Z/Input blocked Last status retained Hi-Z/Input blocked Input enabled Input enabled Input enabled - - - - - - Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled - - - - - - Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled Hi-Z/Input blocked Last status retained*6 Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Last status retained Hi-Z/Last status retained Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained Hi-Z/Input blocked*4 Hi-Z/Input blocked Hi-Z/Input blocked*4 Hi-Z/Input blocked Last status retained Hi-Z/Input blocked*4 Hi-Z/Input blocked Hi-Z/Input blocked*4 Hi-Z/Input blocked Hi-Z/Input blocked*4 Hi-Z/Input blocked*4 Hi-Z/Input blocked Hi-Z/Input blocked*4 Hi-Z/Input blocked Hi-Z/Input blocked*4 Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Last status retained Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained Hi-Z/Input blocked Hi-Z/Last status retained Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained P419/SIN2/INT5 P420/SOT2 P131/SCK2 P431/ERDS1 High impedance enabled (SYSC_SSPECFGR: PSSPADCTRL=1) 85 High impedance disabled (SYSC_SSPECFGR: PSSPADCTRL=0) 97 High impedance enabled (SYSC_SSPECFGR: PSSPADCTRL=1) P412/TX1 Watch mode High impedance disabled (SYSC_SSPECFGR: PSSPADCTRL=0) 84 Stop mode CPU sleep 96 After internal reset issuance (Before GPORT setting) P411/RX1/INT1 Hi-Z/Input blocked Internal reset issuance in progress P410/TX0 83 Hi-Z/ Input blocked After internal reset issuance (Before GPORT setting) 82 95 Internal reset issuance in progress 94 Internal reset issuance in progress P409/RX0/INT0 After internal reset issuance (Before GPORT setting) 81 Internal reset issuance in progress 93 Internal reset issuance in progress P407/SOT1 P408/SCK1 With control P406/SIN1/INT4 79 80 Without control 78 91 92 L*5 Hi-Z/ Last status retained Sleep mode With control 90 Hi-Z/ Input blocked After external factor releasing *7 P305/FRCK0 P306/FRCK1 P000/DTTI0/4ADTG0 P001/RTO0 P002/RTO1 P003/RTO2 P004/RTO3 P005/RTO4 P006/RTO5 P007/4AN0 P008/4AN1 P009/4AN2 P010/4AN3 P011/RDC_W0/ZIN0 P012/RDC_V0/BIN0 P013/RDC_U0/AIN0 P014/RDC_Z0/ZIN1 P015/RDC_B0/BIN1 P016/RDC_A0/AIN1 AREF20 SIN_IN0 COS_IN0 SIN_OUT0 SIN_MINUS0 SIN_PLUS0 COS_PLUS0 COS_MINUS0 COS_OUT0 RDC_ACT0/P026 MAG_MINUS0 MAG_PLUS0 MAG_OUT0 P430/ERDS0 P030/DTTI2/FRCK12 P031/RTO12/FRCK13 P309/RTO13/FRCK14 P310/RTO14/FRCK15 P311/RTO15/FRCK16 P312/RTO16/FRCK17 P313/RTO17 P314/DTTI3/TIOA0 P315/RTO18/TIOB0 P316/RTO19/TIOA1 P317/RTO20/TIOB1 P318/RTO21/TIOA2 P319/RTO22/TIOB2 P320/RTO23/TIOA3 P321/SIN0/INT3/TIOB3 P322/SOT0 P323/SCK0 P324/STOPWT/IN6/IN16 P325/RXDA/IN7/IN17 P326/TXDA/IN8/IN18 P327/TXENA/IN9/IN19 P328/RXDB/IN10/IN20 P329/TXDB/IN11/IN21 P330/TXENB/IN12 NMIX RSTX MD1 MD0 X0 X1 TRSTX TCK TDO TDI TMS nSRST With control 3 4 5 6 7 8 9 10 11 12 13 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 39 40 41 42 43 46 47 48 49 50 51 52 53 54 55 58 59 60 61 62 63 64 65 66 67 68 69 70 72 73 74 75 76 77 External factor generation in progress With control 3 4 5 6 7 8 9 10 11 14 15 16 17 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 43 44 45 46 47 48 49 50 51 55 56 57 58 59 60 61 62 63 64 65 66 67 70 71 72 73 74 75 76 77 78 79 80 81 82 84 85 86 87 88 89 Without control 176 pin With control Pin Name 208 pin GPORTEN control Pin No. Internal reset factor*3 External reset factor*2 Before internal reset issuance External reset factor*1 After external factor releasing External factor generation in progress Last status retained Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked*4 Hi-Z/Input blocked*4 Hi-Z/Input blocked Hi-Z/Input blocked MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Pin Statuses (2/2) Analog output Analog output Analog output Analog output Analog output Analog input Analog input Analog input Analog input Analog input L H/L Analog output H/L Analog output L Analog output H/L L*5 L L*5 Analog output H/L L Analog output High impedance enabled (SYSC_SSPECFGR: PSSPADCTRL=1) High impedance disabled (SYSC_SSPECFGR: PSSPADCTRL=0) Watch mode High impedance enabled (SYSC_SSPECFGR: PSSPADCTRL=1) Stop mode High impedance disabled (SYSC_SSPECFGR: PSSPADCTRL=0) CPU sleep 162 After internal reset issuance (Before GPORT setting) - Sleep Mode Internal reset issuance in progress 153 154 158 159 160 161 - Internal reset issuance in progress - L*5 Internal reset issuance in progress 152 MAG_OUT1 MAG_PLUS1 MAG_MINUS1 RDC_ACT1/P126 COS_OUT1 COS_MINUS1 COS_PLUS1 SIN_PLUS1 SIN_MINUS1 SIN_OUT1 COS_IN1 SIN_IN1 AREF21 P116/RDC_A1/AIN3 P115/RDC_B1/BIN3 P114/RDC_Z1/ZIN3 P113/RDC_U1/AIN2 P112/RDC_V1/BIN2 P111/RDC_W1/ZIN2 P110/4AN7 P109/4AN6 P108/4AN5 P107/4AN4 P106/RTO11 P105/RTO10 P104/RTO9 P103/RTO8 P102/RTO7 P101/RTO6 P100/DTTI1/4ADTG1 Internal reset factor*3 After external factor releasing External factor generation in progress Before internal reset issuance 91 92 93 94 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 120 121 122 123 124 125 126 127 128 129 130 After internal reset issuance (Before GPORT setting) 110 111 112 113 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 139 140 141 142 145 146 147 148 149 150 151 After external factor releasing Internal reset issuance in progress 176 pin Internal reset issuance in progress 208 pin GPORTEN control Pin Name External factor generation in progress External reset factor*2 After internal reset issuance (Before GPORT setting) External reset factor*1 Pin No. Analog output Analog input L L Analog output Analog input Analog input Analog input Analog input Analog input Analog input Analog output Analog output Analog output Analog output Analog output Analog output Analog input Analog input Analog input Analog input Analog input Analog input Analog output Analog output Analog output Analog output Analog output Analog output L Hi-Z/ Last status retained Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained Hi-Z/Input blocked Last status retained Hi-Z/Input blocked P421/SIN3/INT6/FRCK8 Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained Hi-Z/Input blocked*4 Last status retained Hi-Z/Input blocked*4 P422/SOT3/FRCK9/IN13 P423/SCK3/FRCK10/IN14 P425/TIOA8 P426/TIOB8 P427/TIOA9 P428/TIOB9 Hi-Z/ Last status retained Hi-Z/Input blocked Hi-Z/ Last status retained Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained Hi-Z/Input blocked Last status retained Hi-Z/Input blocked 134 P429/MONCLK/MM Hi-Z/Input blocked Hi-Z/ Last status retained Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained*8 Hi-Z/Input blocked Last status retained*8 Hi-Z/Input blocked 163 164 165 166 167 168 169 170 173 174 175 176 177 178 179 180 185 186 187 188 189 190 191 192 195 135 136 137 138 139 140 141 142 145 146 147 148 149 150 151 152 157 158 159 160 161 162 163 164 167 AN0/P200 AN1/P201 AN2/P202 AN3/P203 AN4/P204 AN5/P205 AN6/P206 AN7/P207 AN8/P208 AN9/P209 AN10/P210 AN11/P211 AN12/P212 AN13/P213 AN14/P214 AN15/P215 AN16/P216 AN17/P217 AN18/P218 AN19/P219 AN20/P220/TIOA6 AN21/P221/TIOB6 AN22/P222/TIOA7 AN23/P223/TIOB7 AN24/P224 Hi-Z/Input blocked Hi-Z/Last status retained Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained Hi-Z/Input blocked Last status retained Hi-Z/Input blocked 196 168 AN25/P225/SIN4/INT7 Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained Hi-Z/Input blocked*4 Last status retained Hi-Z/Input blocked*4 197 198 199 200 201 202 203 204 205 206 207 169 170 171 172 173 174 175 - AN26/P226/SOT4/IN0 AN27/P227/SCK4/IN1 AN28/P228/SCS40/IN2 AN29/P229/SCS41/IN3 AN30/P230/SCS42/IN4 AN31/P231/SCS43/IN5 P300/ADTG0 P301/TIOA10/FRCK4 P302/TIOB10/FRCK5 P303/TIOA11/FRCK6 P304/TIOB11/FRCK7 Hi-Z/Last status retained Hi-Z/Input blocked Hi-Z/Last status retained Hi-Z/Input blocked Hi-Z/Input blocked Hi-Z/Input blocked Last status retained*6 Last status retained Hi-Z/Input blocked Last status retained Hi-Z/Input blocked With control Hi-Z/Input blocked *1: Power-on reset, internal power supply low-voltage detection and NMIX + RSTX pin are factors. *2: External power supply low-voltage detection and external reset are factors. *3: Software reset and software/hardware watchdog reset are factors. *4: When external interrupt is valid, input blocked is invalid. *5: When I/O is initialized, "L" is output. *6: Operation is continued according to the peripheral function. *7: If GPORTEN bit is 0 and CPORTEN bit is 1, input is enabled. *8: When clock monitor output pin (MONCLK) is selected, pin state becomes high impedance. