CLD-DS16 Rev 11G Product family data sheet Cree® XLamp® MC-E LED MC-E White MC-E Color Product Description MC-E Dynamic White FEATURES The XLamp® MC-E LED is a family of Table of Contents • Available in white (2600 K – Characteristics 10,000 K CCT), EasyWhite , Complete Package............................ 2 provides high lumen output in a small Dynamic White, or color (RGBW) Per LED Die (White)........................... 2 package. Compared to discrete LEDs, • ANSI-compatible neutral & warm Per LED Die (Color)............................ 2 lighting-class, multi-chip LEDs that XLamp MC-E LEDs reduce the distance ® white chromaticity bins Flux Characteristics between LED die, creating a small optical • Individually addressable LEDs White.................................................. 3 source for excellent optical control and • MC-E Dynamic White LEDs have EasyWhite®........................................ 4 efficient color mixing. XLamp MC-E LEDs two cool-white (6500 K) and two can reduce LED system complexity by warm-white (2700 K) LED die reducing the number of components • MC-E EasyWhite LEDs available in 2- and 4-step bins, up to 85 CRI required. • Maximum drive current: 700 mA per Cree XLamp LEDs bring high performance and quality of light to a wide range of lighting applications, including LED die • Reflow solderable – JEDEC J-STD-020 Relative Spectral Power Distribution White.................................................. 5 Color................................................... 5 Relative Flux Output vs Junction Temperature............................................ 6 Electrical Characteristics........................ 7 Relative Intensity vs. Current.................. 7 Typical Spatial Radiation Pattern........... 8 color-changing lighting, portable and • Electrically neutral thermal path Reflow Soldering Characteristics........... 9 personal lighting, outdoor lighting, indoor • RoHS- and REACh‑compliant Notes.....................................................10 directional lighting, and entertainment • UL recognized component Mechanical Dimensions.......................12 lighting. ® (E349212) Tape and Reel........................................13 www.cree.com/Xlamp Packaging..............................................14 Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 1 XLamp ® MC-E LED Characteristics - Complete Package The following table lists the product characteristics for the XLamp MC-E LED package. Characteristics Unit Thermal Resistance, junction to solder point - white °C/W Thermal Resistance, junction to solder point - color Minimum Typical Maximum 3 °C/W 4 Viewing Angle (FWHM) - white degrees 110 Viewing Angle (FWHM) - color degrees 115 ESD Withstand Voltage (HBM per Mil-Std-883D) V 8000 LED Junction Temperature °C 150 Characteristics - Per LED Die (White, EasyWhite®, Dynamic White) The following table lists the product characteristics of each individual LED die within the XLamp MC-E White LED package. Characteristics Unit Temperature Coefficient of Voltage Minimum Typical mV/°C DC Forward Current Maximum -4 mA 700 Reverse Voltage V 5 Forward Voltage (@ 350 mA) V 3.1 Forward Voltage (@ 700 mA) V 3.4 3.9 Characteristics - Per LED Die (Color) The following table lists the product characteristics for each LED die within the XLamp MC-E Color LED package. Characteristics Temperature Coefficient of Voltage DC Forward Current Unit mV/°C Red Green Blue White Typical -2 -4 -4 -4 mA Maximum 700 700 700 700 Reverse Voltage V Maximum 5 5 5 5 Forward Voltage (@ 350 mA) V Forward Voltage (@ 700 mA) V Typical 2.1 3.4 3.2 3.1 Maximum 2.5 3.9 3.9 3.9 Typical 2.3 3.7 3.5 3.5 Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 2 XLamp ® MC-E LED Flux Characteristics - White, Dynamic White, Color (TJ = 25 °C) The following table provides several base order codes for XLamp MC-E LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the ordercode nomenclature, please consult the