SW4N60DA

SW4N60DA
N-channel Enhanced mode TO-252/TO-220F/TO-251S MOSFET
Features






TO-220F
TO-252
BVDSS : 600V
TO-251S
: 4A
ID
High ruggedness
Low RDS(ON) (Typ3.35Ω)@VGS=10V
Low Gate Charge (Typ 9.6nC)
Improved dv/dt Capability
100% Avalanche Tested
Application:DC-DC,LED
RDS(ON) : 3.35Ω
1
2
1
3
1
2
2
2
3
3
1
1. Gate 2. Drain 3. Source
3
General Description
This power MOSFET is produced with advanced technology of SAMWIN.
This technology enable the power MOSFET to have better characteristics, including fast
switching time, low on resistance, low gate charge and especially excellent avalanche
characteristics.
Order Codes
Item
Sales Type
Marking
Package
Packaging
1
SW D 4N60DA
SW4N60DA
TO-252
REEL
2
SW F 4N60DA
SW4N60DA
TO-220F
TUBE
3
SW SI 4N60DA
SW4N60DA
TO-251S
TUBE
Absolute maximum ratings
Value
TO-252 TO-220F TO-251S
Unit
600
V
Continuous drain current (@TC=25oC)
4*
A
Continuous drain current (@TC=100oC)
2.5*
A
16
A
±30
V
Symbol
VDSS
ID
Parameter
Drain to source voltage
IDM
Drain current pulsed
VGS
Gate to source voltage
EAS
Single pulsed avalanche energy
(note 2)
171.2
mJ
EAR
Repetitive avalanche energy
(note 1)
24.3
mJ
Peak diode recovery dv/dt
(note 3)
5
V/ns
dv/dt
PD
TSTG, TJ
TL
(note 1)
Total power dissipation (@TC=25oC)
109.6
18.9
140.2
W
Derating factor above 25oC
0.88
0.15
0.83
W/oC
Operating junction temperature & storage temperature
Maximum lead temperature for soldering
purpose, 1/8 from case for 5 seconds.
-55 ~ + 150
oC
300
oC
*. Drain current is limited by junction temperature.
Thermal characteristics
Value
Symbol
Parameter
TO-252 TO-220F TO-251S
Unit
Rthjc
Thermal resistance, Junction to case
1.14
6.6
1.2
oC/W
Rthja
Thermal resistance, Junction to ambient
91.3
55
93
oC/W
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.
Oct. 2015. Rev. 2.0
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SW4N60DA
Electrical characteristic ( TC = 25oC unless otherwise specified )
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Off characteristics
Drain to source breakdown voltage
VGS=0V, ID=250uA
ΔBVDSS
/ ΔTJ
Breakdown voltage temperature
coefficient
ID=250uA, referenced to 25oC
IDSS
Drain to source leakage current
BVDSS
600
V
V/oC
0.42
VDS=600V, VGS=0V
1
uA
VDS=480V, TC=125oC
50
uA
Gate to source leakage current, forward
VGS=30V, VDS=0V
100
nA
Gate to source leakage current, reverse
VGS=-30V, VDS=0V
-100
nA
4.5
V
3.65
Ω
IGSS
On characteristics
VGS(TH)
Gate threshold voltage
VDS=VGS, ID=250uA
RDS(ON)
Drain to source on state resistance
VGS=10V, ID=1.5A
Forward transconductance
VDS=30V, ID=2A
Gfs
2.5
3.35
3
S
Dynamic characteristics
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer capacitance
14
td(on)
Turn on delay time
9
tr
td(off)
tf
Qg
Rising time
Turn off delay time
442
VGS=0V, VDS=25V, f=1MHz
52
VDS=300V, ID=4A, RG=25Ω
(note 4,5)
pF
21
ns
19
Fall time
21
9.6
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
VDS=480V, VGS=10V, ID=4A
(note 4,5)
nC
2.2
3.4
Source to drain diode ratings characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
4
A
Pulsed source current
Integral reverse p-n Junction
diode in the MOSFET
16
A
Diode forward voltage drop.
IS=4A, VGS=0V
1.4
V
trr
Reverse recovery time
Qrr
Reverse recovery charge
IS=4A, VGS=0V,
dIF/dt=100A/us
IS
Continuous source current
ISM
VSD
353
ns
1.8
uC
※. Notes
1.
Repeatitive rating : pulse width limited by junction temperature.
2.
L = 85.6mH, IAS = 2A, VDD = 50V, RG=25Ω, Starting TJ = 25oC
3.
ISD ≤ 4A, di/dt = 100A/us, VDD ≤ BVDSS, Staring TJ =25oC
4.
Pulse Test : Pulse Width ≤ 300us, duty cycle ≤ 2%.
5.
Essentially independent of operating temperature.
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Oct. 2015. Rev. 2.0
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SW4N60DA
Fig. 1. On-state characteristics
Fig. 3. Gate charge characteristics
Fig 5. Breakdown Voltage Variation
vs. Junction Temperature
Fig. 2. On-resistance variation vs.
drain current and gate voltage
Fig. 4. On state current vs. diode
forward voltage
Fig. 6. On resistance variation
vs. junction temperature
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SW4N60DA
Fig. 7. Maximum safe operating area(TO-252)
Fig. 8. Maximum safe operating area(TO-220F)
Fig. 9. Maximum safe operating area(TO-251S)
Fig. 10. Capacitance Characteristics
Fig. 11. Transient thermal response curve(TO252)
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SW4N60DA
Fig. 12. Transient thermal response curve(TO-220F)
Fig. 13. Transient thermal response curve(TO-251S)
Fig. 14. Gate charge test circuit & waveform
VGS
Same type
as DUT
QG
10V
VDS
VGS
QGS
QGD
DUT
2.5mA
Charge(nC)
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.
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SW4N60DA
Fig. 15. Switching time test circuit & waveform
VDS
90%
RL
RGS
VDS
VDD
10VIN
DUT
10%
10%
VIN
td(on)
tf
td(off)
tr
tON
tOFF
Fig. 16. Unclamped Inductive switching test circuit & waveform
Fig. 17. Peak diode recovery dv/dt test circuit & waveform
DUT
+ VDS
10V
VGS (DRIVER)
L
IS
di/dt
IS (DUT)
IRM
VDS
RG
10VGS
Diode reverse current
VDD
Diode recovery dv/dt
Same type
as DUT
VDS (DUT)
*. dv/dt controlled by RG
*. Is controlled by pulse period
VF
VDD
Body diode forward voltage drop
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Oct. 2015. Rev. 2.0
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SW4N60DA
DISCLAIMER
* All the data & curve in this document was tested in XI’AN SEMIPOWER TESTING & APPLICATION CENTER.
* This product has passed the PCT,TC,HTRB,HTGB,HAST,PC and Solderdunk reliability testing.
* Qualification standards can also be found on the Web site (http://www.semipower.com.cn)
* Suggestions for improvement are appreciated, Please send your suggestions to [email protected]
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