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 55 D a t a S h e e t 13. Electrical Characteristics 13.1 Absolute Maximum Ratings Parameter Symbol Power supply voltage*1, *2 VCC *1, *2 Rating Unit Min Max VSS-0.3 VSS+6.0 V Analog power supply voltage VDD VSS-0.3 VSS+1.8 V Analog reference voltage*1 AVCC VSS-0.3 VSS+6.0 V *1 Input voltage Analog pin input voltage*1 *1 RVCC VSS-0.3 VSS+6.0 V RVCC≤VCC VSS-0.3 VSS+6.0 V AVRH≤AVCC RVRH VSS-0.3 VSS+6.0 V RVRH≤RVCC VI VSS-0.3 VCC+0.3 V Analog pin input voltage*1 VIA VSS-0.3 VCC+0.3 V Output voltage*1 VO VSS-0.3 VCC+0.3 V Max total clamp current "L" level Max output current *3 "L" level average output current *4 "L" level total output current*5 "H" level Max output current*3 "H" level average output current*4 "H" level total output current *5 AVCC≤VCC AVRH Input voltage Max clamp current Remarks ICLAMP - 4 mA *8 Σ|ICLAMP| - 20 mA *8 IOL1 - 3.5 mA When setting to 1 mA*6 IOL2 - 7 mA When setting to 2 mA IOL3 - 14 mA When setting to 4 mA*7 IOLAV1 - 1 mA When setting to 1 mA*6 IOLAV2 - 2 mA When setting to 2 mA IOLAV3 - 4 mA When setting to 4 mA*7 ΣIOL - 40 mA *6 IOH1 - -3.5 mA When setting to 1 mA*6 IOH2 - -7 mA When setting to 2 mA IOH3 - -14 mA When setting to 4 mA*7 IOHAV1 - -1 mA When setting to1 mA*6 IOHAV2 - -2 mA When setting to 2 mA IOHAV3 - -4 mA When setting to 4 mA*7 ΣIOH - -40 mA *6 Power consumption PD - 1500 mW Operating temperature TA -40 +125 °C Storage temperature Tstg -55 +150 °C *9 *1: These parameters are based on the condition that VSS=AVSS=0.0V. *2: Caution must be taken that AVCC does not exceed VCC. *3: The maximum output current is defined as the value of the peak current flowing through any one of the corresponding pins. *4: The average output current is defined as the value of the average current flowing through any one of the corresponding pins for a 10 ms period. The average value is the operation current the operation ratio. *5: The total output current is defined as the maximum current value flowing through all of corresponding pins. *6: Corresponding pins: general-purpose ports *7: Corresponding pins: general-purpose ports of P325 to P330 *8: Corresponding pins: all general-purpose ports and analog input pin − − − 56 CONFIDENTIAL Use the devices within recommended operating conditions. Use the devices with direct voltage (current). The + B signal should always be applied by connecting a limiting resistor between the + B signal and the microcontroller. MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t − The value of the limiting resistor should be set so that the current input to the microcontroller pin does not exceed rated values at any time regardless of instantaneously or constantly when the + B signal is input. − Note that when the microcontroller drive current is low, such as in the low-power consumption modes, the + B input potential can increase the potential at the VCC pin via a protective diode, possibly affecting other devices. − Note that if the + B signal is input when the microcontroller is off (not fixed at 0V), since the power is supplied through the pin, the microcontroller may operate incompletely. − Note that if the +B signal is input at power-on, since the power is supplied through the pin, the power-on reset may not function in the power supply voltage. − Do not leave + B input pins open. Sample Recommended Circuit MB9D560 series Protective diode Limiting resistor current +B input(12 to 16V) *9: To use this product at TA=125°C, equip this on a multilayer board with four or more layers. To equip this on a single-layer board, change the operating conditions (operating frequency, power supply voltage, etc.) to use this at the power consumption PD=780mW or lower, or use this at TA=100°C or lower. Warning: − Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 57 D a t a S h e e t 13.2 Recommended Operating Conditions (VSS=AVSS-RVSS=0.0V) Parameter Symbol Power supply voltage * Smoothing capacitor Operating temperature Value Min Max Unit Remarks VCC 4.5 5.5 VDD 1.1 1.3 V Recommended operation AVCC 4.5 5.5 V guarantee range RVCC 4.5 5.5 V VCC 3.7 5.5 V VDD 1.09 1.3 V AVCC 3.7 5.5 V RVCC 3.7 5.5 V CREF 0.33 1.0 µF TA -40 +125 °C V Operation guarantee range Tolerance within ±40% * : For connection of smoothing capacitor CREF, see the figure below. − CREF pin connection Decoupling capacitor (0.01µF to 1µF) Wire MB9D560 series Pin AVRH0 AVRL0 CREF AVR0 AVSS0 AVCC0 It should be used smoothing capacitor for between AVR1 to AVRL1, RVR0 to RVRL0, RVR1 to RVRL1 as well. − CREF capacitor size and A/D converter activation time It depends on activation time of A/D converter with R/D converter and activation time of 4 channels same time sampling A/D converter by CREF capacitor seize. The computation expression of activation time is as follows. Activation time = 9 × CREF × 1.2k + 1μ [s] Activation time relate with following time from activation trigger, please use smoothing capacitor with system operation conditions. If A/D converter of 4 channels same time sampling, Set to "1" for ENBL bit of A/D enable setting register. If A/D converter with R/D converter, Set to "1" for RDCEN bit of operation control register 1. 58 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t Warning: − The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated under these conditions. − − Any use of semiconductor devices will be under their recommended operating condition. Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device failure. − No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you are considering application under any conditions other than listed herein, please contact sales representatives beforehand. