4V Drive Nch MOSFET RSH110N03 Dimensions (Unit : mm) Structure Silicon N-channel MOSFET SOP8 Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (SOP8). Application Power switching, DC / DC converter. Each lead has same dimensions Packaging specifications Package Type Inner circuit (8) Taping (7) (6) (5) (8) (7) (6) (5) TB Code Basic ordering unit (pieces) 2500 RSH110N03 ∗2 (1) (2) (3) (4) ∗1 Absolute maximum ratings (Ta=25C) Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body diode) Total power dissipation Channel temperature Storage temperature Continuous Pulsed Continuous Pulsed Symbol VDSS VGSS ID IDP ∗1 IS ISP ∗1 PD ∗2 Tch Tstg Limits 30 20 ±11 ±44 1.6 22 2 150 −55 to +150 Unit V V A A A A W °C °C Symbol Rth (ch-a) ∗ Limits 62.5 Unit °C / W (1) (2) (3) ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE (4) (1)Source (2)Source (3)Source (4)Gate (5)Drain (6)Drain (7)Drain (8)Drain ∗A protection diode is included between the gate and the source terminals to protect the diode against static electricity when the product is in use. Use the protection circuit when the fixed voltages are exceeded. ∗1 Pw≤10μs, Duty cycle≤1% ∗2 Mounted on a ceramic board. Thermal resistance Parameter Channel to ambient ∗ Mounted on a ceramic board. www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 1/3 2009.12 - Rev.A RSH110N03 Data Sheet Electrical characteristics (Ta=25C) Symbol Min. Typ. Max. Gate-source leakage IGSS Drain-source breakdown voltage V(BR) DSS Zero gate voltage drain current IDSS Gate threshold voltage VGS (th) Parameter − 30 − 1.0 − − − 8.0 − − − − − − − − − − − − − − 7.6 10.3 11.2 − 1300 410 250 9 17 60 30 17 3.3 7.1 10 − 1 2.5 10.7 14.5 15.7 − − − − − − − − − − − Static drain-source on-starte resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge ∗ RDS (on) Yfs ∗ Ciss Coss Crss td (on) ∗ tr ∗ td (off) ∗ tf ∗ Qg ∗ Qgs ∗ Qgd ∗ Unit μA V μA V mΩ S pF pF pF ns ns ns ns nC nC nC Conditions VGS=20V, VDS=0V ID=1mA, VGS=0V VDS=30V, VGS=0V VDS=10V, ID=1mA ID=11A, VGS=10V ID=11A, VGS=4.5V ID=11A, VGS=4V ID=11A, VDS=10V VDS=10V VGS=0V f=1MHz ID=5.5A, VDD 15V VGS=10V RL=2.73Ω RG =10Ω VDD 15V VGS=5V ID=11A ∗Pulsed Body diode characteristics (Source-Drain) (Ta=25C) Parameter Forward voltage Symbol VSD ∗ Min. − Typ. − Max. 1.2 Unit V Conditions IS=6.4A, VGS=0V ∗Pulsed www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 2/3 2009.12 - Rev.A RSH110N03 Data Sheet Electrical characteristic curves 10000 Crss 100 10 0.01 0.1 1 10 td (off) 100 tr 10 td (on) 1 0.01 100 0.1 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 1 0.1 0.01 0.001 0.0 0.5 1.0 1.5 2.0 2.5 3.0 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) DRAIN CURRENT : ID (A) 10 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 10 1 0.1 1 10 100 2 1 0 2 4 6 8 10 12 250 ID=11A ID=5.5A 150 100 50 0 0 2 4 6 8 10 12 14 10 100 VGS=0V Pulsed VGS=4.5V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 1 10 100 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 0.1 0.01 0.0 16 10 1 0.1 0.5 1.0 1.5 SOURCE-DRAIN VOLTAGE : VSD (V) Fig.6 Source Current vs. Source-Drain Voltage 1000 100 VGS=4V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 10 1 0.1 1 10 DRAIN CURRENT : ID (A) DRAIN CURRENT : ID (A) DRAIN CURRENT : ID (A) Fig.7 Static Drain-Source On-State Resistance vs. Drain Current (Ι) Fig.8 Static Drain-Source On-State Resistance vs. Drain Current (ΙΙ) Fig.9 Static Drain-Source On-State Resistance vs. Drain Current (ΙΙΙ) www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 3/3 18 1 Fig.5 Static Drain-Source On-State Resistance vs. Gate-Source Voltage 1000 16 Fig.3 Dynamic Input Characteristics 100 200 14 TOTAL GATE CHARGE : Qg (nC) GATE-SOURCE VOLTAGE : VGS (V) STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) 100 3 Ta=25°C Pulsed Fig.4 Typical Transfer Characteristics VGS=10V Pulsed 4 0 100 300 GATE-SOURCE VOLTAGE : VGS (V) 1000 10 5 Fig.2 Switching Characteristics Fig.1 Typical Capacitance vs. Drain-Source Voltage VDS=10V Pulsed 1 Ta=25°C 7 VDD=15V ID=11A 6 RG=10Ω Pulsed DRAIN CURRENT : ID (A) DRAIN-SOURCE VOLTAGE : VDS (V) 100 GATE-SOURCE VOLTAGE : VGS (V) Coss tf 1000 SOURCE CURRENT : Is (A) Ciss 1000 8 Ta=25°C VDD=15V VGS=10V RG=10Ω Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) Ta=25°C f=1MHz VGS=0V SWITCHING TIME : t (ns) CAPACITANCE : C (pF) 10000 100 2009.12 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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