ROHM RTQ020N05

2.5V Drive Nch MOSFET
RTQ020N05
zDimensions (Unit : mm)
zStructure
Silicon N-channel MOSFET
TSMT6
1.0MAX
2.9
1.9
0.95 0.95
zFeatures
1) Low On-resistance.
2) Space savingsmall surface mount package (TSMT6).
3) Low voltage drive (2.5V drive).
(5)
0.7
(4)
1.6
2.8
(6)
0.85
(2)
0~0.1
0.3~0.6
(1)
(3)
1pin mark
0.16
0.4
Each lead has same dimensions
zApplications
Switching
Abbreviated symbol : PU
zPackaging specifications
Package
Type
zInner circuit
Taping
(6)
(5)
(4)
TR
Code
Basic ordering unit (pieces)
3000
∗2
RTQ020N05
∗1
(1)
(2)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
(3)
(1) Drain
(2) Drain
(3) Gate
(4) Source
(5) Drain
(6) Drain
zAbsolute maximum ratings (Ta=25°C)
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body diode)
Total power dissipation
Channel temperature
Range of storage temperature
Continuous
Pulsed
Continuous
Pulsed
Symbol
VDSS
VGSS
ID
IDP ∗1
IS
ISP ∗1
PD ∗2
Tch
Tstg
Limits
45
±12
±2
±8
1
8
1.25
150
−55 to +150
Unit
V
V
A
A
A
A
W
°C
°C
Symbol
Rth(ch-a) ∗
Limits
100
Unit
°C/W
∗1 Pw≤10µs, Duty cycle≤1%
∗2 When mounted on a ceramic board
zThermal resistance
Parameter
Channel to ambient
∗ When mounted on a ceramic board
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1/4
2009.10 - Rev.A
RTQ020N05
Data Sheet
zElectrical characteristics (Ta=25°C)
Symbol
Min.
Typ.
Max.
IGSS
Gate-source leakage
Drain-source breakdown voltage V(BR) DSS
Zero gate voltage drain current
IDSS
Gate threshold voltage
VGS (th)
Parameter
−
45
−
0.5
−
−
−
1.6
−
−
−
−
−
−
−
−
−
−
−
−
−
−
140
150
200
−
150
40
15
8
14
16
10
2.3
0.8
0.5
±10
−
1
1.5
190
210
280
−
−
−
−
−
−
−
−
−
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
RDS (on)∗
Yfs
Ciss
Coss
Crss
td (on)
tr
td (off)
tf
Qg
Qgs
Qgd
∗
∗
∗
∗
∗
∗
∗
∗
−
−
Unit
µA
V
µA
V
mΩ
mΩ
mΩ
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
Conditions
VGS=±12V, VDS=0V
ID= 1mA, VGS=0V
VDS= 45V, VGS=0V
VDS= 10V, ID= 1mA
ID= 2A, VGS= 4.5V
ID= 2A, VGS= 4V
ID= 2A, VGS= 2.5V
VDS= 10V, ID= 2A
VDS= 10V
VGS=0V
f=1MHz
VDD 25V
ID= 1A
VGS= 4.5V
RL 25Ω
RG=10Ω
VDD 25V ,ID= 2A
VGS= 4.5V
RL 12.5Ω ,RG=10Ω
∗Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter
Forward voltage
Symbol
VSD ∗
Min.
Typ.
Max.
−
−
1.2
Unit
V
Conditions
IS= 2A, VGS=0V
∗Pulsed
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○
2/4
2009.10 - Rev.A
RTQ020N05
Data Sheet
zElectrical characteristics curves
2
VGS= 2.0V
1
VGS= 1.8V
0.5
1.5
VGS= 1.8V
0.5
Ta=25°C
Pulsed
0
0
0.2
0.4
0.6
0.8
VGS= 2.0V
1
0
2
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
4
6
8
0
10
100
VGS= 2.5V
VGS= 4.0V
VGS= 4.5V
10
1000
VGS= 4.5V
Pulsed
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
0.1
1
DRAIN-CURRENT : ID [A]
10
FORWARD TRANSFER
ADMITTANCE : |Yfs| [S]
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
10
0.1
1
10
DRAIN-CURRENT : ID [A]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅳ)
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○
0.1
0.01
2.5
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
10
10
0.1
1
10
DRAIN-CURRENT : ID [A]
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅲ)
10
VDS= 10V
Pulsed
1
2
100
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅱ)
VGS= 2.5V
Pulsed
1.5
VGS= 4.0V
Pulsed
DRAIN-CURRENT : ID [A]
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅰ)
1
GATE-SOURCE VOLTAGE : VGS[V]
10
1
0.5
Fig.3 Typical Transfer Characteristics
REVERSE DRAIN CURRENT : Is [A]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
1000
10
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
0.01
Fig.2 Typical Output Characteristics(Ⅱ)
Ta= 25°C
Pulsed
0.1
Ta= 25°C
Ta= - 25°C
0.1
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics(Ⅰ)
1000
Ta= 125°C
Ta= 75°C
0.001
0
1
DRAIN-SOURCE VOLTAGE : VDS[V]
1000
1
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
1.5
10 V = 10V
DS
Pulsed
Ta=25°C
Pulsed
VGS= 10V
VGS= 4.5V
VGS= 4.0V
VGS= 2.5V
DRAIN CURRENT : ID [A]
VGS= 10V
VGS= 4.5V
VGS= 4.0V
VGS= 2.5V
DRAIN CURRENT : ID [A]
DRAIN CURRENT : ID [A]
2
Ta= -25°C
Ta=25°C
Ta=75°C
Ta=125°C
VGS=0V
Pulsed
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
0.01
0.1
1
DRAIN-CURRENT : ID [A]
Fig.8 Forward Transfer Admittance
vs. Drain Current
3/4
10
0
0.5
1
1.5
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.9 Reverse Drain Current
vs. Sourse-Drain Voltage
2009.10 - Rev.A
Data Sheet
1000
300
250
Ta=25°C
VDD = 25V
VGS=4.5V
RG=10Ω
Pulsed
td(off)
Ta=25°C
Pulsed
ID = 2.0A
200
150
ID = 1.0A
100
tf
100
5
GATE-SOURCE VOLTAGE : VGS [V]
350
SWITCHING TIME : t [ns]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : R DS(ON)[mΩ]
RTQ020N05
10
50
tr
td (on)
4
3
2
0
1
0
0
2
4
6
8
10
GATE-SOURCE VOLTAGE : VGS[V]
Fig.10 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
Ta=25°C
VDD = 25V
ID = 2.0A
RG=10Ω
Pulsed
1
0.01
0.1
1
0
10
0.5
1
1.5
2
2.5
DRAIN-CURRENT : ID [A]
TOTAL GATE CHARGE : Qg [nC]
Fig.11 Switching Characteristics
Fig.12 Dynamic Input Characteristics
3
1000
CAPACITANCE : C [pF]
Ciss
100
Crss
10
Coss
Ta=25°C
f=1MHz
VGS=0V
1
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.13 Typical Capacitance
vs. Drain-Source Voltage
zMeasurement circuit
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
tr
ton
90%
td(off)
tf
toff
Fig.1-2 Switching waveforms
Fig.1-1 Switching time measurement circuit
VG
VGS
ID
VDS
RL
D.U.T.
IG(Const.)
RG
Qg
VGS
Qgs
Qgd
VDD
Charge
Fig.2-1 Gate charge measurement circuit
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Fig.2-2 Gate charge waveform
4/4
2009.10 - Rev.A
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