APX7343

APX7343
Single-Phase Full-Wave Motor Driver for Silent Fan Motor
Features
General Description
•
Single Phase Full Wave Fan Driver
•
Silent Driver
The APX7343 is a single-phase full-wave motor driver for
DC fan motor. The output signal of this IC is the amplified
•
Low Supply Current
•
Low Standby Current (Lock mode TOFF ),
hall input signal. It is suitable for both game machine
and CPU cooler that need silent drivers. The device is
equipped with built-in lock protection. When fan is locked,
the device will enter the lockup protection mode. It is also
Supply current less than 220µA
•
Lock Protection and Auto Restart Function
•
Built-in FG Output
•
Built-in Thermal Protection Circuit
•
Lead Free and Green Devices Available
with thermal protection function. In normal operation, supply current is less than 5mA; however, in lock mode, it is
just around 150µA, moreover, this feature will shutdown
amplifier and FG. The APX7343 is available in MSOP-10
package.
(RoHS Compliant)
Pin Configuration
Applications
•
NC 1
FG 2
NC 3
OUTB 4
GND 5
Motor Drivers For Silent Fan Motors
Ordering and Marking Information
IN+
INVCC
OUTA
GND
Package Code
X : MSOP - 10
Operating Ambient Temperature Range
I : -40 to 105 °C
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device G : Halogen and Lead Free Device
APX7343
Assembly Material
Handling Code
Temperature Range
Package Code
APX7343 X :
MSOP-10
10
9
8
7
6
A7343
XXX
XX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
VCC
Parameter
VCC Pin Supply Voltage
Rating
Unit
-0.3 to 7
V
A
IOUT
OUTA/OUTB Pin Output Current
-1 to 1
VOUTA/VOUTB
OUTA/OUTB Pin Output Voltage
-0.3 to VCC+0.3
V
VFG
FG Pin Output Voltage
-0.3 to VCC+0.3
V
IFG
FG Pin Sink Current
0 to 10
mA
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2- Jun., 2008
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APX7343
Absolute Maximum Ratings (Cont.)
Symbol
Parameter
Rating
Unit
PD
Power Dissipation
0.8
W
TJ
Maximum Junction Temperature
150
°C
-65 to 150
°C
260
°C
Typical Value
Unit
TSTG
Storage Temperature Range
TSDR
Maximum Lead Soldering Temperature, 10 seconds
Note 1: Absolute Maximum Ratings are those values beyond which the life of the device may be Impaired.
Thermal Characteristics
Symbol
RTH, JA
Parameter
Thermal Resistance-Junction to Ambient
MSOP-10
°C/W
192
Recommended Operating Conditions
Symbol
Parameter
Rating
Unit
VCC
VCC Pin Supply Voltage
2.2 to 5.5
V
VHall
Hall Input Voltage Range
0.2 to Vcc-1.1
V
-40 to 105
°C
TA
Ambient Temperature
Electrical Characteristics
Symbol
(VCC=5V, TA= 25°C, unless otherwise specified)
Parameter
Test Conditions
ICC1
Operating Current
Rotation Mode, Loading=0
ICC2
Standby Supply Current
Lock Mode
VHOFS
Input Offset Voltage
APX7343
Min.
Typ.
Max.
-
3
5
Unit
mA
-
150
220
µA
-6
-
6
mV
45
48
51
dB
GIO
Input-Output Gain
Ratio of (VOUTA-VOUTB) to (VIN+-VIN-)
VOL
Output Lower Side Saturation
IOUT=250mA
-
0.15
0.22
V
VOH
Output Upper Side Saturation
IOUT=250mA
-
0.15
0.22
V
FG Pin Low Voltage
IFG=5mA
-
0.2
0.3
V
FG Pin Leak Current
VFG=5V
-
-
1
µA
-
-
1
µA
IFGL
IIN+/IIN-
Hall Signal Input Pin Leak Current VIN+=VIN-=1.3V
TON
Lock Protection On Time
0.35
0.5
0.65
sec
TOFF
Lock Protection Off Time
3.5
5
6.5
sec
-
170
-
°C
-
35
-
°C
Thermal Protection Temperature
Thermal Protection Hysteresis
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APX7343
Pin Description
PIN
FUNCTION
NO.
NAME
1
NC
No Connection.