XLamp MC-E LED Binning and Labeling document. Part White Color Minimum Maximum Cool White 5000 K 10,000 K Neutral White 3700 K 5000 K Warm White Dynamic White Color CCT / Dominant Wavelength Range 2600 K 3700 K Minimum Luminous Flux @ 350 mA* Flux (lm) K 370 MCE4WT-A2-0000-000K01 M 430 MCE4WT-A2-0000-000M01 J 320 MCE4WT-A2-0000-000JE4 K 370 MCE4WT-A2-0000-000KE4 G 240 MCE4WT-A2-0000-000GE7 H 280 MCE4WT-A2-0000-000HE7 J 320 MCE4WT-A2-0000-000JE7 2 cool-white die 6500 K K 100 2 warm-white die 2700 K G 70 2 cool-white die 6000 K K 100 2 warm-white die 2700 K G 70 Red 620 nm 630 nm Green 520 nm 535 nm Blue 450 nm 465 nm Order Code Group MCEDWT-A1-0000-0000A1001 MCEDWT-A1-0000-0000A1002 30.6 A5 67.2 8.2 Cool White 5700 K 7000 K 100 Red 620 nm 630 nm 30.6 Green 520 nm 535 nm Blue 450 nm 465 nm Neutral White 3700 K 4300 K A4 67.2 8.2 MCE4CT-A2-0000-00A5AAAA1 MCE4CT-A2-0000-00A4AAAB1 80 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements, ±2 on CRI measurements and ± 1 nm on dominant wavelength measurements. See the Measurements section (page 10). • Typical CRI for cool white and neutral white (3700 K - 10,000 K CCT) is 75. • Typical CRI for warm white (2600 K - 3700 K CCT) is 80. * Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA. The flux and chromaticity of XLamp MC-E White LED are measured with all LEDs lit simultaneously. The flux and color of each LED in XLamp MC-E Dynamic White and MC-E Color LEDs are measured individually. Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 3 XLamp ® MC-E LED Flux Characteristics - EasyWhite® MC-E LEDs (TJ = 25 °C) The following table provides order codes for XLamp MC-E EasyWhite LEDs. For a complete description of the order-code nomenclature, please consult the XLamp MC-E LED Binning and Labeling document. Color CCT Range 4000 K 3500 K Standard CRI EasyWhite 3000 K 2700 K 4000 K 80-CRI Minimum EasyWhite 3500 K 3000 K 2700 K 85-CRI Minimum EasyWhite 3000 K 2700 K Minimum Luminous Flux @ 350 mA, 25 ° C* Group Flux (lm) K 370 J 320 J 320 H 280 J 320 H 280 J 320 H 280 K 370 J 320 J 320 H 280 J 320 H 280 J 320 H 280 H 280 G 240 H 280 G 240 2-Step Chromaticity Region 40H 35H 30H 27H 40H 35H 30H 27H 30H 27H 4-Step Order Code MCEEZW-A1-0000-0000K040H MCEEZW-A1-0000-0000J040H MCEEZW-A1-0000-0000J035H MCEEZW-A1-0000-0000H035H MCEEZW-A1-0000-0000J030H MCEEZW-A1-0000-0000H030H MCEEZW-A1-0000-0000J027H MCEEZW-A1-0000-0000H027H MCEEZW-H1-0000-0000K040H MCEEZW-H1-0000-0000J040H MCEEZW-H1-0000-0000J035H MCEEZW-H1-0000-0000H035H MCEEZW-H1-0000-0000J030H MCEEZW-H1-0000-0000H030H MCEEZW-H1-0000-0000J027H MCEEZW-H1-0000-0000H027H MCEEZW-P1-0000-0000H030H MCEEZW-P1-0000-0000G030H MCEEZW-P1-0000-0000H027H MCEEZW-P1-0000-0000G027H Chromaticity Region 40F 35F 30F 27F 40F 35F 30F 27F 30F 27F Order Code MCEEZW-A1-0000-0000K040F MCEEZW-A1-0000-0000J040F MCEEZW-A1-0000-0000J035F MCEEZW-A1-0000-0000H035F MCEEZW-A1-0000-0000J030F MCEEZW-A1-0000-0000H030F MCEEZW-A1-0000-0000J027F MCEEZW-A1-0000-0000H027F MCEEZW-H1-0000-0000K040F MCEEZW-H1-0000-0000J040F MCEEZW-H1-0000-0000J035F MCEEZW-H1-0000-0000H035F MCEEZW-H1-0000-0000J030F MCEEZW-H1-0000-0000H030F MCEEZW-H1-0000-0000J027F MCEEZW-H1-0000-0000H027F MCEEZW-P1-0000-0000H030F MCEEZW-P1-0000-0000G030F MCEEZW-P1-0000-0000H027F MCEEZW-P1-0000-0000G027F Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. See the Measurements section (page 10). • For Standard CRI parts, the typical CRI is 80 for 4000 and 3500 K CCT parts and typical CRI is 82 for 3000 and 2700 K CCT. * Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA and with all LEDs lit simultaneously. Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 4 XLamp ® MC-E LED Relative Spectral Power Distribution (If = 350 mA per LED) - White Relative Spectral Power Distribution (IF = 350 mA per LED) - White The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on sim The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on simultaneously. Relative Radiant Power (%) 100 80 5000 K - 10,000 K CCT 60 3700 K - 5000 K CCT 40 2600 K - 3700 K CCT 20 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Relative Spectral Power Distribution (If = 350 mA per LED) - Color The following graph represents typical spectral output the -XLamp Relative Spectral Power Distribution (IF = 350 mA perofLED) ColorMC-E Color LED with all four LEDs on simulta The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously. Relative Radiant Power (%) 100 80 60 RGBW (6000 K) RGBW (4000 K) 40 20 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 5 XLamp ® MC-E LED The following graph represents typical spectral output of LED) the XLamp MC-E Color LED with each LED on independen Relative Spectral Power Distribution (IF = 350 mA per - Color (continued) The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently. Relative Radiant Power (%) 100 80 Red 60 Green Blue 40 White (6000 K) White (4000 K) 20 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Relative Flux Output vs Junction Temperature (I = 350 mA) Relative Flux Output vs. Junction Temperature (If = 350 mA) F TheThe following typical performance of each LED dieXLamp in the MC-E XLamp MC-E LED followinggraph graph represents represents typical performance of each LED die in the LED. 100% Relative Luminous Flux 90% 80% 70% White 60% Red 50% Green 40% Blue 30% 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 6 XLamp ® MC-E LED Electrical Characteristics (Tj = 25ºC) Electrical (TJ performance = 25 ˚C) The following Characteristics graph represents typical of each LED die in the XLamp MC-E LED The following graph represents typical performance of each LED die in the XLamp MC-E LED. 700 Forward Current (mA) 600 500 400 White, Blue Red 300 Green 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage (V) Relative Intensity vs. Current (Tj = 25ºC) Relative Intensity vs. Current (T = 25 ˚C) J The following graph represents typical performance of each LED die in the XLamp MC-E LED. 200 Relative Luminous Flux (%) 180 160 140 120 White, Blue 100 Red Green 80 60 40 20 0 0 100 200 300 400 500 600 700 Forward Current (mA) Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 7 XLamp ® MC-E LED Typical Spatial Radiation Pattern Typical Spatial Radiation Pattern following graph represents output of the with all four LEDs on simultaneously. The followingThe graph represents typical outputtypical of the spectral XLamp MC-E LED withXLamp all fourMC-E LEDsLED on simultaneously. 100 Relative Luminous Intensity (%) 80 60 White Color 40 20 -90 -60 -30 0 0 30 60 90 Angle (º) Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 8 XLamp ® MC-E LED Reflow Soldering Characteristics In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Free Solder 1.2 °C/second Preheat: Temperature Min (Tsmin) 120 °C Preheat: Temperature Max (Tsmax) 170 °C Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) 65-150 seconds 217 °C 45-90 seconds 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 9 XLamp ® MC-E LED Notes Measurements The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are provided for informational purposes only and are not intended as specifications. Pre‑Release Qualification Testing Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs. Lumen Maintenance Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document. Moisture Sensitivity Cree recommends keeping XLamp MC-E LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp MC-E LEDs should be handled and stored as MSL 4 per JEDEC J-STD-033, meaning they have limited exposure time before damage to the LED may occur during the soldering operation. The table on the right specifies the maximum Temperature Maximum Percent Relative Humidity 30% 40% 50% 60% 70% 80% 90% exposure time in days depending on temperature and humidity 30 ºC 9 5 4 3 1 1 1 conditions. LEDs with exposure time longer than the specified 25 ºC 12 7 5 4 2 1 1 maximums must be baked according to the baking conditions 20 ºC 17 9 7 6 2 2 1 listed