INTERSIL RFD4N06LSM

RFD4N06L, RFD4N06LSM
Data Sheet
4A, 60V, 0.600 Ohm, Logic Level,
N-Channel Power MOSFETs
File Number
2837.1
Features
• 4A, 60V
The RFD4N06L, RFD4N06LSM are N-Channel enhancement
mode silicon gate power field effect transistors specifically
designed for use with logic level (5 volt) driving sources in
applications such as programmable controllers, automotive
switching, and solenoid drivers. This performance is
accomplished through a special gate oxide design which
provides full rated conduction at gate biases in the 3-5 volt
range, thereby facilitating true on-off power control from logic
circuit supply voltages.
Formerly developmental type TA09520.
• rDS(ON) = 0.600Ω
• Design Optimized for 5 Volt Gate Drive
• Can be Driven Directly From Q-MOS, N-MOS,
or TTL Circuits
• SOA is Power Dissipation Limited
• 175oC Rated Junction Temperature
• Logic Level Gate
• High Input Impedance
• Related Literature
Ordering Information
PART NUMBER
June 1999
PACKAGE
BRAND
RFD4N06L
TO-251AA
RFD4N06L
RFD4N06LSM
TO-252AA
RFD4N06LSM
- TB334 “Guidelines for Soldering Surface Mount
Components to PC Boards”
Symbol
D
NOTE: When ordering, use the entire part number.
G
S
Packaging
JEDEC TO-251AA
JEDEC TO-252AA
SOURCE
DRAIN
GATE
DRAIN
(FLANGE)
DRAIN
(FLANGE)
GATE
SOURCE
6-189
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
RFD4N06L, RFD4N06LSM
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified
Drain to Source Breakdown Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS
Drain to Gate Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Derated above 25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
RFD4N06L
RFD4N06LSM
60
60
±10
4
10
30
0.20
-55 to 175
UNITS
V
V
V
A
A
W
W/oC
oC
300
260
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 150oC.
Electrical Specifications
TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Drain to Source Breakdown Voltage
BVDSS
ID = 1mA, VGS = 0V
60
-
-
V
Gate to Threshold Voltage
VGS(TH)
VGS = VDS, ID = 250µA
1
-
2.5
V
TC = 25oC, VDS = 50V, VGS = 0V
TC = 125oC, VDS = 50V, VGS = 0V
-
-
1
µA
-
-
50
µA
VGS = 10V, VDS = 0V
-
-
100
nA
ID = 1A, VGS = 5V
-
-
0.8
V
ID = 2A, VGS = 5V
-
-
2.0
V
ID = 4A, VGS = 7.5V
-
-
4.0
V
ID = 1A, VGS = 5V
-
-
0.600
Ω
-
-
4.5
V
-
-
20
ns
-
-
130
ns
td(OFF)
-
-
40
ns
tf
-
-
160
ns
-
-
8
nC
-
-
5
nC
Zero Gate Voltage Drain Current
IDSS
Gate to Source Leakage Current
IGSS
Drain to Source On Voltage (Note 2)
VDS(ON)
Drain to Source On Resistance (Note 2)
Forward Transconductance (Note 2)
rDS(ON)
V(plateau) VDS = 15V, ID = 4A
Turn-On Delay Time
td(ON)
Rise Time
tr
Turn-Off Delay Time
Fall Time
Total Gate Charge
(Gate to Source + Gate to Drain)
Gate Charge at 5V
Threshold Gate Charge
Thermal Resistance Junction to Case
VDD = 30V, ID = 1A, RGS = 6.25Ω,
VGS = 5V
Qg(TOT)
VGS = 0-10V
Qg(5)
VGS = 0-5V
Qg(TH)
VGS = 0-1V
VDD = 48V,
ID = 2A,
RL = 24Ω
RθJC
-
-
1
nC
-
-
5
oC/W
Source to Drain Diode Specifications
PARAMETER
Source to Drain Diode Voltage (Note 2)
Reverse Recovery Time
SYMBOL
VSD
trr
TEST CONDITIONS
MIN
TYP
MAX
UNITS
ISD = 1A
-
-
1.4
V
ISD = 2A, dISD/dt = 100A/µs
-
150
-
ns
NOTES:
