ROHM RCX160N20

Data Sheet
10V Drive Nch MOSFET
RCX160N20
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
TO-220FM
φ3.2
10.0
4.5
1.2
1.3
14.0
2.5
8.0
15.0
Features
1) Low on-resistance.
2) Low input capacitance.
3) High ESD.
12.0
2.8
0.8
2.54
2.54
0.75
2.6
(1) (2) (3)
 Application
Switching
 Packaging specifications
Package
Type
Code
Basic ordering unit (pieces)
RCX160N20
 Inner circuit
Bulk
500

∗1
 Absolute maximum ratings (Ta = 25C)
Symbol
Parameter
Drain-source voltage
VDSS
Gate-source voltage
Drain current
Source current
(Body Diode)
Continuous
VGSS
ID *3
Pulsed
Continuous
IDP
IS
*1
Pulsed
ISP
*1
Avalanche current
Avalanche energy
IAS *2
EAS *2
Power dissipation
PD
Channel temperature
Range of storage temperature
*4
Tch
Tstg
(1) Gate
(2) Drain
(3) Source
Limits
Unit
200
30
V
V
16
A
64
16
A
A
64
A
8
20.7
40
A
mJ
W
150
55 to 150
C
C
Limits
3.125
Unit
C / W
(1)
(2)
(3)
1 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 L
500H, VDD=50V, RG=25, T ch=25°C
*3 Limited only by maximum channel temperature allowed.
*4 TC=25°C
 Thermal resistance
Parameter
Channel to Case
Symbol
Rth (ch-c)*
* T C=25°C
* Limited only by maximum channel temperature allowed.
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2011.08 - Rev.A
1/6
Data Sheet
RCX160N20
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
Min.
Max.
Unit
-
-
100
nA
VGS=30V, VDS=0V
200
-
-
V
ID=1mA, VGS=0V
IGSS
Drain-source breakdown voltage V(BR)DSS
Conditions
Typ.
IDSS
-
-
10
A
VDS=200V, VGS=0V
VGS (th)
3.25
-
5.25
V
VDS=10V, ID=1mA
RDS (on)*
-
135
180
l Yfs l *
4
8
-
S
VDS=10V, ID=8A
Input capacitance
Ciss
-
1370
-
pF
VDS=25V
Output capacitance
Coss
-
95
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
50
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
27
-
ns
VDD 100V, ID=8A
tr *
-
47
-
ns
VGS=10V
Turn-off delay time
td(off) *
-
42
-
ns
RL=12.5
Fall time
tf *
Qg *
Qgs *
Qgd *
-
17
-
ns
RG=10
-
26
-
nC
VDD 100V, ID=16A
-
10
11
-
nC
nC
VGS=10V
Min.
-
Typ.
-
Max.
1.5
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Rise time
Total gate charge
Gate-source charge
Gate-drain charge
m ID=8A, VGS=10V
*Pulsed
Body diode characteristics (Source-Drain)
Parameter
Forward Voltage
Symbol
VSD *
Conditions
Unit
V Is=16A, VGS=0V
*Pulsed
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2/6
2011.08 - Rev.A
Data Sheet
RCX160N20
Electrical characteristic curves (Ta=25C)
Fig.2 Typical Output Characteristics (Ⅱ)
Fig.1 Typical Output Characteristics (Ⅰ)
8
16
Ta=25°C
Pulsed
14
VGS=10.0V
VGS=9.0V
6
Drain Current : ID [A]
Drain Current : ID [A]
VGS=9.0V
12
VGS=8.0V
4
VGS=7.0V
2
Ta=25°C
Pulsed
VGS=10.0V
VGS=8.0V
10
8
6
VGS=7.0V
4
2
VGS=6.0V
VGS=6.0V
0
0
0
0.2
0.4
0.6
0.8
1
0
2
Drain-Source Voltage : VDS [V]
4
6
8
Fig.4 Gate Threshold Voltage vs. Channel Temperature
Fig.3 Typical Transfer Characteristics
5
100
Gate Threshold Voltage : VGS(th) [V]
VDS=10V
pulsed
Drain Currnt : ID [A]
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
VDS=10V
ID=1mA
pulsed
4
3
2
1
0.01
0
0.001
0
1
2
3
4
5
6
7
8
9
-50
10
-25
0
25
50
75
100
125
150
Channel Temperature : Tch [℃]