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 59 D a t a S h e e t 13.3 DC Characteristics (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Conditions Value Unit Min Typ Max 0.7VCC - Vcc+0.3 V 0.8VCC - Vcc+0.3 V 0.7VCC - Vcc+0.3 V Remarks P000 to P016, P026, P030 to P031, P100 to P116, VIH1 P126, P131, P200 to P231, P300 toP306, When CMOS schmitt input level is selected P309 to P324, P406 to P423, P425 to P431 P000 to P016, P026, P030 to P031, "H" level input P100 to P116, voltage VIH2 P126, P131, P200 to P231, P300 to P306, When automotive input level is selected P309 to P330, P406 to P423, P425 to P431 When FlexRay input VIH3 P325 to P330 VIH4 RSTX, NMIX - 0.7VCC - Vcc+0.3 V VIH5 MD0, MD1 - 0.7VCC - Vcc+0.3 V - 2.3 - Vcc+0.3 V level is selected TRSTX, VIH6 TCK, TDI, TMS, nSRST 60 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Conditions Value Unit Min Typ Max VSS-0.3 - 0.3VCC V VSS-0.3 - 0.5VCC V VSS-0.3 - 0.3VCC V Remarks P000 to P016, P026, P030 to P031, P100 to P116, VIL1 P126, P131, P200 to P231, P300 toP306, When CMOS schmitt input level is selected P309 to P324, P406 to P423, P425 to P431 P000 to P016, P026, P030 to P031, "L" level input P100 to P116, voltage VIL2 P126, P131, P200 to P231, P300 to P306, When automotive input level is selected P309 to P330, P406 to P423, P425 to P431 When FlexRay input VIL3 P325 to P330 VIL4 RSTX, NMIX - VSS-0.3 - 0.3VCC V VIL5 MD0, MD1 - VSS-0.3 - 0.3VCC V VIL6 TCK, TDI, - VSS-0.3 - 0.8 V level is selected TRSTX, TMS, nSRST May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 61 D a t a S h e e t (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Conditions Value Unit Min Typ Max VCC-0.5 - VCC V VCC-0.5 - VCC V Remarks P000 to P016, P026, P030 to P031, P100 to P116, VOH1 P126, P131, VCC=4.5V P200 to P231, IOH=-2.0mA P300 toP306, P309 to P330, P406 to P423, P425 to P431 "H" level output VOH2 voltage P325 to P330 VCC=4.5V IOH=-4.0mA When FlexRay selected P000 to P016, P026, P030 to P031, P100 to P116, VOH3 P126, P131, VCC=4.5V P200 to P231, IOH=-1.0mA VCC-0.5 - VCC V VCC-0.5 - VCC V P300 toP306, P309 to P330, P406 to P423, P425 to P431 VOH4 62 CONFIDENTIAL TDO VCC=4.5V IOH=-5mA MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Conditions Value Unit Min Typ Max 0 - 0.4 V 0 - 0.4 V Remarks P000 to P016, P026, P030 to P031, P100 to P116, VOL1 P126, P131, VCC=4.5V P200 to P231, IOL=2.0mA P300 toP306, P309 to P330, P406 to P423, P425 to P431 "L" level output VOL2 voltage P325 to P330 VCC=4.5V IOL=4.0mA When FlexRay selected P000 to P016, P026, P030 to P031, P100 to P116, VOL3 P126, P131, VCC=4.5V P200 to P231, IOL=1.0mA 0 - 0.4 V 0 - 0.4 V P300 toP306, P309 to P330, P406 to P423, P425 to P431 VOL4 TDO May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL VCC=4.5V IOL=5mA 63 D a t a S h e e t (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Input leakage current Symbol Pin Name IIL All input pin RUP1 RSTX, NMIX Conditions VCC=AVCC=RVCC=5.5V VSS < VI < VCC - Value Unit Min Typ Max -5 - +5 µA 25 - 100 kΩ 25 - 100 kΩ - 5 15 pF Remarks P000 to P016, P026, P030 to P031, P100 to P116, Pull-up resistance RUP2 P126, P131, When pull-up P200 to P231, resistance is selected P300 to P306, P309 to P330, P406 to P423, P425 to P431 Other than Input capacitor CIN VCC, VSS, AVCC, AVSS, - RVCC, RVSS 64 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Value Conditions Min Typ Max Unit Remarks FCD0_CLK=200 MHz FCLK_CPUx=200 MHz, FCLK_TFCLKx=66 MHz, FCLK_HPMPD2=200 MHz, FCLK_DMA=200 MHz, Normal operations - 104 115 mA FCLK_MEMC=100 MHz, FCLK_WFCLKx=200 MHz, 200MHz FCLK_SYSCPD1=100 MHz, FCLK_PERIy=100 MHz, FCLK_PERIz=50 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 FCD0_CLK=160 MHz FCLK_CPUx=160 MHz, FCLK_TFCLKx=80 MHz, FCLK_HPMPD2=160 MHz, Normal FCLK_DMA=160 MHz, operations - 105 116 mA FCLK_MEMC=80 MHz, FCLK_WFCLKx=160 MHz, 160MHz FCLK_SYSCPD1=80 MHz, FCLK_PERIy=80 MHz, FCLK_PERIz=40 MHz Power supply current ICC5 x=0, 1 y=0, 4, 5 z=1, 6, 7 VCC5 FCD0_CLK=200 MHz FCLK_CPUx=200 MHz, FCLK_TFCLKx=66 MHz, FCLK_HPMPD2=200 MHz, FCLK_DMA=200 MHz, * Flash write/erase 200MHz - 115 126 mA FCLK_MEMC=100 MHz, FCLK_WFCLKx=200 MHz, FCLK_SYSCPD1=100 MHz, FCLK_PERIy=100 MHz, FCLK_PERIz=50 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 FCD0_CLK=160 MHz FCLK_CPUx=160 MHz, FCLK_TFCLKx=80 MHz, FCLK_HPMPD2=160 MHz, Flash write/erase* 160MHz FCLK_DMA=160 MHz, - 116 127 mA FCLK_MEMC=80 MHz, FCLK_WFCLKx=160 MHz, FCLK_SYSCPD1=80 MHz, FCLK_PERIy=80 MHz, FCLK_PERIz=40 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 *: This series has 2 types of flash; TCFLASH (4) and WorkFLASH (2); however, this is the specification when only one of those is written/erased. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 65 D a t a S h e e t (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Value Conditions Min Typ Max Unit Remarks FCD0_CLK=200 MHz FCLK_CPUx=200 MHz, FCLK_TFCLKx=66 MHz, FCLK_HPMPD2=200 MHz, FCLK_DMA=200 MHz, Normal operations - 310 510 mA FCLK_MEMC=100 MHz, FCLK_WFCLKx=200 MHz, 200MHz FCLK_SYSCPD1=100 MHz, FCLK_PERIy=100 MHz, FCLK_PERIz=50 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 FCD0_CLK=160 MHz FCLK_CPUx=160 MHz, FCLK_TFCLKx=80 MHz, FCLK_HPMPD2=160 MHz, Normal FCLK_DMA=160 MHz, operations - 290 490 mA FCLK_MEMC=80 MHz, FCLK_WFCLKx=160 MHz, 160MHz FCLK_SYSCPD1=80 MHz, FCLK_PERIy=80 MHz, FCLK_PERIz=40 MHz Power supply current ICC12 x=0, 1 y=0, 4, 5 z=1, 6, 7 VCC12 FCD0_CLK=200 MHz FCLK_CPUx=200 MHz, FCLK_TFCLKx=66 MHz, FCLK_HPMPD2=200 MHz, FCLK_DMA=200 MHz, * Flash write/erase 200MHz - 312 512 mA FCLK_MEMC=100 MHz, FCLK_WFCLKx=200 MHz, FCLK_SYSCPD1=100 MHz, FCLK_PERIy=100 MHz, FCLK_PERIz=50 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 FCD0_CLK=160 MHz FCLK_CPUx=160 MHz, FCLK_TFCLKx=80 MHz, FCLK_HPMPD2=160 MHz, Flash write/erase* 160MHz FCLK_DMA=160 MHz, - 292 492 mA FCLK_MEMC=80 MHz, FCLK_WFCLKx=160 MHz, FCLK_SYSCPD1=80 MHz, FCLK_PERIy=80 MHz, FCLK_PERIz=40 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 *: This series has 2 types of flash; TCFLASH (4) and WorkFlash (2); however, this is the specification when only one of those is written/erased. 66 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin name Conditions Value Min Typ Max Unit Remarks FCD0_CLK=200 MHz FCLK_CPUx=200 MHz, FCLK_TFCLKx=66 MHz, FCLK_HPMPD2=200 MHz, CPU sleep mode 200MHz FCLK_DMA=200 MHz, - 40 42 mA FCLK_MEMC=100 MHz, FCLK_WFCLKx=200 MHz, FCLK_SYSCPD1=100 MHz, FCLK_PERIy=100 MHz, FCLK_PERIz=50 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 ICCS5 Power supply FCD0_CLK=160 MHz FCLK_CPUx=160 MHz, VCC5 current FCLK_TFCLKx=80 MHz, FCLK_HPMPD2=160 MHz, CPU sleep mode 160MHz FCLK_DMA=160 MHz, - 30 32 mA FCLK_MEMC=80 MHz, FCLK_WFCLKx=160 MHz, FCLK_SYSCPD1=80 MHz, FCLK_PERIy=80 MHz, FCLK_PERIz=40 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 Watch mode, ICCT5 4MHz source - 390 1030 µA - 380 1010 µA oscillation ICCH5 May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL Stop mode When using crystal TA=25°C TA=25°C 67 D a t a S h e e t (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Conditions Value Min Typ Max Unit Remarks FCD0_CLK=200 MHz FCLK_CPUx=200 MHz, FCLK_TFCLKx=66 MHz, FCLK_HPMPD2=200 MHz, CPU sleep mode 200MHz FCLK_DMA=200 MHz, - 220 410 mA FCLK_MEMC=100 MHz, FCLK_WFCLKx=200 MHz, FCLK_SYSCPD1=100 MHz, FCLK_PERIy=100 MHz, FCLK_PERIz=50 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 ICCS12 Power supply FCD0_CLK=160 MHz FCLK_CPUx=160 MHz, VCC12 current FCLK_TFCLKx=80 MHz, FCLK_HPMPD2=160 MHz, CPU sleep mode 160MHz FCLK_DMA=160 MHz, - 180 360 mA FCLK_MEMC=80 MHz, FCLK_WFCLKx=160 MHz, FCLK_SYSCPD1=80 MHz, FCLK_PERIy=80 MHz, FCLK_PERIz=40 MHz x=0, 1 y=0, 4, 5 z=1, 6, 7 Watch mode, ICCT12 4MHz source - 1280 9730 µA - 860 9530 µA oscillation ICCH12 68 CONFIDENTIAL Stop mode When using crystal TA=25°C TA=25°C MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 13.4 AC Characteristics (1) Source Clock Timing (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol Pin Name Conditions