ANPEC APX9266

APX9266
Single-Phase Full-Wave Motor Driver for Silent Fan Motor
Features
General Description
•
Single Phase Full Wave Fan Driver
•
Silent Driver
The APX9266 is a single-phase full-wave motor driver for
DC fan motor, and its speed can be controlled by PWM
•
Low Supply Current
•
Low Standby Current (PWM=0), Supply current
less than 200µA
•
Speed controllable by PWM input signal
•
Built-in Quick Start Function
•
Lock Protection and Auto Restart Function
•
Built-in FG Output
•
Built-in Hall Bias Circuit
•
Built-in Thermal Protection Circuit
•
Lead Free and Green Devices Available
input signal. The output signal of this IC is the amplified
hall input signal. It is suitable for both game machine and
CPU cooler that need silent drivers. The device has lock
protection function and the lock-restart timing can be
tunable by CT capacitor. The device is also with thermal
shutdown function. In normal operation, the supply current is less than 3mA, but in PWM=0 standby mode, it is
just around 130µA. Moreover, this feature will shutdown HB, Amplifier, and FG. The APX9266 is available
in MSOP-10 package.
Pin Configuration
(RoHS Compliant)
Applications
•
OUT2
CT
IN+
HB
IN-
Motor Drivers For Silent Fan Motors
1
2
3
4
5
Ordering and Marking Information
MSOP-10
Package Code
X : MSOP-10
Operating Ambient Temperature Range
I : -40 to 105 °C
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
APX9266
Assembly Material
Handling Code
Temperature Range
Package Code
APX9266 X :
10 GND
9 OUT1
8 VCC
7 PWM
6 FG
A9266
XXX
XX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
VCC
(Note 1)
Parameter
VCC Pin Supply Voltage
Rating
Unit
7
V
IOUT
Output Pin Output Current
1
A
VOUT
Output Pin Output Voltage
7
V
HB Pin Output Current
25
mA
IHB
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Mar., 2008
1
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APX9266
Absolute Maximum Ratings (Cont.)
Symbol
Rating
Unit
VFG
FG Pin Output Voltage
Parameter
7
V
IFG
FG Pin Sink Current
10
mA
192
°C/W
Thermal Resistance-Junction to Ambient
RTH, JA
MSOP-10
PD
Power Dissipation (Note2)
0.8
W
TJ
Junction Temperature
-40 to 150
°C
TSTG
Storage Temperature
-65 to 150
°C
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
260
°C
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure
to absolute maximum rating conditions for extended periods may affect device reliability.
Note 2: Mounted on a board (48x38x1.6t mm, Glass epoxy).
Recommended Operating Conditions
Symbol
Parameter
Ratings
Unit
VCC
VCC Pin Supply Voltage
2 to 5.5
V
VHall
Hall Input Voltage Range
0.2 to Vcc-1.1
V
-40 to 105
°C
TA
Ambient Temperature
Electrical Characteristics
Symbol
Parameter
(VCC = 5V, TA=-25°C, unless otherwise specified)
Test Conditions
APX9266
Unit
Min.
Typ.
Max.
1.2
1.3
1.4
V
-
0
-
V
-
15
20
mA
SUPPLY CURRENT
IHB=5mA
VHB
Hall Bias Voltage
IHB
HB Supply Current
THBR
HB Recovery Time
None Capacitor
-
5
10
µSec
ICC1
Operating Current
Rotation Mode
-
3
5
mA
ICC2
Standby Supply Current
PWM=0
-
130
200
µA
VCTH
CT Pin High Level Voltage
CCT=0.47µF
1.4
1.3
1.5
V
VCTL
CT Pin Low Level Voltage
CCT=0.47µF
0.25
0.325
0.4
V
ICT1
CT Charge Current
VCT=0V
0.75
0.95
1.15
µA
ICT2
CT Discharge Current
VCT=2V
0.13
0.16
0.19
µA
RCT
CT Charge/Discharge Current Ratio
RCT=ICT1/ICT2
5
6
7
Lock Protect TOFF or PWM=0
CT
PWM
VPWMH
PWM Input High Level Voltage
2.5
-
VCC+0.5
V
VPWML
PWM Input Low Level Voltage
0
-
1
V
FPWM
PWM Input Frequency
0.02
-
50
kHz
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APX9266
Electrical Characteristics (Cont.)
Symbol
Parameter
(VCC = 5V, TA=-25°C, unless otherwise specified)
Test Conditions
APX9266
Min.
Typ.