Gate-Source Voltage : VGS [V]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
Fig.6 Static Drain-Source On-State Resistance vs. Channel Temperature
0.5
10
VGS=10V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [W]
VGS=10V
pulsed
Static Drain-Source On-State Resistance
RDS(on) [W]
10
Drain-Source Voltage : VDS [V]
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
0.01
0.4
ID=16A
0.3
ID=8A
0.2
0.1
0
0.1
1
10
100
-50
Drain Current : ID [A]
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-25
0
25
50
75
100
125
150
Channel Temperature : Tch [℃]
3/6
2011.08 - Rev.A
Data Sheet
RCX160N20
Fig.7 Forward Transfer Admittance vs. Drain Current
Fig.8 Source Current vs. Source-Drain Voltage
100
100
VGS=0V
pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
10
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
Source Current : Is [A]
Forward Transfer Admittance
Yfs [S]
VDS=10V
pulsed
0.1
1
0.1
0.01
0.01
0.01
0.1
1
10
100
0
0.5
1
1.5
Source-Drain Voltage : VSD [V]
Drain Current : ID [A]
Fig.9 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
Fig.10 Switching Characteristics
0.5
10000
VDD≒100V
VGS=10V
RG=10Ω
Ta=25°C
Pulsed
0.4
1000
Switching Time : t [ns]
Static Drain-Source On-State Resistance
RDS(on) [W]
Ta=25°C
Pulsed
ID=8A
0.3
ID=16A
0.2
tf
100
10
tr
0.1
0
1
0
2
4
6
8
10
12
14
16
18
20
0.01
0.1
Gate-Source Voltage : VGS [V]
1
10
Drain Current : ID [A]
Fig.11 Dynamic Input Characteristics
Fig.12 Typical Capacitance vs. Drain-Source Voltage
10000
15
Ta=25°C
VDD=100V
ID=16A
Pulsed
1000
10
Capacitance : C [pF]
Gate-Source Voltage : VGS [V]
td(off)
td(on)
5
Ciss
100
Coss
Crss
10
Ta=25°C
f=1MHz
VGS=0V
1
0
0
5
10
15
20
25
30
0.01
35
Total Gate Charge : Qg [nC]
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© 2011 ROHM Co., Ltd. All rights reserved.
0.1
1
10
100
1000
Drain-Source Voltage : VDS [V]
4/6
2011.08 - Rev.A
Data Sheet
RCX160N20
Fig.14 Normalized Transient Thermal Resistance v.s. Pulse Width
Fig.13 Maximum Safe Operating Area
100
Normalized Transient Thermal Resistance : r(t)
10
Drain Current : ID [ A ]
10
PW = 100μs
Operation in this area
is limited by RDS(on)
(VGS = 10V)
1
PW = 1ms
0.1
PW = 10ms
Ta=25°C
Single Pulse
0.01
0.1
1
10
100
1
0.1
0.01
Rth(ch-a)=55.3°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.001
0.0001
1000
Drain-Source Voltage : VDS [ V ]
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Ta=25°C
Single Pulse
0.001
0.01
0.1
1
10
100
1000
Pulse width : Pw (s)
5/6
2011.08 - Rev.A
Data Sheet
RCX160N20
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
90%
td(off)
tr
ton
tf
toff
Fig.1-2 Switching Waveforms
Fig.1-1 Switching Time Measurement Circuit
VG
VGS
ID
VDS
RL
Qg
VGS
D.U.T.
IG(Const.)
Qgs
Qgd
VDD
Charge
Fig.2-2 Gate Charge Waveform
Fig.2-1 Gate Charge Measurement Circuit
VGS
IAS
VDS
V(BR)DSS
D.U.T.
RG
L
VDD
IAS
VDD
EAS =
Fig.3-1 Avalanche Measurement Circuit
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1
2
L IAS
2
V(BR)DSS
V(BR)DSS - VDD
Fig.3-2 Avalanche Waveform
6/6
2011.08 - Rev.A
Notice
Notes
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R1120A