PH5551A2NA1-E4

Preliminary
PH5551A2NA1-E4
Data Sheet
Ambient Illuminance Sensor
R08DS0037EJ0100
Rev.1.00
Aug 03, 2011
DESCRIPTION
The PH5551A2NA1-E4 is a digital ambient illuminance sensor for I2C bus interfaces and includes a 16-bit AD
converter. This product has spectral characteristics close to human eye sensitivity and outputs digital signals
corresponding to the ambient brightness.
The PH5551A2NA1-E4 can be used to improve the performance and reduce the power consumption of digital
equipment such as FPD TV sets and mobile phones, by enabling automatic brightness control and automatic switching
on and off of lighting systems.
FEATURES

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Small and thin SON package
2.55 x 1.56 x 0.55 mm
Built-in 16-bit AD converter
I2C bus interface
Spectral characteristics close to human eye sensitivity
Peak sensitivity wavelength
560 nm TYP.
Wide illuminance range
1 to 65,535 lx
I2C slave address selectable
2 types
Interrupt function
Pb-free
APPLICATIONS
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FPD TV sets, displays
Mobile phones, smartphones
Notebook PCs, tablet PCs
DSCs, DVCs
FA equipments
Lighting systems, etc.
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Aug 03, 2011
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PH5551A2NA1-E4
Chapter Title
PACKAGE DIMENSIONS (UNIT: mm)
Pin No.
1
Terminal
VDD
I/O

Function
Supply Voltage
2
3
GND
ADDR_SEL

I
GND
Slave Address (2 addresses selectable)
4
5
SCL
INT
I
O
I C bus SCL
Interrupt
6
SDA
IO
I C bus SDA
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2
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PH5551A2NA1-E4
Chapter Title
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Symbol
Ratings
Unit
Supply Voltage
*1
Power Dissipation
Parameter
VDD
PD
4.5
135
V
mW
Operating Temperature
Storage Temperature
TA
Tstg
30 to +85
40 to +100
C
C
Note:
*1. Mounted on glass epoxy board (18 mm  13 mm  0.8 mm)
t
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Symbol
MIN.
TYP.
MAX.
Unit
VDD
2.4
3.0
3.6
V
ELECTRO-OPTICAL CHARACTERISTICS
(TA = 25C, VDD = 3.0 V, unless otherwise specified)
Parameter
Symbol
Conditions
MIN.
*1
Supply Current 1
Supply Current 2
IDD1
IDD2
Ev = 100 lx
*1
Ev = 100 lx , power-down
Dark Sensor Output
Peak Sensitivity Wavelength

p
Ev = 0 lx
TYP.
MAX.
Unit
130
290
1
A
A
4
560
count
nm
lx
lx
H-Resolution Mode Resolution
L-Resolution Mode Resolution
HRM
LRM
1
16
Measurement Time in
H-Resolution Mode
HRt
330
495
ms
Measurement Time in
L-Resolution Mode
LRt
21
32
ms
400
2
I C SCL Clock Frequency
2
I C Bus Free Time
fSCL
tBUF
1.3
kHz
s
tHDSTA
0.6
s
tSUSTA
0.6
s
tSUSTO
0.6
s
tHDDAT
0
tSUDAT
tLOW
100
1.3
tHIGH
VOL
0.6
0
2
I C Hold Time for START
Condition
2
I C Set-up Time for START
Condition
2
I C Set-up Time for STOP
Condition
2
I C Data Hold Time
2
I C Data Set-up Time
2
I C „L‟ Period of the SCL Clock
2
I C „H‟ Period of the SCL Clock
2
I C „L‟ Output Voltage at SDA
Note:
0.9
μs
ns
s
s
0.4
V
*1 Fluorescent light
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PH5551A2NA1-E4
Chapter Title
I2C BUS INTERFACE SPECIFICATION
2
1. I C Bus Interface Timing Chart
2. Slave Address
Two slave addresses are selectable. The slave address is determined by the ADDR_SEL pin.
When ADDR_SEL “H”, the address is “1100100”.
When ADDR_SEL  “L”, the address is “0111001”.
2
3. I C Protocols
(1) Write Format
(2) Read Format
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PH5551A2NA1-E4
Chapter Title
INSTRUCTION CODE AND REGISTER MAP
1. Instruction Code
The instruction code is specified after the slave address.
0
1
0
1
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
REG_SEL
AP_CNT
ADR_PTR
PWR
Default
*1
Note: *1 There are two PWR bits, one in the instruction code and one in the control register. When one bit changes, the
other bit also changes at the same time.
(1) REG_SEL: Register selection for Write or Read operation
Code
Register Address Selection
Write Operation
Read Operation
00
Control Register
Control Register
Control Register
01
Measurement Register
Control Register
Measurement Register
10
Measurement Register

