ROHM RSJ300N10

Data Sheet
4V Drive Nch MOSFET
RSJ300N10
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
LPTS
10.1
1.3
13.1
9.0
Features
1) Low on-resistance.
2) Built-in G-S Protection Diode.
4.5
2.54
0.4
0.78
2.7
5.08
(1)
(2)
1.2
3.0
1.0
1.24
(3)
 Application
Switching
 Packaging specifications
 Inner circuit
Package
Code
Basic ordering unit (pieces)
RSJ300N10
Taping
TL
1000

Type
∗1
∗2
 Absolute maximum ratings (Ta = 25C)
Parameter
Symbol
Limits
Drain-source voltage
VDSS
100
V
Gate-source voltage
VGSS
20
V
Drain current
Source current
(Body Diode)
Unit
Continuous
ID
*1
30
A
Pulsed
Continuous
IDP
IS
*2
*1
60
30
A
A
ISP
*2
60
A
PD
*3
50
W
Tch
Tstg
150
55 to 150
C
C
Symbol
Limits
Unit
2.5
C / W
Pulsed
Power dissipation
Channel temperature
Range of storage temperature
(1) Gate
(2) Drain
(3) Source
(1)
(2)
(3)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
*1 Limited only by maximum temperature allowed.
*2 Pw≦10s, Duty cycle≦1%
*3 Tc=25℃
 Thermal resistance
Parameter
Channel to Case
Rth
(ch-c)*
*Mounted on a ceramic board.
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1/6
2011.08 - Rev.A
Data Sheet
RSJ300N10
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
Min.
Typ.
Max.
Unit
IGSS
-
-
10
A
VGS=20V, VDS=0V
100
-
-
V
ID=1mA, VGS=0V
Drain-source breakdown voltage V(BR)DSS
Conditions
IDSS
-
-
1
A
VDS=100V, VGS=0V
Gate threshold voltage
VGS (th)
1.0
-
2.5
V
VDS=10V, ID=1mA
Static drain-source on-state
resistance
RDS (on)*
-
33
52
ID=15A, VGS=10V
-
36
58
m ID=15A, VGS=4.5V
-
38
59
ID=15A, VGS=4.0V
Forward transfer admittance
l Yfs l*
15
-
-
S
ID=15A, VDS=10V
Input capacitance
Ciss
-
2200
-
pF
VDS=25V
Zero gate voltage drain current
Output capacitance
Coss
-
190
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
120
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
20
-
ns
ID=15A, VDD 50V
Rise time
tr *
td(off) *
-
65
-
ns
VGS=10V
-
130
-
ns
RL=3.3
Turn-off delay time
Fall time
tf *
-
180
-
ns
RG=10
Total gate charge
Qg *
-
50
-
nC
ID=30A, VDD 50V
Gate-source charge
Gate-drain charge
Qgs *
Qgd *
-
6
15
-
nC
nC
VGS=10V
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage
Symbol
VSD *
Min.
Typ.
Max.
Unit
-
-
1.5
V
Conditions
Is=30A, VGS=0V
*Pulsed
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2/6
2011.08 - Rev.A
Data Sheet
RSJ300N10
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics(Ⅰ)
Fig.2 Typical Output Characteristics(Ⅱ)
30
30
Ta=25°C
Pulsed
25
VGS= 10V
VGS= 4.5V
VGS= 4.0V
Ta=25°C
Pulsed
VGS= 10V
VGS= 4.5V
VGS= 4.0V
25
DRAIN CURRENT : ID[A]
DRAIN CURRENT : ID[A]
VGS= 3.0V
20
VGS= 3.0V
15
10
5
20
15
10
5
VGS= 2.5V
0
0
0
0.2
0.4
0.6
0.8
1
0
4
6
8
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.3 Typical Transfer Characteristics
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅰ)
10
100
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
Ta=25°C
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
VDS= 10V
Pulsed
DRAIN CURRENT : ID[A]
2
DRAIN-SOURCE VOLTAGE : VDS[V]
100
0.1
0.01
VGS= 4.0V
VGS= 4.5V
VGS= 10V
.
10
0.001
0
1
2
0.01
3
0.1
1
10
GATE-SOURCE VOLTAGE : VGS[V]
DRAIN-CURRENT : ID[A]
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅱ)
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅲ)
1000
100
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
1000
VGS= 10V
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
VGS= 2.5V
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
100
10
VGS= 4.5V
Pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
100
10
0.1
1
10
100
0.1
DRAIN-CURRENT : ID[A]
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1
10
DRAIN-CURRENT : ID[A]
100
2011.08 - Rev.A
Data Sheet
RSJ300N10
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅳ)
Fig.8 Forward Transfer Admittance
vs. Drain Current
1000
100
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
VGS= 4.0V
Pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
100
10
0.1
1
10
VDS= 10V
Pulsed
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
0.01
100
0.1
1
Fig.9 Reverse Drain Current
vs. Sourse-Drain Voltage
Fig.10 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[mΩ]
VGS=0V
Pulsed
SOURCE CURRENT : Is [A]
100
100
100
10
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
0.01
ID= 15.0A
Ta=25°C
Pulsed
80
ID= 30.0A
60
40
20
0
0
0.5
1
1.5
0
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.11 Switching Characteristics
2
4
6
8
GATE-SOURCE VOLTAGE : VGS[V]
10
Fig.12 Dynamic Input Characteristics
10
10000
tf
1000
GATE-SOURCE VOLTAGE : VGS [V]
Ta=25°C
VDD=50V
VGS=10V
RG=10Ω
Pulsed
td(off)
SWITCHING TIME : t [ns]
10
DRAIN-CURRENT : ID[A]
DRAIN-CURRENT : ID[A]
100
td(on)
10
tr
1
8
6
4
Ta=25°C
VDD= 50V
ID= 30A
RG=10Ω
Pulsed
2
0
0.01
0.1
1
10
100
0
DRAIN-CURRENT : ID[A]
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10
20
30
40
50
TOTAL GATE CHARGE : Qg [nC]
4/6
2011.08 - Rev.A
Data Sheet
RSJ300N10
Fig.13 Typical Capacitance
vs. Drain-Source Voltage
Fig.14 Maximum Safe Operating Aera
10000
1000
Operation in this area is limited by RDS(ON)
(VGS=10V)
Ciss
DRAIN CURRENT : ID (A)
CAPACITANCE : C [pF]
100
1000
Crss
100
Coss
PW =100us
10
1
PW =1ms
PW = 10ms
0.1
Ta=25°C
f=1MHz
VGS=0V
DC operation
TC=25°C
Single Pulse
10
0.01
0.01
0.1
1
10
100
1000
0.1
1
10
100
1000
DRAIN-SOURCE VOLTAGE : VDS[V]
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width
NORMARIZED TRANSIENT THERMAL
RESISTANCE : r (t)
10
1
0.1
0.01
Ta = 25°C
Single Pulse
Rth(ch-a)(t) = r(t)×Rth(ch-a)
Rth(ch-a) = 65.8 °C/W
0.001
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE WIDTH : Pw(s)
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5/6
2011.08 - Rev.A
Data Sheet
RSJ300N10
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
ton
Fig.1-1 Switching Time Measurement Circuit
90%
td(off)
tr
tf
toff
Fig.1-2 Switching Waveforms
VG
VGS
ID
VDS
Qg
RL
IG(Const.)
VGS
D.U.T.
Qgs
Qgd
VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
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Fig.2-2 Gate Charge Waveform
6/6
2011.08 - Rev.A
Notice
Notes
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R1120A