below. Baking Conditions It is not necessary to bake all XLamp MC-E LEDs. Only the LEDs that meet all of the following criteria must be baked: • LEDs that have been removed from the original MBP. • LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above. • LEDs that have not been soldered. LEDs should be baked at 80 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do not bake parts at temperatures higher than 80 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 10 XLamp ® MC-E LED Notes - Continued Storage Conditions XLamp MC-E LEDs that have been removed from the original MBP but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 ± 5 ºC and no greater than 10% RH. For LEDs stored in these conditions, storage time does not add to exposure time as defined in the above Moisture Sensitivity section. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com. REACh Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request. UL® Recognized Component Level 1 enclosure consideration. The LED package or a portion thereof has not been investigated as a fire enclosure or a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and eye safety, please refer to the LED Eye Safety application note. Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 11 6 5 4 3 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. XLamp ® MC-E LED 4 3 6 2 5 REVISIONS REV CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. COMMENTS A Mechanical Dimensions Initial Release B 1.45 Change height due to new lens C Change recommended solder pad footprint Height change .05±.05 due to new lens (was 3.86) D - Change package height FROM 1.5 TO 1.45 - Add LED reference designators - Delete Series Configuration schematic - Add tabs to recommended PCB footprint E HEATSINK 5 NOTICE DATE APPROVED BY AND THE INFORMATION CREE CONFIDENTIAL. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND 10/16/07 RC CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT 10/23/2007 RC MAY NOT BE COPIED, REPRODUCED +.13OR DISCLOSED TO ANY .75 -.03 UNAUTHORIZED PERSONRCWITHOUT THE WRITTEN CONSENT 11/26/2007 OF CREE INC. 12/26/2007 RC 5/12/2008 RC 1 +.13 .75 -.03 .80 TYP. 6 Color D1: Red D2: Green D3: Blue 1 D4:DATEWhite 2 REVISIONS C REV +.2 9.0 .0 D A D2 D3 Initial Release Change recommended solder pad footprint D Height change due to new lens (was 3.86) E - Change package height FROM 1.5 TO 1.45 - Add LED reference designators - Delete Series Configuration schematic - Add tabs to recommended PCB footprint 8 HEATSINK 7 6 5.40 5 A 2.60 .05±.05 +.13 .75 -.03 +.2 9.0 .0 4 APPROVED BY A RC 2.60 10/23/2007 .25 RC 4.48±.20 .05±.05 D 7.50 1 2 2.60 5.40 +.2 7090MC INDEPENDENT Bottom 9.0 PARALLEL /7.50 .0CONFIGURATION Side View 8 1 D1 5.60 C 2 1 D1 B 2.84 POSITIVE (+) 1 1.16 7.70 10.02 8(-) 3 NEGATIVENEGATIVE (-) 1 6 D1 D5 POSITIVE (+) 1 7 .10 2 D2 2.00 POSITIVE (+) 2 3.85 1.30 5 7(-) 4 NEGATIVENEGATIVE (-) 2 3 6 1.50 BSC 3 PITCH POSITIVE (+) 3 7.00 B A D8 2 4 (+) 4 POSITIVE POSITIVE (+) 2 POSITIVE (+) 3 D7 5 1.16 NEGATIVE (-) 4 NEGATIVE (-) 1 1 D4 8 2.75 D1 4 THIRD ANGLE PROJECTION 1 POSITIVE (+) 4 POSITIVE (+) 1 D8 DRAWN BY DATE UNLESS OTHERWISE SPECIFIED 10/16/07 R.Chaloupecky DIMENSIONS ARE IN 2.00 CHECK B DATE MILLIMETERS & BEFORE FINISH. 5 Ban Loh TOLERANCE UNLESS SPECIFIED: APPROVED DATE .X ± 0.3 .XX ± .13 6 3.85 A Tolerances: .10 10.02 MATERIAL 7.70 X° mm ± 1° bigger 2.84 Solder mask windows must be .05 than PCB Solder Pad. FOR SHEET METAL PARTS ONLY 2.75 X° ± 2° 3 6 5 TITLE SIZE OUTLINE DRAWING, 1. C 20:1 DRAWING NO. 2 D2 4 POSITIVE (+) 2 UNLESS SPECIFIED 2.84OTHERWISE 7.70 10.02 DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. TOLERANCE UNLESS SPECIFIED: .X ± 0.3 1.30 .XX ± .13 X° ± 1° FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 DRAWN B UNLESS OTHERWISE SPECIFIED R.Cha DIMENSIONS AREX° IN ± 2° 3 MILLIMETERS & BEFORE FINISH. A D7 2.75 .X ± .25 .XX ± .10 E SHEET 1 OF 1 D4 1 4 POSITIVE (+) 4 3 6 CHECK Ban L APPROVE .XX ± .13 REV. 5 4 2.00 Tolerances: .10 7.7 10.02 THIRD ANGLE PROJECTION D3 31.24 Solder mask windows must be mm biggerX° ± 1° POSITIVE (+) .05 3 than PCB Solder Pad. FOR SHEET METAL PARTS ONLY 2610-00005 NEGATIVE (-) 4 .10 TOLERANCE UNLESS SPECIFIED: RECOMMENDED PCB SOLDER PAD .X ± 0.3 6 7090MC 2. NEGATIVE (-) 3PACKAGE SCALE 2 Durham, N.C 27703 D6 FINAL PROTECTIVE FINISH 1.30 1.50 BSC 4600 Silicon Drive PITCH 4 3.85 THIRD ANGLE PROJECTION .X ± .25 .XX ± .10 7 NEGATIVE (-) 2 RECOMMENDED PCB SOLDER PAD 4 3 (+) 3 POSITIVE POSITIVE (+) 1 D5 1.50 BSC PITCH 1. 