Max.
Unit
OUTPUT
VOL
Output Lower Side Saturation
IO=250mA
-
0.15
0.22
V
VOH
Output Upper Side Saturation
IO=250mA
-
0.15
0.22
V
VFG
FG Pin Low Voltage
IFG=3mA
-
0.2
0.3
V
IFG
FG Pin Leak Current
VFG=5V
-
-
1
µA
GAIN
-
±1
±6
mV
45
48
51
dB
Over Temperature Shutdown
-
170
-
Over Temperature Shutdown
Hysteresis
-
35
-
-
66.5
90
VHOFS
Input Offset Voltage
Gio
Input – Output Gain
VO/(IN+ - IN-) (ratio)
THERMAL SHUTDOWN
OTS
°C
QUICK START
TQS
Quick Start Enable Time
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Mar., 2008
3
mSec
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APX9266
Typical Operating Characteristics
VCC Supply Current vs. VCC Supply Voltage
VCC Supply Current vs. VCC Supply Voltage
300
4
Operation Mode
Standby Mode
VCC Supply Current (µA)
VCC Supply Current (mA)
3.5
3
2.5
2
1.5
1
0.5
0
0
1
2
3
4
5
6
250
200
150
100
50
0
7
0
1
VCC Supply Voltage (V)
5
6
7
1.2
1
0.8
0.6
0.4
0.2
0
0
-40
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
-20
0.8
0.7
1.2
CT Pin Voltage (V)
0.6
Upper Side MOSFET
0.4
0.3
0.2
20
40
60
80
CT Pin Voltage vs. VCC Supply Voltage
1.4
0.5
0
Ambient Temperature (°C)
Saturation Voltage vs. Output Current
Saturation Voltage (V)
4
Offset Voltage vs. Ambient Temperature
FG Pin Low Voltage (V)
CT High Lev el Voltage
1
0.8
0.6
0.4
Low Side MOSFET
CT Low Lev el Voltage
0.2
0.1
0
3
1.4
Offset Voltage (mV)
FG Pin Current (mA)
FG Pin Current vs. FG Pin Low Voltage
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
2
VCC Supply Voltage (V)
0
0
100
200
300
400 500
600
700
800
0
Output Current (mA)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Mar., 2008
1
2
3
4
5
6
7
VCC Supply Voltage(V)
4
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APX9266
Typical Operating Characteristics (Cont.)
HB Voltage vs. VCC Supply Voltage
1.4
1
0.9
1.2
0.7
0.6
0.5
0.4
0.3
CT Discharge Current
0.2
1
0.8
0.6
0.4
0.2
0.1
0
IHB=5mA
CT Charge Current
0.8
HB Voltage (V)
CT Charge/Discharge Current (uA)
1.1
CT Charge/Discharge Current vs.
VCC Supply Voltage
0
0
1
2
3
4
5
6
7
0
1
VCC Supply Voltage (V)
2
3
4
5
6
7
VCC Supply Voltage (V)
Maximum Power Dissipation vs.
Ambient Temperature
Maximum Power Dissipation (W)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100105 125
150
Ambient Temperature (°C)
Operating Waveforms
Rotation Waveform 1
Rotation Waveform 2
PWM Mode
IN+(50mV/div)
OUT1(2V/div)
Full Speed
IN-(50mV/div)
OUT2(2V/div)
OUT1(2V/div)
Time (0.2ms/div)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Mar., 2008
IN-(50mV/div)
IN+(50mV/div)
OUT2(2V/div)
Time (0.2ms/div)
5
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APX9266
Operating Waveforms (Cont.)
Rotation Waveform 3
Rotation Waveform 4
PWM Mode
Full Speed
IIN (200mA/div)
IIN (200mA/div)
OUT2(2V/div)
OUT2(2V/div)
OUT1(2V/div)
OUT1(2V/div)
FG(5V/div)
FG(5V/div)
Time (0.2ms/div)
Time (0.2ms/div)
Lock Protection Waveform 1
Lock Protection Waveform 2
OUT1(5V/div)
OUT1(5V/div)
OUT2(5V/div)
OUT2(5V/div)
CT(0.5V/div)
CT(0.5V/div)
FG(5V/div)
FG(5V/div),always High
Time (1s/div)
Time (1s/div)
Pin Description
PIN
Description
No.
Name
1
OUT2
2
CT
Shutdown Time and Restart Time Setting.
3
IN+
Hall Input +.
4
HB
Hall Bias.
5
IN-
Hall Input -.