2. Pulsed: pulse duration = 300µs max, duty cycle = 2%.
3. Repetitive rating: pulse width limited by maximum junction temperature.
6-190
RFD4N06L, RFD4N06LSM
Unless Otherwise Specified
1.2
5
1.0
4
ID, DRAIN CURRENT (A)
POWER DISSIPATION MULTIPLIER
Typical Performance Curves
0.8
0.6
0.4
3
2
1
0.2
0
0
25
50
75
100
125
0
25
150
50
75
100
125
TC, CASE TEMPERATURE (oC)
TC, CASE TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
1.0
TJ = MAX RATED
TC = 25oC
PULSE DURATION = 80µs
TC = 25oC
12
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
10
OPERATION IN THIS AREA
LIMITED BY rDS(ON)
VGS = 10V
VGS = 7.5V
10
8
6
VGS = 5V
4
4.5V
4V
3.5V
3V
2.5V
2V
7
2
0.1
1
0
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
0
100
1
2
3
4
5
6
VDS, DRAIN TO SOURCE VOLTAGE (V)
FIGURE 4. SATURATION CHARACTERISTICS
1.6
8
VGS = 5V
1.4 PULSE DURATION = 80µs
VDS = 10V
PULSE DURATION = 80µs
DUTY CYCLE ≤ 2%
7
rDS(ON), DRAIN TO SOURCE
ON RESISTANCE(Ω)
IDS(ON), DRAIN TO SOURCE CURRENT (A)
FIGURE 3. FORWARD BIAS SAFE OPERATING AREA
6
TC = 25oC
5
TC = -40oC
4
TC = 125oC
3
2
TC = 125oC
1
0
150
2
3
4
5
VGS, GATE TO SOURCE VOLTAGE (V)
FIGURE 5. TRANSFER CHARACTERISTICS
6-191
TC = 125oC
1.0
0.8
TC = 25oC
0.6
TC = -40oC
0.4
0.2
TC = -40oC
1
1.2
6
0
0
2
4
6
ID, DRAIN CURRENT (A)
8
10
FIGURE 6. DRAIN TO SOURCE ON RESISTANCE vs DRAIN
CURRENT
RFD4N06L, RFD4N06LSM
Typical Performance Curves
2
VGS = 5V, ID = 2A
NORMALIZED GATE
1.5
THRESHOLD VOLTAGE
1
0.5
0
-50
0
50
100
1.5
1
0.5
0
-50
200
150
VGS = VDS, ID = 250µA
0
TJ, JUNCTION TEMPERATURE (oC)
FIGURE 7. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
200
150
10
60
VGS = 0V, f = 1MHz
CISS = CGS + CGD
CRSS = CGD
COSS ≈ CDS + CGD
300
VDS, DRAIN TO SOURCE VOLTAGE (V)
C, CAPACITANCE (pF)
100
FIGURE 8. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
400
200
CISS
100
COSS
CRSS
0
50
TJ, JUNCTION TEMPERATURE (oC)
RL = 4Ω
IG(REF) = 0.5mA
VGS = 5V
45
8
GATE SOURCE
VOLTAGE
VDD = BVDSS
VDD = BVDSS
30
6
4
0.75BVDSS
0.50BVDSS
0.25BVDSS
15
2
DRAIN SOURCE VOLTAGE
0
0
0
10
20
30
40
VGS, GATE TO SOURCE VOLTAGE (V)
NORMALIZED DRAIN TO
SOURCE ON RESISTANCE
2
Unless Otherwise Specified (Continued)
50
20
VDS, DRAIN TO SOURCE VOLTAGE (V)
IG(REF)
IG(ACT)
t, TIME (µs)
80
IG(REF)
IG(ACT)
NOTE: Refer to Intersil Application Notes AN7254 and AN7260.
FIGURE 9. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
FIGURE 10. NORMALIZED SWITCHING WAVEFORMS FOR
CONSTANT GATE CURRENT
Test Circuits and Waveforms
tON
tOFF
td(ON)
td(OFF)
tf
tr
RL
VDS
90%
90%
+
RG
-
VDD
10%
10%
0
DUT
90%
VGS
VGS
0
FIGURE 11. SWITCHING TIME TEST CIRCUIT
6-192
10%
50%
50%
PULSE WIDTH
FIGURE 12. RESISTIVE SWITCHING WAVEFORMS
RFD4N06L, RFD4N06LSM
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
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