2. 1 7090MC PARALLEL / D3 INDEPENDENT 6 3 CONFIGURATION NEGATIVE (-) 3 2.75 1.30 Tolerances: 1.00 TYP..10 POSITIVE (+) 4 windows must be .05 mm bigger Solder mask than PCB Solder Pad. 1. 4 2. D4 1.16 5 7.70 10.02 RECOMMENDED PCB SOLDER PAD D7 4 2.84 5.60 5 1.50 BSC POSITIVE (+) 2PITCH D8 D6 D3 A D4 D2 3.85 D6 6 D7 D5 2.75 .10 D1 D4 B 1.00 TYP. D3 B .25 7.00 D2 D3 D6 1.00 TYP. 4 5 View 8 D5 7090MC PARALLEL / INDEPENDENT D2 7 CONFIGURATION NEGATIVE (-) 2 .10 1.50 BSC PITCH 5.40 .25 2.00 6 E A 2.60 1.50 BSC PITCH 3 7 .10 A 5 .80 7.00 TYP. .25 C 1.16 REV 6 D1 D4 8 R3.18 5.60 8 7 D2 D3 R3.18 C NEGATIVE (-) 1 3.85 .05±.05 3 D1 D4 4 2 +.13 .75 -.03 C 1.00 TYP. 7090MC PARALLEL / INDEPENDENT CONFIGURATION 1 B +.2 9.0 .0 1.45 1.50 BSC 5.40 PITCH 1.16 7.50 1.45 D B 7 E .80 TYP. D2 D3 3 R3.18 5.60 2 D 4 C Top View 8 3 A Dynamic WhiteRC 11/26/2007 D1: Cool WhiteRC 12/26/2007 D2: Warm White 5/12/2008 RC D3: Cool White D4: Warm White 7.00 BSC H B C HEATSINK 10/16/07 7.50 Change height due to new lens D1 D4 B C C COMMENTS 4 1 A All measurements are ±.1 mm unless otherwise indicated. D 1.45 5 NOTICE 1 THE 2 INFORMATION 3 4 CREE CONFIDENTIAL. THIS PLOT AND CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BEHEATSINK COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. 5 2 REV .80 TYP. 4.48±.20 D D R3.18 3 6 4.48±.20 NOTICE DCONFIDENTIAL. THIS PLOT AND THE INFORMATION CREE 1 4 X° MATERIA FINAL PROT ± 2° 5 D8 A 1.50 BSC PITCH 1.5 Recommended Stencil Pattern (Shaded Area is Open) THIRD ANGLE PROJECTION RECOMMENDED PCBPCB SOLDER PADPad Recommended Solder 1. 2. Tolerances: .10 Solder mask windows must be .05 mm bigger than PCB Solder Pad. ESS OTHERWISE SPECIFIED 10/16/07 4600 Silicon Drive R.Chaloupecky DIMENSIONS ARE INCopyright © 2008-2016 Cree, Inc. All rights reserved. The information in thisN.Cdocument Durham, 27703 DATE CHECK ® METERS & BEFORE trademark FINISH. ofBan Cree, Inc UL and the UR logo are registered trademarks of UL LLC. Loh RANCE UNLESS SPECIFIED: APPROVED DATE .X ± 0.3 TITLE .XX ± .13 DRAWN BY X° ± 1° DATE 6 MATERIAL OUTLINE DRAWING, 7090MC PACKAGE 5 is subject to change without notice. Cree , XLamp and EasyWhite are registered trademarks ® ® ® A UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. TOLERANCE UNLESS SPECIFIED: .X ± 0.3 .XX ± .13 X° 3 ± 2° R.Ch CHECK Ban APPRO MATER FOR SHEET METAL PARTS ONLY and the Cree.X logo is a ± .25 .XX ± .10 X° 4 ± 1° DRAW 12 FINAL PR XLamp ® MC-E LED Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. Except as noted, all measurements in mm. 4.0±.1 1.5±.1 12.0±.1 1.75±.10 5.5±.1 Cathode Side +.3 16.0 .0 Anode Side (denoted by chamfer) User Feed Direction END START Loaded Pockets (200 Lamps) Trailer 160mm (min) of empty pockets sealed with tape (13 pockets min.) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (34 empty pockets min.) User Feed Direction Cover Tape Pocket Tape 13mm 7" Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 13 XLamp ® MC-E LED Packaging Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Quantity, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Dessicant (inside bag) Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Quantity, Reel ID, PO # Humidity Indicator Card (inside bag) Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Patent Label (on bottom of box) Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc UL® and the UR logo are registered trademarks of UL LLC. 14