6
FG
Rotation Speed Output.
7
PWM
PWM Signal Input Terminal.
8
VCC
Supply Voltage Input Pin.
9
OUT1
H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and
four-protection diode for switching applications.
10
GND
Power Ground.
H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and
four-protection diode for switching applications.
Copyright  ANPEC Electronics Corp.
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APX9266
Block Diagram
Discharge
Circuit
CT
GND
150kΩ
VCC
500Ω
OUT1
3µA
HB
90kΩ
Vcc
Hall
Bias
Control
TSD
PWM
10kΩ
IN+
OUT2
500Ω
150kΩ
FG
IN-
Typical Application Circuit
CCT
1
OUT2
GND 10
2
CT
OUT1
9
3
IN+
VCC
8
0.47µF
D1
Zener
Hall
4
HB
PWM
7
5
IN-
FG
6
VIN
D2
C1
6V
1µF
PWM control
signal
FG output
RFG
10kΩ
Pull High
Voltage
Note 3: In hot plug application, it’s necessary to protect against a hot plug input voltage overshoot. Add an input zener diode, between
the VCC and GND, to clamp the overshoot. In normal operation, the zener diode isn’t stressed because output current
doesn’t reverse to VCC.
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APX9266
Function Description
Lockup Protection and Automatic Restart
Lock protect function does not work if PWM input frequency
is slower than 15Hz (typ.). Therefore, the PWM input
The APX9266 provides the lockup protection and auto-
frequency must be more than 20Hz.
matic restart functions for preventing the coil burnout
in the locked fan. Connecting the capacitor from CT pin to
GND determines the shutdown time and restart time.
As the fan is locked the charge/discharge circuit, charging
PWM
66.5ms
(typ.)
the CT capacitor to 1.3V by a 0.95µA source current for a
locked detection time and then switches the capacitor
Lock protect
enable (internal)
enable
disable
enable
to discharge. During this discharge interval, the output drivers are switched off until the CT voltage is discharged to 0.325V by a 0.16µA sink current and
switches the capacitor to charge. During this charging
CT
interval, the IC enters the restart time; one output is high
and another is low, which makes a torque for fan rotation
until the CT voltage is charged to 1.3V by a 0.95µA source
current. If the locked condition is not removed, the charge/
HB
HB recovery time (typ.=5us)
discharge process will be recurred until the locked condition is released (See Figure 1. Lockup Protection and
Automatic Restart Waveform).
OUT1
ININ+
Figure 2. Quick Start Waveform
TOFF
OUT1
TOFF
Frequency Generator Function
The FG pin is an open collector output, connecting a pull up
resistor to a high level voltage for the frequency generator
TON
OUT2
function.
CT
During the Lock Mode, the FG will be always high (switch
off). (See Truth Table) Open the terminal is at no use.
FG
Thermal Protection
The APX9266 has thermal protection. W hen internal
HB
Lock
Lock
Detection
junction temperature reaches 170°C, the output devices
will be switched off. When the IC’s junction temperature
Release
cools by 35°C, the thermal sensor will turn the output
devices on again, resulting in a pulsed output during
Figure 1. Lockup Protection and Automatic Restart Waveform
continuous thermal protection.
Quick Start
This IC disables the lock protection function when the
PWM input keeps low level for more than 66.5ms (typ.)
(see Figure 2. Quick Start Waveform).
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APX9266
Truth Table
Input
IN-
IN+
L
H
H
L
H
L
L
H
L
H
H
L
-
-
Output
PWM
CT
H
L
L
-
H
L
-
OUT1
OUT2
FG
H
L
L
L
H
OFF
L
L
OFF
L
L
L
L
L
OFF
L
L
OFF
OFF
OFF
OFF
Mode
Operation Mode
Lock Mode
Standby Mode
Application Information
Input Protection Diode & Capacitor
(IN+)-(IN-)
It should be added a protection diode (D1) to protect the
damage from the power reverse connection. However,
the protection diode will cause a voltage drop on the
supply voltage. The current rating of the diode must be
larger than the maximum output current. Connecting
a capacitor (C1) between VCC and GND is used for a
OUT1
noise reduction purpose ( See the Application Circuit).
HB pin & Hall input
(IN+)-(IN-)
1.3V reference is for hall element bias. In case VCC
influences the hall signal by board wiring pattern, please
connect 0.1µF capacitor between HB and GND. The
supply current is just around 130µA at PWM=0 standby
mode. This feature will shutdown HB, Amplifier and FG.