2
FG
Rotation Speed Output. This is an open-drain output.
3
NC
No Connection.
4
OUTB
H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and
four-protection diode for switching applications.
5
GND
Ground.
6
GND
Ground.
7
OUTA
H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and
four-protection diode for switching applications.
8
VCC
9
IN-
Hall Input -. Connect to hall element negative output.
10
IN+
Hall Input +. Connect to hall element positive output.
Supply Voltage Input Pin.
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APX7343
Typical Operating Characteristics
VCC Supply Current vs. VCC Supply Voltage
VCC Supply Current vs. VCC Supply Voltage
4
250
VCC Supply Current (µA)
VCC Supply Current (mA)
Lock Mode
Rotation Mode
(Loading=0)
3.5
3
2.5
2
1.5
1
0.5
0
200
150
100
50
0
0
1
2
3
4
5
6
7
0
1
VCC Supply Voltage (V)
4
5
6
7
0.8
0.7
Saturation Voltage (V)
FG Pin Current (mA)
3
Saturation Voltage vs. Output Current
FG Pin Current vs. FG Pin Low Voltage
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
2
VCC Supply Voltage (V)
0.6
Upper Side MOSFET
0.5
0.4
0.3
0.2
Low Side MOSFET
0.1
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
0
100
200
300
400
500
600
700
800
Output Current (mA)
FG Pin Low Voltage (V)
Maximum Power Dissipation vs.
Ambient Temperature
Maximum Power Dissipation (W)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100 105 125
150
Ambient Temperature (°C)
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VCC Supply Voltage(V)
APX7343
Operating Waveforms
Rotation Waveform 1
VIN+(50mV/div)
Rotation Waveform 2
VIN-(50mV/div)
IIN(100mA/div)
V OUTA(5V/div)
V OUTB (2V/div)
V OUTA(2V/div)
VOUTB (5V/div)
VFG(5V/div)
Time (0.2ms/div)
Time (2ms/div)
Lock Protection Waveform 1
Lock Protection Waveform 2
IOUT(200mA/div)
IOUT(200mA/div)
V OUTA(5V/div)
VOUTA (5V/div)
V OUTB(5V/div)
V OUTB (5V/div)
VFG(5V/div)
VFG(5V/div)
Time (2s/div)
Time (2s/div)
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APX7343
Block Diagram
NC
IN+
FG
500Ω
IN-
500Ω
150kΩ
150kΩ
NC
VCC
Oscillator
OUTB
OUTA
Lock
Protection
Thermal
Protection
Control
GND
GND
Typical Application Circuit
D1
VIN
Pull High
Voltage
D2
Zener
(6V)
C1
RFG
10kΩ
VCC
Hall
element
FG
output
FG
IN+
IN-
OUTA
M
OUTB
GND
Note 2: In hot plug application, it’s necessary to protect against a hot plug input voltage overshoot. Add an input zener diode, between
the VCC and GND, to clamp the overshoot. In normal operation, the zener diode isn’t stressed because output current doesn’t
reverse to VCC.
Copyright  ANPEC Electronics Corp.
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APX7343
Function Description
Lockup Protection and Automatic Restart
This IC detects the rotation of the motor by hall signal,
and adjusts lock detection ON time (TON) and lock detection OFF time (TOFF) by internal counter. These times (TNO,
TOFF) are shown below.
IN+
IN-
TOFF
OUTA
TOFF
TON
OUTB
FG
Lock
Lock
Detection
Release Reset
Figure 1. Lock Protection and Automatic Restart Waveform
Frequency Generator Function
The FG pin is an open-drain output, connecting a pull up
resistor to a high level voltage for the frequency generator
function. During the lock mode, the FG will be always high
(switch off). (See Truth Table) Open the terminal when
not in using.
Thermal Protection
The APX7343 is equipped with thermal protection. When
internal junction temperature reaches 170οC, the output
devices will be switched off. On the contrary, when the
IC’s junction temperature cools by 35οC, the thermal sensor will turn the output devices on again, resulting in a
pulsed output during continuous thermal protection.