Measurement Register
(2) AP_CNT: Address Pointer Control
Code
Description
00
The address is fixed to the register address specified by ADR_PTR.
01
The register address is incremented when one item of data is written or read.
10
If these bits are read after being written, the current register address is output.
(3) ADR_PTR: Register Address
Specify the address of the register to be written or read by using these 3 bits.
(4) PWR: Power On/Power Down
Power on/Power down (1: Power on)
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PH5551A2NA1-E4
Chapter Title
2. Register Map
The register map is specified after the instruction code.
(1) Control Register
(a) Register Address: 000
0
0
0
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Reserved
SWRST
INTCLR
INT_COND
RSLTN
INT_EN
0
Default
Bit 0
*2
PWR
*1
Notes: *1 There are two PWR bits, one in the instruction code and one in the control register. When one bit changes,
the other bit also changes at the same time.
*2 There are two INT_EN bits in the control register. When one bit changes, the other bit also changes at the
same time.
SWRST
INTCLR
INT_COND
RSLTN
INT_EN
PWR
: Register reset (Initial values are restored by setting this bit to 1.)
: Interrupt source clear (1: Clear interrupt source)
: Interrupt result
(00: No comparison with threshold value; 01: Measured lux is lower than lower-limit threshold value;
11: Measured lux is higher than upper-limit threshold value.)
: Resolution selection (1 lx/16 lx) (0: 1 lx resolution; 1: 16 lx resolution)
: Interrupt enable/disable (1: Enable interrupts)
: Power on/Power down (1: Power on)
(b) Register Address: 001
0
0
0
0
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
Lower interrupt generation threshold when interrupts are enabled - Lower 8 bits
(c) Register Address: 010
0
0
0
0
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
Lower interrupt generation threshold when interrupts are enabled - Higher 8 bits
(d) Register Address: 011
0
0
0
0
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
Upper interrupt generation threshold when interrupts are enabled - Lower 8 bits
(e) Register Address: 100
0
0
0
0
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
Upper interrupt generation threshold when interrupts are enabled - Higher 8 bits
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PH5551A2NA1-E4
Chapter Title
(f) Register Address: 101
0
0
0
0
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reserved
Reserved
Reserved
STOP
Note: *1
INT_AT_RT
*1
INT_EN
There are two INT_EN bits in the control register. When one bit changes, the other bit also changes at the
same time.
STOP
INT_COUNT
INT_AT_RT
INT_EN
INT_COUNT
Default
: Stops lux measurement after the current ADC cycle. The lux data measured last is retained. The ADC
enters standby mode.(1: Stop)
: How many times the upper or lower threshold value is exceeded in succession before an interrupt
signal is generated.
(00: Once; 01: 4 times; 10: 8 times; 11: 16 times)
: Automatic restoration from interrupt enable/disable
(0: Processing automatically restored; 1: Processing not automatically restored (restored after the
interrupt is cancelled by the system))
: Interrupt enable/disable (0: Disable interrupts; 1: Enable interrupts)
3. Measurement Register
(a) Register Address: 000
0
0
0
0
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
Measurement of lux - lower 8 bits (read only)
(b) Register Address: 001
0
0
0
0
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
Measurement of lux - higher 8 bits (read only)
R08DS0037EJ0100 Rev.1.00
Aug 03, 2011
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PH5551A2NA1-E4
Chapter Title
TAPING SPECIFICATIONS (UNIT: mm)
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Aug 03, 2011
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PH5551A2NA1-E4
Chapter Title
RECOMMENDED MOUNT PAD DIMENSIONS (Unit: mm)
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PH5551A2NA1-E4
Chapter Title
NOTES ON HANDLING
1. Recommended reflow soldering conditions
(including infrared reflow, convection reflow, and infrared + convection reflow)
(1) This product is dry-packed with desiccant in order to avoid moisture absorption.
(2) After breaking the seal, reflow soldering must be done within 168 hours under the recommended temperature
profile shown below.
(3) If more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and
reel.
Baking conditions: Once, with tape and reel, 605C, 10 to 24 hours
After the baking process, this product must be stored under conditions of 30C or below, 70% RH or below, and
reflow soldering must be done within 168 hours.
<Storage conditions after breaking seal>
 Storage conditions
 Maximum storage period after breaking seal
: 30C or below, 70% RH or below
: 168 hours (Second reflow soldering must be completed
within 168 hours.)
<Reflow soldering conditions>
 Peak reflow temperature
: 260C or below (Package surface temperature)
 Maximum number of reflows
:2
 No repair by hand soldering
 Maximum chlorine content of rosin flux (percentage mass) : 0.2% or less
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Aug 03, 2011
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Revision History
PH5551A2NA1-E4 Data Sheet
Description
Rev.
1.00
Date
Aug 03, 2011
Page

Summary
First edition issued
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