The output signal of this IC is the amplified hall input
OUT1
signal, therefore, the output signal depends on hall input.
When the hall input is small, the output signal becomes
Figure 3. Different of output signal depending on the shape of
Hall input signal
gentle. Oppositely, the input signal is large, the output
becomes steep (See Figure 3. Different of output signal
PWM input
depending on the shape of Hall input signal).The input/
output gain is 48dB (typ.). Therefore, please adjust the
It is possible to change rotation speed of the motor by
amplitude of hall input to meet the adequate output
voltage. In the case of long board wiring pattern from
switching high side output transistor. The on-duty of
switching depends on the input signal to PWM terminal.
hall element to hall signal input terminal, please connect a
capacitor between IN+ and IN-.
(See Figure 4. PWM Input Waveform)
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APX9266
Application Information (Cont.)
Where:
PWM input (Cont.)
C CT = CT pin capacitor
The input level of PWM terminal is
For example:
H : High side output transistor is ON
L : High side output transistor is OFF
CCT= 0.47µF
(see Truth Table).
Restart Time=0.52s,
When PWM terminal is open, it is equal to high
Shutdown Time=3.13s
The value of charge capacitor in range of 0.47µF to 1µF
is recommended .
FG Resistor
IN+
The value of the FG resistor could be decided by the following equation:
RFG =
PWM
V CC − VFG
I
For example:
VCC= 5V, I=3mA, VFG= 0.2V, RFG= 1.6kΩ
The value of resistor in the range of 1KΩ to 10KΩ is
recommended.
OUT1
Thermal Consideration
Refer to “Maximum Power Dissipation vs. Ambient
Temperature”, the IC is safe to operate below the curve
and it will eable the thermal protection if the operating
area is above the line. For example, T A = 75°C, the
OUT2
maximum power dissipation is about 0.48w.
The power dissipation can be calculated by the following
equation:
FG
PD = ( VCC − VOUT1− VOUT 2 ) × IOUT + VCC × ICC
Figure 4.PWM Input Waveform
For example:
CT Capacitor
if VCC=5V, ICC=4mA, IOUT=300mA, VOUT1=4.81V,
The capacitor that is connected from CT pin to GND
VOUT2=0.17V, then PD=0.128W
determines the shutdown time and restart time.
Restart Time =
The GND pin provides an electrical connection to ground
and channeling heat away. The printed circuit board (PCB)
CCT × (VCTH − VCTL )
ICT1
Shutdown Time =
forms a heat sink and dissipates most of the heat into
ambient air.
CCT × (VCTH − VCTL )
ICT 2
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APX9266
Packaging Information
MSOP-10
D
b
A
0.25
c
A2
e
E
E1
SEE
VIEW A
L
0
A1
GAUGE PLANE
SEATING PLANE
VIEW A
S
Y
M
B
O
L
MSOP-10
MILLIMETERS
MIN.
INCHES
MAX.
A
MIN.
MAX.
0.043
1.10
A1
0.00
0.15
0.000
0.006
A2
0.75
0.95
0.030
0.037
0.013
b
0.17
0.33
0.007
c
0.08
0.23
0.003
0.009
D
2.90
3.10
0.114
0.122
E
4.70
5.10
0.185
0.201
E1
2.90
3.10
0.114
e
0.50 BSC
0.122
0.020 BSC
L
0.40
0.80
0.016
0.031
0
0°
8°
0°
8°
Note: 1. Follow JEDEC MO-187 BA.
2. Dimension “D”does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not flash or protrusions.
3. Dimension “E1” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 6 mil per side.
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APX9266
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
330.0±2.00 50 MIN.
MSOP-10
P0
T1
C
d
D
W
E1
12.4+2.00 13.0+0.50
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10
-0.00
-0.20
P1
P2
4.00±0.10 8.00±0.10 2.00±0.10
D0
D1
1.5+0.10
-0.00
1.5 MIN.
T
A0
B0
F
5.5±0.10
K0
0.6+0.00
6.70±0.20 3.30±0.20 1.40±0.20
-0.40
(mm)
Devices Per Unit
Package Type
Unit
Quantity
MSOP- 10
Tape & Reel
3000
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APX9266
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Ramp-up
Temperature
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 sec
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Notes: All temperatures refer to topside of the package. Measured on the body surface.
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APX9266
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
3
3
Package Thickness
<2.5 mm
≥2.5 mm
Volume mm
≥350
225 +0/-5°C
225 +0/-5°C
Volume mm
<350
240 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Package Thickness
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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