FC X0, X1 tCYL Source oscillation clock frequency Source oscillation clock cycle time CAN PLL jitter (during lock) Built-in slow-CR oscillation frequency Built-in fast-CR oscillation frequency Value Unit Remarks Min Typ Max - 4 - 20 MHz X0, X1 - 50 - 250 ns tPJ - - -10 - +10 ns FCRS - - 50 100 150 kHz FCRF - - 4 8 12 MHz Without calibration 7.2 8 8.8 MHz With calibration − X0, X1 clock timing tCYL X0 − CAN PLL jitter Deviation time from the ideal clock is assured per cycle out of 20,000 cycles. t1 Ideal clock t2 t3 tn-1 tn Slow t1 PLL output t2 t3 tn-1 tn Fast May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 69 D a t a S h e e t (2) Internal Clock Timing (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Internal clock frequency Internal clock cycle time 70 CONFIDENTIAL Symbol Pin Name Conditions FCD0_CLK - - Value Min Typ Max 0 - 200 Unit MHz Remarks CD0_CLK FCD4_CLK - - 0 - 200 MHz CD4_CLK FCLK_CPU0 - - 0 - 200 MHz CLK_CPU0 FCLK_CPU1 - - 0 - 200 MHz CLK_CPU1 FCLK_TFCLK0 - - 0 - 80 MHz CLK_TFCLK0 FCLK_TFCLK1 - - 0 - 80 MHz CLK_TFCLK1 FCLK_ATB - - 0 - 100 MHz CLK_ATB FCLK_DBG - - 0 - 50 MHz CLK_DBG FCLK_HPMPD2 - - 0 - 200 MHz CLK_HPMPD2 CLK_DMA FCLK_DMA - - 0 - 200 MHz FCLK_MEMC - - 0 - 200 MHz CLK_MEMC FCLK_WFCLK0 - - 0 - 80 MHz CLK_WFCLK0 FCLK_WFCLK1 - - 0 - 80 MHz CLK_WFCLK1 FCLK_SYSCPD1 - - 0 - 100 MHz CLK_SYSCPD1 FCLK_PERI0 - - 0 - 100 MHz CLK_PERI0 FCLK_PERI1 - - 0 - 50 MHz CLK_PERI1 FCLK_PERI4 - - 0 - 100 MHz CLK_PERI4 FCLK_PERI5 - - 0 - 100 MHz CLK_PERI5 FCLK_PERI6 - - 0 - 50 MHz CLK_PERI6 FCLK_PERI7 - - 0 - 50 MHz CLK_PERI7 FCLK_CLKO - - 0 - 200 MHz tCD0_CLK - - 5 - - ns CLK_CLKO CD0_CLK tCD4_CLK - - 5 - - ns CD4_CLK tCLK_CPU0 - - 5 - - ns CLK_CPU0 tCLK_CPU1 - - 5 - - ns CLK_CPU1 tCLK_TFCLK0 - - 12.5 - - ns CLK_TFCLK0 tCLK_TFCLK1 - - 12.5 - - ns CLK_TFCLK1 tCLK_ATB - - 10 - - ns CLK_ATB tCLK_DBG - - 20 - - ns CLK_DBG tCLK_HPMPD2 - - 5 - - ns CLK_HPMPD2 CLK_DMA tCLK_DMA - - 5 - - ns tCLK_MEMC - - 5 - - ns CLK_MEMC tCLK_WFCLK0 - - 12.5 - - ns CLK_WFCLK0 CLK_WFCLK1 tCLK_WFCLK1 - - 12.5 - - ns tCLK_SYSCPD1 - - 10 - - ns CLK_SYSCPD1 tCLK_PERI0 - - 10 - - ns CLK_PERI0 tCLK_PERI1 - - 20 - - ns CLK_PERI1 tCLK_PERI4 - - 10 - - ns CLK_PERI4 tCLK_PERI5 - - 10 - - ns CLK_PERI5 tCLK_PERI6 - - 20 - - ns CLK_PERI6 tCLK_PERI7 - - 20 - - ns CLK_PERI7 tCLK_CLKO - - 5 - - ns CLK_CLKO MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t − Guaranteed operation range Internal operation clock frequency vs. Power supply voltage Recommended guaranteed operation range: Power supply voltage VCC (V) PLL guaranteed operation range: 5.5 Guaranteed operation range: 4.5 Power supply voltage VDD (V) 3.7 1.3 1.1 1.09 2 4 200 Internal operation clock frequency FCD0_CLK(MHz) Note: The CPU will be reset at the power supply voltage of the low-voltage detection setting voltage or less. − Oscillation clock frequency vs. Internal operation clock frequency Oscillation Clock Frequency Main Clock PLL Multiplying PLL Output Divider Setting Setting 100 2 200 MHz 200 MHz PLL Clock 4 MHz 4 MHz 8 MHz 8 MHz 50 2 8 MHz 4 MHz 100 2 200 MHz 16 MHz 16 MHz 25 2 200 MHz 16 MHz 8 MHz 50 2 200 MHz − Example of oscillation circuit X0 X1 R C1 C2 Note: when configuring the oscillator circuit, it is recommended to ask matching evaluation of the circuit to oscillator manufacturers for the design. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 71 D a t a S h e e t AC characteristics are specified by the following measurement reference voltage values. Input signal waveform Hysteresis input pin (Automotive) Output signal waveform Output pin 0.8Vcc 2.4V 0.5Vcc 0.8V Hysteresis input pin (CMOS schmitt) 0.7Vcc 0.3Vcc Hysteresis input pin (FlexRay) 0.7Vcc 0.3Vcc Hysteresis input pin (TTL) 2.0V 0.8V 72 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (3) Reset Input (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Reset input time Width for reset input removal Symbol Pin Name Conditions tRSTL RSTX - Value Unit Min Max 10 - µs 1 - µs Remarks tRSTL RSTX 0.2Vcc May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 0.2Vcc 73 D a t a S h e e t (4) Power-on Conditions Parameter (TA: Recommended operating conditions, VSS=0.0V) Symbol Pin Name Conditions Level detection - VCC5 voltage - Level detection - hysteresis width - Level detection time Power-on time Power-off time Value Unit Remarks V When turning 0.7 V on power 150 mV During mV voltage drop *1 Min Typ Max - 2.0 2.2 2.4 VCC12 - 0.4 - VCC5 - - - VCC12 - - - 50 - - - - - 30 µs tR5 VCC5 - 0.11 - 30 ms tR12 VCC12 - 0.05 - 0.6 ms tOFF VCC5 - 1 - - ms *2 *1: If the fluctuation of the power supply is faster than the low-voltage detection time, there is the possibility to generate or release after the power supply voltage has exceeded the detection voltage range. *2: This time is to start the slope detection at next power on after power down and internal charge loss. − Power-on , Power-off sequence 2.0V VCC5 0.2Vcc tR5 0.2Vcc tOFF 1.1V VCC12 tR12 NMIX + RSTX Notes: 74 CONFIDENTIAL − Power supply input procedure Power supply should input same time VCC5 and VCC12, or VCC5 to up step. Also, when power supply input, VCC12 is not over voltage of VCC5. − Power supply shutdown procedure Power supply should shutdown same time VCC5 and VCC12, or VCC12 to up step. Also, when power supply shutdown, VCC12 is not over voltage of VCC5. − Notes: When power supply input and power supply shutdown When power supply input, power supply voltage until achieve to recommend operation guarantee area, same time input for NMIX pin + RSTX pin. When power supply shutdown, power supply voltage until achieve to recommend operation guarantee area, same time input for NMIX pin + RSTX pin. MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (5) Multi-Function Serial Interface (5-1) CSIO Timing (SMR:MD[2:0]=0b010) (5-1-1) Normal Synchronous Transfer (SCR:SPI=0) and Serial Clock Output Signal Detect Level "H" (SMR:SCINV=0) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol Pin Name Serial clock cycle time tSCYC SCK0 to SCK4 SCK↓→SOT tSLOVI delay time Valid SIN→SCK↑ tIVSHI setup time SCK↑→Valid SIN tSHIXI hold time Serial clock "H" pulse SCK0 to SCK4, SOT0 to SOT4 SCK0 to SCK4, SIN0 to SIN4 Conditions Unit Max 4tCLK_PERI1 - ns -30 +30 ns 30 - ns 0 - ns tCLK_PERI1+10 - ns 2tCLK_PERI1-10 - ns - 30 ns 10 - ns 20 - ns Remarks Master mode (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, IOL=-1mA, IOH=1mA) tSHSL width Value Min SCK0 to SCK4 Serial clock "L" pulse tSLSH width SCK↓→SOT tSLOVE delay time Valid SIN→SCK↑ tIVSHE setup time SCK↑→Valid SIN tSHIXE hold time SCK0 to SCK4, SOT0 to SOT4 SCK0 to SCK4, SIN0 to SIN4 Slave mode (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, IOL=-1mA, IOH=1mA) SCK fall time tF SCK0 to SCK4 - 5 ns SCK rise time tR SCK0 to SCK4 - 5 ns - - - 5 Mbps - - - 6 Mbps Transfer speed CL=50pF, IOL=-2mA, IOH=2mA CL=20pF, IOL=-1mA, IOH=1mA Notes: − − − This is the AC characteristic in CLK synchronized mode. CL is the load capacitance applied to pins during testing. The maximum baud rate is limited by the internal operation clock used and other parameters. See Hardware Manual for details. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 75 D a t a S h e e t tSCYC VOH SCK VOL tSLOVI VOH VOL SOT tSHIXI tIVSHI VIH VIL SIN VIH VIL Master mode tSHSL tSLSH SCK VIH tF SOT VIL VIL tR tSLOVE VOH VOL tIVSHE SIN VIH VIH VIH VIL tSHIXE VIH VIL Slave mode 76 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (5-1-2) Normal Synchronous Transfer (SCR:SPI=0) and Serial Clock Output Signal Detect Level "L" (SMR:SCINV=1) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol Pin Name Serial clock cycle time tSCYC SCK0 to SCK4 SCK↑→SOT tSHOVI delay time Valid SIN→SCK↓ tIVSLI setup time SCK↓→valid SIN tSLIXI hold time Serial clock "H" pulse SCK0 to SCK4, SOT0 to SOT4 SCK0 to SCK4, SIN0 to SIN4 Conditions Unit Max 4tCLK_PERI1 - ns -30 +30 ns 30 - ns 0 - ns tCLK_PERI1+10 - ns 2tCLK_PERI1-10 - ns - 30 ns 10 - ns 20 - ns Remarks Master mode (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, IOL=-1mA, IOH=1mA) tSHSL width Value Min SCK0 to SCK4 Serial clock "L" pulse tSLSH width SCK↑→SOT tSHOVE delay time valid SIN→SCK↓ tIVSLE setup time SCK↓→valid SIN tSLIXE hold time SCK0 to SCK4, SOT0 to SOT4 SCK0 to SCK4, SIN0 to SIN4 Slave mode (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, IOL=-1mA, IOH=1mA) SCK fall time tF SCK0 to SCK4 - 5 ns SCK rise time tR SCK0 to SCK4 - 5 ns - - - 5 Mbps - - - 6 Mbps Transfer speed CL=50pF, IOL=-2mA, IOH=2mA CL=20pF, IOL=-1mA, IOH=1mA Notes: − − − This is the AC characteristic in CLK synchronized mode. CL is the load capacitance applied to pins during testing. The maximum baud rate is limited by the internal operation clock used and other parameters. See Hardware Manual for details. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 77 D a t a S h e e t tSCYC VOH SCK VOL tSHOVI VOH VOL SOT tIVSLI tSLIXI VIH SIN VIH VIL VIL Master mode tSLSH tSHSL SCK VIH VIL tR SOT VIH tF tSHOVE VOH VOL tIVSLE SIN VIL VIL VIH VIL tSLIXE VIH VIL Slave mode 78 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (5-1-3) SPI Compatible (SCR:SPI=1) and Serial Clock Output Signal Detect Level "H" (SMR:SCINV=0) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol Pin Name Serial clock cycle time tSCYC SCK0 to SCK4 SCK↑→SOT tSHOVI delay time Valid SIN→SCK↓ tIVSLI setup time SCK↓→valid SIN tSLIXI hold time SOT→SCK↓ tSOVLI delay time Serial clock "H" pulse SCK0 to SCK4, SOT0 to SOT4 SCK0 to SCK4, SIN0 to SIN4 Conditions Master mode Unit Min Max 4tCLK_PERI1 - ns -30 +30 ns 30 - ns 0 - ns 2tCLK_PERI1-30 - ns tCLK_PERI1+10 - ns 2tCLK_PERI1-10 - ns - 30 ns 10 - ns 20 - ns Remarks (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, IOL=-1mA, IOH=1mA) SCK0 to SCK4, SOT0 to SOT4 tSHSL width Value SCK0 to SCK4 Serial clock "L" pulse tSLSH width SCK↑→SOT tSHOVE delay time valid SIN→SCK↓ tIVSLE setup time SCK↓→valid SIN tSLIXE hold time SCK0 to SCK4, SOT0 to SOT4 SCK0 to SCK4, SIN0 to SIN4 Slave mode (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, IOL=-1mA, IOH=1mA) SCK fall time tF SCK0 to SCK4 - 5 ns SCK rise time tR SCK0 to SCK4 - 5 ns - - - 5 Mbps - - - 6 Mbps Transfer speed CL=50pF, IOL=-2mA, IOH=2mA CL=20pF, IOL=-1mA, IOH=1mA Notes: − − − This is the AC characteristic in CLK synchronized mode. CL is the load capacitance applied to pins during testing. The maximum baud rate is limited by the internal operation clock used and other parameters. See Hardware Manual for details. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 79 D a t a S h e e t tSCYC VOH SCK VOL tSOVLI VOH VOL SOT VOH VOL tSLIXI tIVSLI VIH VIL SIN VOL tSHOVI VIH VIL Master mode tSHSL tSLSH VIH SCK tF * SOT VIL VOH VIH VIH VIL tSHOVE VOH VOL VOL tIVSLE SIN VIL tR tSLIXE VIH VIL VIH VIL *: Changes when writing to TDR register Slave mode 80 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (5-1-4) SPI Compatible (SCR:SPI=1) and Serial Clock Output Signal Detect Level "L" (SMR:SCINV=1) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol Pin Name Serial clock cycle time tSCYC SCK0 to SCK4 SCK↓→SOT tSLOVI delay time Valid SIN→SCK↑ tIVSHI setup time SCK↑→valid SIN tSHIXI hold time SOT→SCK↑ tSOVHI Delay time Serial clock "H" pulse tSHSL width Serial clock "L" pulse tSLSH width SCK↓→SOT tSLOVE delay time valid SIN→SCK↑ tIVSHE setup time SCK↑→valid SIN tSHIXE hold time SCK0 to SCK4, SOT0 to SOT4 SCK0 to SCK4, SIN0 to SIN4 Conditions Master mode IOL=-1mA, IOH=1mA) SCK0 to SCK4, SOT0 to SOT4 SCK0 to SCK4, SIN0 to SIN4 Max 4tCLK_PERI1 - ns -30 +30 ns 30 - ns 0 - ns 2tCLK_PERI1-30 - ns tCLK_PERI1+10 - ns 2tCLK_PERI1-10 - ns - 30 ns 10 - ns 20 - ns Slave mode (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, IOL=-1mA, IOH=1mA) SCK fall time tF SCK0 to SCK4 - 5 ns SCK rise time tR SCK0 to SCK4 - 5 ns - - - 5 Mbps - - - 6 Mbps Transfer speed Remarks (CL=20pF, SOT0 to SOT4 SOT0 to SOT4 Unit Min (CL=50pF, IOL=-2mA, IOH=2mA), SCK0 to SCK4, SCK0 to SCK4, Value CL=50pF, IOL=-2mA, IOH=2mA CL=20pF, IOL=-1mA, IOH=1mA Notes: − − − This is the AC characteristic in CLK synchronized mode. CL is the load capacitance applied to pins during testing. The maximum baud rate is limited by the internal operation clock used and other parameters. See Hardware Manual for details. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 81 D a t a S h e e t t SCYC VOH VOH SCK VOL t SOVHI t SLOVI VOH VOL SOT VOH VOL t IVSHI t SHIXI VIH VIL SIN VIH VIL Master mode t SHSL SCK VIL tR * SOT VIH VIH tF VOH VOL VIL VIL VIH t SLOVE VOH VOL t IVSHE SIN t SLSH VIH VIL t SHIXE VIH VIL *: Changes when writing to TDR register Slave mode 82 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (5-1-5) When the Serial Chip Select is Used (SCSCR:CSEN=1) − Serial clock output signal detect level "H" (SMR, SCSFR:SCINV=0) − Serial chip select inactive level "H" (SCSCR, SCSFR:CSLVL=1) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol SCS↓→SCK↓ tCSSI setup time SCK↑→SCS↑ tCSHI hold time Pin Name SCK4, SCS40 to SCS43 Conditions Master mode tCSDI SCS↓→SCK↓ tCSSE setup time SCK↑→SCS↑ tCSHE hold time SCS40 to SCS43 IOL=-1mA, IOH=1mA) SCK4, SCS40 to SCS43 Unit Max tCSSU*1-50 - ns tCSHD*2+0 - ns - ns 3tCLK_PERI1+30 - ns 0 - ns 3tCLK_PERI1+30 - ns - 40 ns 0 - ns Remarks (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, SCS deselect time Value Min Slave mode tCSDS*3-50 +5 tCLK_PERI1 (CL=50pF, SCS deselect time tCSDE SCS40 to SCS43 IOL=-2mA, IOH=2mA), (CL=20pF, SCS↓→SOT tDSE delay time SCS↑→SOT tDEE delay time SCS40 to SCS43, IOL=-1mA, IOH=1mA) SOT4 Master mode, Round operation SCK↓→SCS↓ tSCC clock switch time SCK4, (CL=50pF, SCS40 to SCS43 IOL=-2mA, IOH=2mA), 3tCLK_PERI1+0 3tCLK_PERI1 +50 ns (CL=20pF, IOL=-1mA, IOH=1mA) - - - - Transfer speed CL=50pF, IOL=-2mA, IOH=2mA CL=20pF, IOL=-1mA, IOH=1mA - 5 Mbps - 6 Mbps *1: tCSSU =SCSTR:CSSU[7:0] serial chip select timing operation clock *2: tCSHD=SCSTR:CSHD[7:0] serial chip select timing operation clock *3: tCSDS=SCSTR:CSDS[15:0] serial chip select timing operation clock For details of *1, *2 and *3 above, see Hardware Manual. Notes: − − − This is the AC characteristic in CLK synchronized mode. CL is the load capacitance applied to pins during testing. The maximum baud rate is limited by the internal operation clock used and other parameters. See Hardware Manual for details. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 83 D a t a S h e e t VOH SCS output VOL VOL t CSHI t CSSI SCK output VOH t CSDI VOH VOL SOT (Normal Sync transfer) SOT (SPI compatible) Master mode VIH SCS input VIL VIL t CSHE t CSSE VIH SCK input SOT (Normal Sync transfer) t CSDE t DEE VOL t DSE SOT (SPI compatible) VIH VOH VOL Slave mode SCSx output t SCC SCSy output SCK output VOL VOL Clock switching example by master mode round operation (x, y = 40, 41, 42, 43: x and y are d ifferent value) 84 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (5-1-6) When the Serial Chip Select is Used (SCSCR:CSEN=1) − Serial clock output signal detect level "L"(SMR, SCSFR:SCINV=1) − Serial chip select inactive level "H"(SCSCR, SCSFR:CSLVL=1) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol SCS↓→SCK↑ tCSSI setup time SCK↓→SCS↑ tCSHI hold time Pin Name SCK4, SCS40 to SCS43 Conditions Master mode tCSDI SCS↓→SCK↑ tCSSE setup time SCK↓→SCS↑ tCSHE hold time SCS deselect time tCSDE SCS↓→SOT tDSE delay time SCS↑→SOT tDEE delay time SCS40 to SCS43 IOL=-2mA, IOH=2mA), IOL=-1mA, IOH=1mA) SCK4, SCS40 to SCS43 Slave mode (CL=50pF, SCS40 to SCS43 IOL=-2mA, IOH=2mA), (CL=20pF, SCS40 to SCS43, Unit Max tCSSU*1-50 - ns tCSHD*2+0 - ns - ns 3tCLK_PERI1+30 - ns 0 - ns 3tCLK_PERI1+30 - ns - 40 ns 0 - ns 3tCLK_PERI1+0 3tCLK_PERI1+50 ns - 5 Mbps - 6 Mbps Remarks (CL=50pF, (CL=20pF, SCS deselect time Value Min IOL=-1mA, IOH=1mA) SOT4 tCSDS*3-50 +5tCLK_PERI1 Master mode, Round operation SCK↑→SCS↓ tSCC clock switch time SCK4, (CL=50pF, SCS40 to SCS43 IOL=-2mA, IOH=2mA), (CL=20pF, IOL=-1mA, IOH=1mA) - - - - Transfer speed CL=50pF, IOL=-2mA, IOH=2mA CL=20pF, IOL=-1mA, IOH=1mA *1: tCSSU =SCSTR:CSSU[7:0] serial Chip select timing operation clock *2: tCSHD=SCSTR:CSHD[7:0] serial Chip select timing operation clock *3: tCSDS=SCSTR:CSDS[15:0] serial Chip select timing operation clock For details of *1, *2 and *3 above, see Hardware Manual. Notes: − − − This is the AC characteristic in CLK synchronized mode. CL is the load capacitance applied to pins during testing. The maximum baud rate is limited by the internal operation clock used and other parameters. See Hardware Manual for details. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 85 D a t a S h e e t SCS output VOH VOL t CSHI VOL t CSSI VOH t CSDI VOH SCK output VOL SOT (Normal Sync transfer) SOT (SPI compatible) Master mode VIH SCS input VIL t CSHE VIL t CSSE VIH t CSDE VIH SCK input VIL SOT (Normal Sync transfer) VOL t DSE SOT (SPI compatible) t DEE VOH VOL Slave mode SCSx output t SCC SCSy output SCK output VOL VOH Clock switching example by master mode round operation (x, y = 40, 41, 42, 43: x and y are different value) 86 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (5-1-7) When the Serial Chip Select is Used (SCSCR:CSEN=1) − Serial clock output signal detect level "H"(SMR, SCSFR:SCINV=0) − Serial Chip select inactive level "L"(SCSCR, SCSFR:CSLVL=0) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol SCS↑→SCK↓ tCSSI setup time SCK↑→SCS↓ tCSHI hold time Pin Name SCK4, SCS40 to SCS43 Conditions Master mode tCSDI SCS↑→SCK↓ tCSSE setup time SCK↑→SCS↓ tCSHE hold time SCS40 to SCS43 IOL=-1mA, IOH=1mA) SCK4, SCS40 to SCS43 Unit Max tCSSU*1-50 - ns tCSHD*2+0 - ns - ns 3tCLK_PERI1+30 - ns 0 - ns 3tCLK_PERI1+30 - ns - 40 ns 0 - ns Remarks (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, SCS deselect time Value Min Slave mode tCSDS*3-50 +5tCLK_PERI1 (CL=50pF, SCS deselect time tCSDE SCS40 to SCS43 IOL=-2mA, IOH=2mA), (CL=20pF, SCS↑→SOT tDSE delay time SCS↓→SOT tDEE delay time SCS40 to SCS43, IOL=-1mA, IOH=1mA) SOT4 Master mode, round operation SCK↓→SCS↑ tSCC clock switch time SCK4, (CL=50pF, SCS40 to SCS43 IOL=-2mA,IOH=2mA), 3tCLK_PERI1+0 3tCLK_PERI1 +50 ns (CL=20pF, IOL=-1mA, IOH=1mA) - - - - Transfer speed CL=50pF, IOL=-2mA, IOH=2mA CL=20pF, IOL=-1mA, IOH=1mA - 5 Mbps - 6 Mbps *1: tCSSU =SCSTR:CSSU[7:0] serial chip select timing operation clock *2: tCSHD=SCSTR:CSHD[7:0] serial chip select timing operation clock *3: tCSDS=SCSTR:CSDS[15:0] serial chip select timing operation clock For details of *1, *2 and *3 above, see Hardware Manual. Notes: − − − This is the AC characteristic in CLK synchronized mode. CL is the load capacitance applied to pins during testing. The maximum baud rate is limited by the internal operation clock used and other parameters. See Hardware Manual for details. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 87 D a t a S h e e t SCS output VOH VOH VOL t CSHI t CSSI SCK output t CSDI VOH VOL SOT (Normal Sync transfer) SOT (SPI compatible) Master mode SCS input VIH VIH VIH SCK input SOT (SPI compatible) VIL t CSHE t CSSE SOT (Normal Sync transfer) t CSDE VIL t DEE VOL t DSE VOH VOL Slvae mode SCSx output t SCC VOH SCSy output SCK output VOL Clock switching example by master mode round operation (x, y = 40, 41, 42, 43: x and y are different value) 88 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (5-1-8) When the Serial Chip Select is Used (SCSCR:CSEN=1) − Serial clock output signal detect level "L"(SMR, SCSFR:SCINV=1) − Serial Chip select inactive level "L"(SCSCR, SCSFR:CSLVL=0) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol SCS↑→SCK↑ tCSSI setup time SCK↓→SCS↓ tCSHI hold time Pin Name SCK4, SCS40 to SCS43 Conditions Master mode tCSDI SCS↑→SCK↑ tCSSE setup time SCK↓→SCS↓ tCSHE hold time SCS40 to SCS43 IOL=-1mA, IOH=1mA) SCK4, SCS40 to SCS43 Unit Max tCSSU*1-50 - ns tCSHD*2+0 - ns - ns 3tCLK_PERI1+30 - ns 0 - ns 3tCLK_PERI1+30 - ns - 40 ns 0 - ns Remarks (CL=50pF, IOL=-2mA, IOH=2mA), (CL=20pF, SCS deselect t time Value Min Slave mode tCSDS*3-50 +5tCLK_PERI1 (CL=50pF, SCS deselect time tCSDE SCS40 to SCS43 IOL=-2mA, IOH=2mA), (CL=20pF, SCS↑→SOT tDSE delay time SCS↓→SOT tDEE delay time SCS40 to SCS43, IOL=-1mA, IOH=1mA) SOT4 Master mode, Round operation SCK↑→SCS↑ tSCC clock switch time SCK4, (CL=50pF, SCS40 to SCS43 IOL=-2mA,IOH=2mA), 3tCLK_PERI1+0 3tCLK_PERI1 +50 ns (CL=20pF, IOL=-1mA, IOH=1mA) - - - - Transfer speed CL=50pF, IOL=-2mA, IOH=2mA CL=20pF, IOL=-1mA, IOH=1mA - 5 Mbps - 6 Mbps *1: tCSSU =SCSTR:CSSU[7:0] serial chip select timing operation clock *2: tCSHD=SCSTR:CSHD[7:0] serial chip select timing operation clock *3: tCSDS=SCSTR:CSDS[15:0] serial chip select timing operation clock For details of *1, *2 and *3 above, see Hardware Manual. Notes: − − − This is the AC characteristic in CLK synchronized mode. CL is the load capacitance applied to pins during testing. The maximum baud rate is limited by the internal operation clock used and other parameters. See Hardware Manual for details. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 89 D a t a S h e e t SCS output t CSDI VOH VOH VOL t CSHI t CSSI VOH SCK output VOL SOT (Normal Sync transfer) SOT (SPI compatible) Master mode SCS input t CSDE VIH VIH t CSHE t CSSE VIH SCK input SOT (Normal Sync transfer) SOT (SPI compatible) VIL VIL VIL t DEE VOL t DSE VOH VOL Slave mode SCSx output t SCC VOH SCSy output SCK output VOH Clock switching example by master mode round operation (x, y = 40, 41, 42, 43: x and y are different value) 90 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (5-2) UART (Async Serial Interface) Timing (SMR:MD[2:0]=0b000, 0b001) (5-2-1) When the External Clock is Selected (BGR:EXT=1) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol serial clock "L" pulse width serial clock "H" pulse width Pin Name Value Conditions tSLSH (CL=50pF, tSHSL SCK0 to SCK4 SCK fall time tF SCK rise time tR Max tCLK_PERI1+10 - ns tCLK_PERI1+10 - ns - 5 ns - 5 ns (CL=20pF, IOL=-1mA, IOH=1mA) tR SCK IOL=-2mA, IOH=2mA), tF t SHSL VIH VIH VIL Unit Min Remarks t SLSH VIL VIH VIL When the external clock is selected (5-3) LIN Interface (v2.1) (LIN Communication Control Interface (v2.1)) Timing (SMR:MD[2:0]=0b011) (5-3-1) When