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APX7343
Truth Table
Input
Output
Mode
IN+
IN-
OUTA
OUTB
FG
L
H
H
L
L
H
L
L
H
OFF
L
H
L
L
OFF
H
L
L
L
OFF
Rotation Mode
Lock Mode
Application Information
Input Protection Diode & Capacitor
(VIN+)-(VIN-)
It is necessary to add in a protection diode (D1) to protect
the damage from the power reverse connection. However,
the protection diode will cause a voltage drop on the supply voltage. The current rating of the diode must be larger
than the maximum output current. For the noise reduction purpose, a capacitor (C1) 1µF is connected between
VCC and GND (see Typical Application Circuit).
VOUTB
Hall input
Please adjust hall input voltage by value of resistance so
that hall signal contains amplitude input within range
(VIN+)-(VIN-)
GND~VCC-1.1V.
The output signal of this IC is the amplified hall input
signal, therefore, the output signal depends on hall input.
When the hall input is small, the output signal becomes
gentle. Oppositely, the input signal is large, the output
VOUTB
becomes steep (See Figure 2. Different of output signal
depending on the shape of hall input signal). The input/
Figure 2. Different of Output Signal Depending on the
Shape of Hall Input Signal
output gain is 48dB (typ.). Thus, please adjust the amplitude of hall input to meet the adequate output voltage.
FG Resistor
The value of FG resistor could be decided by the following
equation:
R FG =
VCC − VFG
IFG
For example:
VCC=5V, IFG=3mA, VFG=0.2V, RFG=1.6kΩ
The value of resistor in the range of 1kΩ to 10kΩ is
recommended.
Copyright  ANPEC Electronics Corp.
Rev. A.2- Jun., 2008
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APX7343
Application Information (Cont.)
Thermal Consideration
Refre to to “Maximum Power Dissipation vs. Ambient
Temperature”, the IC is safe to operate below the curve
and it will cause the thermal protection if the operating
area is above the line. For example, TA= 75°C, the maximum power dissipation is about 0.47W.
The power dissipation can be calculated by the following
equation:
PD = ( VCC − VOUTA − VOUTB ) × IOUT + VCC × ICC
For example:
VCC = 5V, ICC = 4mA, IOUT = 270mA, VOUTA = 4.83V,
VOUTB = 0.17V, then PD= 0.111w
The GND pin provides an electrical connection to ground
and channeling heat away. The printed circuit board (PCB)
forms a heat sink and dissipates most of the heat into
ambient air.
Copyright  ANPEC Electronics Corp.
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APX7343
Package Information
MSOP-10
D
b
A
0.25
c
A2
e
E
E1
SEE
VIEW A
L
0
A1
GAUGE PLANE
SEATING PLANE
VIEW A
S
Y
M
B
O
L
MSOP-10
MILLIMETERS
MIN.
INCHES
MIN.
MAX.
MAX.
A
1.10
A1
0.00
0.15
0.000
0.043
0.006
A2
0.75
0.95
0.030
0.037
b
0.17
0.33
0.007
0.013
c
0.08
0.23
0.003
0.009
D
2.90
3.10
0.114
0.122
0.201
0.122
E
4.70
5.10
0.185
E1
2.90
3.10
0.114
e
0.50 BSC
0.020 BSC
L
0.40
0.80
0.016
0.031
0
0°
8°
0°
8°
Note: 1. Follow JEDEC MO-187 BA.
2. Dimension “D”does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not flash or protrusions.
3. Dimension “E1” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 6 mil per side.
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APX7343
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
330.0±2.00 50 MIN.
MSOP-10
P0
T1
C
d
12.4+2.00 13.0+0.50
-0.00
-0.20 1.5 MIN.
P1
P2
4.00±0.10 8.00±0.10 2.00±0.10
D0
D1
1.5+0.10
-0.00
1.5 MIN.
D
W
E1
20.2 MIN. 12.0±0.30 1.75±0.10
T
A0
B0
F
5.5±0.10
K0
0.6+0.00
-0.40 6.70±0.20 3.30±0.20 1.40±0.20
(mm)
Devices Per Unit
Package Type
Unit
Quantity
MSOP- 10
Tape & Reel
3000
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APX7343
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Ramp-up
Temperature
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 sec
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Notes: All temperatures refer to topside of the package. Measured on the body surface.
Copyright  ANPEC Electronics Corp.
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APX7343
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
3
3
Package Thickness
<2.5 mm
≥2.5 mm
Volume mm
≥350
225 +0/-5°C
225 +0/-5°C
Volume mm
<350
240 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Package Thickness
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
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