the External Clock is Selected (BGR:EXT=1) (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter serial clock "L" pulse width serial clock "H" pulse width Symbol Pin Name tSLSH (CL=50pF, tSHSL SCK0 to SCK4 SCK fall time tF SCK rise time tR IOL=-2mA, IOH=2mA), (CL=20pF, IOL=-1mA, IOH=1mA) tR SCK Value Conditions VIL tF t SHSL VIH VIH Unit Min Max tCLK_PERI1+10 - ns tCLK_PERI1+10 - ns - 5 ns - 5 ns Remarks t SLSH VIL VIL VIH When the external clock is selected May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 91 D a t a S h e e t (6) Timer Input Timing (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Value Conditions Unit Min Max 4tCLK_PERI1 - ns - ns Remarks IN16 to IN21, TIOA0 to TIOA11, - TIOB0 to TIOB11 - FRCK12 to FRCK17 Input pulse width FRCK0 to FRCK1, tTIWL FRCK4 to FRCK5 4tCLK_PERI4<70ns 70 4tCLK_PERI5≥70ns 4tCLK_PERI5 IN0 to IN3, tTIWH, 4tCLK_PERI4≥70ns 4tCLK_PERI4 IN4 to IN14, FRCK6 to FRCK10, - - ns 4tCLK_PERI5<70ns 70 4tCLK_PERI5≥70ns 4tCLK_PERI5 AIN0, BIN0, ZIN0 - - AIN2, BIN2, ZIN2 ns 70 4tCLK_PERI5<70ns 4tCLK_PERI4 4tCLK_PERI4≥70ns - 70 ns 4tCLK_PERI4<70ns − Timer input timing INx FRCKx TIOAx,TIOBx AINx,BINx,ZINx 92 CONFIDENTIAL tTIWH VIH tTIWL VIH VIL VIL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (7) Trigger Input Timing (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Conditions INT0 to INT7 RX0 to RX2 ADTG0, DTTI2 to DTTI3 tTRGH, width tTRGL Unit Max - 200 - ns - 5tCLK_SYSCPD1 - ns - 5tCLK_PERI6 - ns - ns 5tCLK_PERI5 4ADTG0, Input pulse Value Min - DTTI0 4ADTG1, 5tCLK_PERI5≥70ns 70 5tCLK_PERI5<70ns 5tCLK_PERI4 5tCLK_PERI4≥70ns - - DTTI1 Remarks ns 70 5tCLK_PERI4<70ns INT0 to INT7, ADTG0, 4ADTG0, 4ADTG1, - 1 - µs When stop mode RX0 to RX2, DTTI0 to DTTI3 − Trigger input timing INTx ADTGx RXx 4ADTGx DTTIx VIH May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL tTRGL tTRGH VIH VIL VIL 93 D a t a S h e e t (8) NMI Input Timing (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS= AVSS= RVSS=0.0V) Parameter Symbol Pin Name Conditions tNMIL NMIX - Input pulse width Value Min Max 200 - Unit Remarks ns − NMIX input timing tNMIL NMIX VIH VIH VIL 94 CONFIDENTIAL VIL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (9) External Low-Voltage Detection Parameter Power supply voltage range Detection voltage Symbol Pin Name Conditions VDP5 VCC5 VDL VCC5 (TA: Recommended operating conditions, VSS=AVSS=RVSS=0.0V) Value Unit Min Typ Max - - - 5.5 V *1 3.7 3.9 4.1 V Remarks − When power supply voltage falls − The original setting of detection level is 4.1V±0.2V Hysteresis width Low voltage detection time Power supply voltage fluctuation rate VHYS VCC5 - 75 100 150 mV Td - - - - 30 µs - VCC5 - -4 - - V/ms − When power supply voltage rises *2 *1: If the fluctuation of the power supply has exceeded the detection voltage range within the time less than the low-voltage detection time (Td), there is the possibility to generate or release after the power supply voltage has exceeded the detection voltage range. *2: In order to perform the low-voltage detection at the detection voltage (VDL), be sure to suppress fluctuation of the power supply within the limits of the power supply voltage fluctuation rate. (10) Internal Low-Voltage Detection Parameter Symbol Pin Name Conditions VRDP5 VCC12 Detection voltage VRDL Hysteresis width Power supply voltage range Low voltage detection time Power supply voltage fluctuation rate (TA: Recommended operating conditions, VSS=AVSS=RVSS=0.0V) Value Unit Remarks Min Typ Max - - - 1.3 V VCC12 *1 0.8 0.9 1.0 V − When power supply voltage falls VRHYS VCC12 - 20 30 50 mV − When power supply voltage rises TRd - - - - 30 µs - VCC12 - -4 - - V/ms *2 *1: If the fluctuation of the power supply has exceeded the detection voltage range within the time less than the low-voltage detection time (TRd), there is the possibility to generate or release after the power supply voltage has exceeded the detection voltage range. *2: In order to perform the low-voltage detection at the detection voltage (VRDL), be sure to suppress fluctuation of the power supply within the limits of the power supply voltage fluctuation rate. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 95 D a t a S h e e t 13.5 A/D Converter (1) Electrical Characteristics (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol Pin Name Resolution - Non linearity error Value Unit Remarks Min Typ Max - - - 12 bit - - -4.0 - +4.0 LSB - - -1.9 - +1.9 LSB VZT AN0 to AN31 VFST AN0 to AN31 Sampling time tSMP - 0.3 - 12 µs *1 Compare time tCMP - 0.7 - 28 µs *1 A/D conversion time tCNV - 1.0 - 40 µs *1 IAIN AN0 to AN31 -2.0 - 2.0 µA VAVSS≤VAIN≤VAVCC Differential linearity error Zero transition voltage Full-scale transition voltage Analog port input current Analog input voltage Reference voltage -1.5LSB-20 - AVRL +0.5LSB+20 AVRH -1.5LSB+20 mV 1LSB=(VFST-VZT)/4094 mV VAIN AN0 to AN31 AVSS - AVRH V AVRH2 4.5 - 5.5 V AVRL AVRL2 - 0.0 - V - 500 680 µA - - 17.7 µA - 1 2 mA - - 2.16 µA - - 4 LSB Power supply IAH current IR AVCC2 AVRH2 IRH channels AVRH - AVRH IA Variation between AVRL +0.5LSB-20 - AN0 to AN31 AVCC≥AVRH *2 *2 *1: Time for each channel. *2: The power supply current (VCC=AVCC=5.0V) is specified if the A/D converter is not operating and CPU is stopped. (2) Notes on Using A/D Converter <About the output impedance of the analog input of external circuit> When the external impedance is too high, the sampling time for analog voltages may not be sufficient. In this case, it is recommended to connect the capacitor (approx. 0.1 µF) to the analog input pin. − Analog input circuit model Comparator Analog input R C Sampling ON 12bit A/D R 3.0kΩ (max) C 8.30pF (max) (4.5V ≤ AVcc ≤ 5.5V) Note: Listed values must be considered as reference values. 96 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 13.6 4 Channels Same Time Sampling A/D Converter (1) Electrical Characteristics (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Symbol Pin Name Resolution - Non linearity error Value Unit Remarks Min Typ Max - - - 12 bit - - -4.0 - +4.0 LSB - - -1.9 - +1.9 LSB VZT 4AN0 to 4AN7 VFST 4AN0 to 4AN7 Sampling time tSMP - 0.6 - 1.2 µs *1 Compare time tCMP - 1.4 - 5.6 µs *2 A/D conversion time tCNV - 2 - 6.8 µs *3 IAIN 4AN0 to 4AN7 -0.7 - 0.7 µA VAVSS≤VAIN≤VAVCC Differential linearity error Zero transition voltage Full-scale transition voltage Analog port input current Analog input voltage Reference voltage current AVRH -1.5LSB-20 - AVRL +0.5LSB+20 AVRH -1.5LSB+20 mV 1LSB=(VFST-VZT)/4094 mV VAIN 4AN0 to 4AN7 AVSS - AVRH V AVRH AVRH0, AVRH1 4.5 - 5.5 V AVRL AVRL0, AVRL1 - 0.0 - V - 1.0 1.5 mA 1 unit operation - - 27.5 µA 1 unit operation*4 - 0.5 4.0 mA 1 unit operation - - 4.5 µA 1 unit operation*4 IA Power supply AVRL +0.5LSB-20 IAH IR IRH AVCC0, AVCC1 AVRH0, AVRH1 Variation between - 4AN0 to 4AN3 - - 20 mV channels - 4AN4 to 4AN7 - - 20 mV AVCC≥AVRH *1: 4 channels same time sampling time. *2: Compare time for 4 channels. *3: Conversion time for 4 channels. *4: The power supply current (VCC=AVCC=5.0V) is specified if the A/D converter is not operating and CPU is stopped. May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 97 D a t a S h e e t (2) Notes on Using A/D converter <About the output impedance of the analog input of external circuit> When the external impedance is too high, the sampling time for analog voltages may not be sufficient. In this case, it is recommended to connect the capacitor (approx. 0.1 µF) to the analog input pin. − Analog input circuit model Comparator Analog input R C Sampling ON 4-SH 12bit A/D R 3.8kΩ (max) C 8.30pF (max) (4.5V ≤ AVcc ≤ 5.5V) Note: Listed values must be considered as reference values. 98 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t (12-3) Definition of Terms Resolution: Analog variation that is recognized by an A/D converter. Linearity error: Deviation of the actual conversion characteristics from a straight line that connects the zero transition point ("0000 0000 0000" ←→ "0000 0000 0001") to the full-scale transition point ("1111 1111 1110" ←→ "1111 1111 1111"). Differential linearity error: Deviation of the input voltage from the ideal value that is required to change the output code by 1LSB. Linearity error Differential linearity error FFF Digital output FFD N+1 VFST (Actuallymeasured value) 004 VNT (Actually-measured value) 003 002 Actual conversion characteristics Digital output FFE Ideal characteristics Actual conversion characteristics {1 LSB (N - 1) + VZT} Actual conversion characteristics N N-1 V(N+1)T VNT (Actually-measured value) (Actually-measured value) Ideal characteristics N-2 001 Actual conversion characteristics VZT (Actually-measured value) AVSS (AVRL) Analog input AVRH AVSS (AVRL) Analog input AVRH VNT - {1LSB×(N-1) + V ZT} [LSB] 1LSB V(N + 1)T - VNT Differential linearity error of digital output N = -1 LSB [LSB] 1LSB VFST - VZT 1LSB = [V] 4094 Linearity error of digital output N = VZT: Voltage at which the digital output changes from "0x000" to "0x001". VFST: Voltage at which the digital output changes from "0xFFE" to "0xFFF". May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 99 D a t a S h e e t 13.7 Flash Memory Value Parameter Min Typ Max - 200 800 Unit ms - 300 1100 ms - 400 2000 ms Sector erase time Remarks 8K Byte sector*1 Excluding internal preprogramming time 8K Byte sector *1 Including internal preprogramming time 64K Byte sector *1 Excluding internal preprogramming time 64K Byte sector *1 - 700 3700 ms 8bit writing time - 9 288 µs Excluding overhead time at system level*1 16bit writing time - 12 384 µs Excluding overhead time at system level*1 ECC writing time - 9 288 µs Excluding overhead time at system level*1 - - - Erase cycle *2/ Data retention time 1,000 times /20 years, 10,000 times /10 years, 100,000 times / 5 years Including internal preprogramming time Temperature at writing/erasing Average temperature TA=+85°C*3 *1: The guaranteed value for erase up to 100,000 cycles *2: Number of erase cycles for each sector *3: This value comes from the technology qualification (using Arrhenius equation to translate high temperature measurements into normalized value at + 85°C). Notes: − − 100 CONFIDENTIAL While the Flash memory is written or erased, shutdown of the external power supply (VCC, VDD) is prohibited. In the application system where VCC or VDD might disappear while writing, be sure to turn the power off by using an external low-voltage detector and NMIX pin + RSTX pin for reset input at same time. Concretely, please execute two of the following. 1. After simultaneous input from the NMIX and RSTX pins while VDD is within the recommended operating range, maintain VDD within the recommended operating range for at least 60 µs. 2. After simultaneous input from the NMIX and RSTX pins while VCC is within the recommended operating range, power off VCC in observance of the standard regarding the supply voltage fluctuation rate of the external low-voltage detector. MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 13.8 R/D Converter (TA: Recommended operating conditions, VCC=5.0V±0.5V, VDD=1.2V±0.1V, VSS=AVSS=RVSS=0.0V) Parameter Output voltage(amplitude) Excitation signal Output voltage(displacement) output output current Frequency Resolver response signal*1 Excitation input Amplitude Maximum input frequency Phase difference from resolver detection signal Angle accuracy (conversion accuracy) Resolution Output delay Angular velocity Resolution voltage AREF2 output voltage Tracking loop characteristics (0dB cross frequency) Tracking loop characteristics (-3dB cross frequency) Operating characteristics Max Unit 0.4VCC-1% 0.4VCC 0.4VCC+1% V -0.4VCC+(VCC/2) - 0.4VCC+(VCC/2) V - - 1 mA Remarks - 10 or 20 - kHz AREF20-2.0 - AREF20+2.0 V Unit0 AREF21-2.0 - AREF21+2.0 V Unit1 - - 24 kHz 0 - RVCC0 V 0 - RVCC1 V -45 - 45 ° -4 - 4 LSB - 12 - bit 1.1 - 2.1 µs - - 4000 rps Maximum Angular velocity output Reference output Typ Amplitude signal*2 Angle output Value Min - - 3000 rps rps/LSB Setting with the register Unit0 More than 2Vp-p Unit1 More than 2Vp-p Variation when Pausing: ±1LSB When bandwidth 1.8 kHz mode When bandwidth 600 kHz mode - 0.261 - RVCC0/2-3% - RVCC0/2+3% V Unit0 RVCC1/2-3% - RVCC1/2+3% V Unit1 - - 1.2 kHz - - 400 Hz - - 1.8 kHz - - 600 Hz - - 4000 rps Maximum tracking rate - - 3000 rps - - 4 ms - - 12 ms - - 1,000,000 rad/s2 - - 150,000 rad/s2 Settling time (179 degree step) Maximum angular velocity When bandwidth 1.8 kHz mode*3 When bandwidth 600 Hz mode*3 When bandwidth 1.8 kHz mode*3 When bandwidth 600 Hz mode*3 When bandwidth 1.8 kHz mode When bandwidth 600 Hz mode When bandwidth 1.8 kHz mode When bandwidth 600 Hz mode When bandwidth 1.8 kHz mode When bandwidth 600 Hz mode *1: Corresponding pin: COS_PLUS, COS_MINUS, SIN_PLUS, SIN_MINUS *2: Corresponding pin: MAG_PLUS, MAG_MINUS *3: When signal amplitude is nominal May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 101 D a t a S h e e t 14. Ordering Information Part Number Package MB9DF564MxEEQ-GTE1 208-pin plastic TEQFP MB9DF565MxEEQ-GTE1 (LER208) MB9DF566MxEEQ-GTE1 MB9DF564LxEEQ-GTE1 176-pin plastic TEQFP MB9DF565LxEEQ-GTE1 (LEP176) MB9DF566LxEEQ-GTE1 Notes: − "x" is option number. This option is following table. The detail of package, see "16. Package Dimensions". 15. Part Number Option Part Number Option R/D Converter FlexRay Key Code A - - G - L - - - Q - - : Supported 102 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 16. Package Dimensions May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 103 D a t a S h e e t 104 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t 17. Major Changes Page Section Change Results Revision 1.0 - - Initial release Revision 2.0 11 3. Product Lineup Add 176 pin product 14, 15 4. Pin Assignment Add 176 pin product 16 to 33 5. Pin Description Add 176 pin product 46, 47 10. Memory Map Add address information of MB9DF564 and MB9DF565 54, 55 12. Pin Statuses in CPU Status 102 14. Ordering Information 103, 104 16. Package Dimensions Add 176 pin product Change package name Add 176 pin product Change package dimensions Add 176 pin product Revision 3.0 102 15. Part Number Option May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL Add part number option L, Q 105 D a t a S h e e t 106 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015 D a t a S h e e t May 15, 2015, MB9D560_DS708-00001-3v0-E CONFIDENTIAL 107 D a t a S h e e t Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. ® ® ® TM Copyright © 2014-2015 Cypress All rights reserved. Spansion , the Spansion logo, MirrorBit , MirrorBit Eclipse , TM TM TM ORNAND , Easy DesignSim , Traveo and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners. 108 CONFIDENTIAL MB9D560_DS708-00001-3v0-E, May 15, 2015