VSMG285011RG, VSMG285011G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 850 nm, GaAlAs, DH FEATURES VSMG285011RG VSMG285011G • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 • Peak wavelength: λp = 850 nm • High reliability • High radiant power • High radiant intensity • Angle of half intensity: ϕ = ± 12° • Low forward voltage • Suitable for high pulse current operation • Terminal configurations: Gullwing or reserve gullwing • Package matches with detector VEMD2000X01 series DESCRIPTION • Floor life: 4 weeks, MSL 2a, acc. J-STD-020 VSMG28511 series are infrared, 850 nm emitting diodes in GaAlAs (DH) technology with high radiant power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Data transmission • IR-illumination (CCTV) • Miniature light barrier • Photointerrupters • Optical switch • Shaft encoders • IR emitter source for proximity applications • Smoke detectors PRODUCT SUMMARY Ie (mW/sr) ϕ (deg) λp (nm) tr (ns) VSMG285011RG 40 ± 12 850 20 VSMG285011G 40 ± 12 850 20 COMPONENT Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMG285011RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMG285011G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note • MOQ: minimum order quantity Rev. 1.0, 05-Aug-14 Document Number: 84229 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMG285011RG, VSMG285011G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V mA Reverse voltage Forward current Surge forward current tp = 100 μs IF 100 IFSM 1 A PV 180 mW Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature 100 °C -40 to +85 °C Tstg -40 to +100 °C Tsd 260 °C RthJA 250 K/W Acc. figure 9, J-STD-020 Thermal resistance junction/ambient J-STD-051, leads 7 mm, soldered on PCB 120 200 180 IF - Forward Current (mA) PV - Power Dissipation (mW) Tj Tamb 160 140 120 100 80 RthJA = 250 K/W 60 40 20 100 80 60 RthJA = 250 K/W 40 20 0 0 0 20 40 60 80 0 100 Tamb - Ambient Temperature (°C) 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT IF = 100 mA, tp = 100 μs VF 1.25 1.5 1.8 V IF = 1 A, tp = 100 μs VF 2.9 V IF = 1 mA TKVF -1.8 mV/K VR = 5 V IR VR = 0 V, f = 1 MHz, E = 0 mW/cm2 CJ IF = 100 mA, tp = 100 μs Ie 10 μA 60 mW/sr 45 20 40 pF IF = 1 A, tp = 100 μs Ie 320 IF = 100 mA, tp = 100 μs φe 40 mW IF = 100 mA TKφe -0.35 %/K Peak wavelength IF = 30 mA λp Spectral bandwidth IF = 30 mA Δλ 35 nm Temperature coefficient of λp IF = 30 mA TKλp 0.25 nm/K Rise time IF = 100 mA, 20 % to 80 % tr 20 ns Fall time IF = 100 mA, 20 % to 80 % tf 20 ns IDC = 70 mA, IAC = 30 mA pp fc 23 MHz Radiant power Temperature coefficient of φe ϕ Angle of half intensity Cut-off frequency Rev. 1.0, 05-Aug-14 mW/sr ± 12 830 850 deg 870 nm Document Number: 84229 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMG285011RG, VSMG285011G www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 tp = 100 μs Ie - Radiant Intensity (mW/sr) IF - Forward Current (mA) 1000 tp = 100 μs 100 10 100 10 1 1 0.1 1.0 1.5 2.0 2.5 3.0 1 VF - Forward Voltage (V) IF = 100 mA tp = 20 ms 1.60 1.55 1.50 1.45 1.40 0 20 40 60 80 115 IF = 100 mA tp = 20 ms 110 105 100 95 90 85 80 -60 -40 -20 100 Tamb - Ambient Temperature (°C) 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 4 - Forward Voltage vs. Ambient Temperature Fig. 7 - Relative Radiant Intensity vs. Ambient Temperature 110 1.25 IF = 100 mA tp = 20 ms 105 100 Φe, rel - Relative Radiant Power VF, rel - Relative Forward Voltage (%) 1000 Fig. 6 - Radiant Intensity vs. Forward Current Ie, rel - Relative Radiant Intensity (%) VF - Forward Voltage (V) 1.70 -60 -40 -20 100 IF - Forward Current (mA) Fig. 3 - Forward Current vs. Forward Voltage 1.65 10 1.0 0.75 0.5 0.25 95 0 -60 -40 -20 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 5 - Relative Forward Voltage vs. Ambient Temperature Rev. 1.0, 05-Aug-14 800 16972 850 900 λ- Wavelength (nm) Fig. 8 - Relative Radiant Power vs. Wavelength Document Number: 84229 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMG285011RG, VSMG285011G www.vishay.com Vishay Semiconductors DRYPACK 0° 10° 20° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0.4 0.6 0.2 ϕ - Angular Displacement Ie, rel - Relative Radiant Intensity 30° Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020. DRYING 0 λ - Wavelength (nm) Fig. 9 - Relative Radiant Intensity vs. Angular Displacement In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. SOLDER PROFILE 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 50 100 150 200 250 300 Time (s) Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.0, 05-Aug-14 Document Number: 84229 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMG285011RG, VSMG285011G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMG285011RG 0.3 Ø 1.8 ± 0.1 Z 1.6 0.19 2.77 ± 0.2 0.05 ± 0.1 0.4 2.2 2.2 5.8 ± 0.2 Z 20:1 1.1 ± 0.1 0.4 0.5 2.3 ± 0.2 0.254 exposed copper 2.3 ± 0.2 Cathode Pin ID 1.7 Anode 0.75 Solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.1 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5391.02-4 Issue: 2; 18.03.10 21517 Rev. 1.0, 05-Aug-14 Document Number: 84229 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMG285011RG, VSMG285011G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMG285011G Ø 1.8 2.77 ± 0.2 0.3 0.4 0.19 0.05 1.6 X 2.2 2.2 4.2 ± 0.2 X 20:1 exposed copper 0.6 Cathode 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 Anode Pin ID technical drawings according to DIN specifications 0.75 Solder pad proposal acc. IPC 7351 Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.02-4 Issue: 4; 18.03.10 21488 Rev. 1.0, 05-Aug-14 Document Number: 84229 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMG285011RG, VSMG285011G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMG285011RG Unreel direction X 2. Ø 62 ± 0.5 Reel 0 5± Ø 13 ± 0.5 Ø 330 ± 1 .5 Tape position coming out from reel 6000 pcs/reel Label posted here Technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Devicce Lead I Lead II Collector Emitter Cathode Anode Anode Cathode Ø 1.55 ± 0.05 I VEMT2000 VEMT2500 X 2:1 4 ± 0.1 2 ± 0.05 VEMD2000 5.5 ± 0.05 VEMD2500 VSMB2000 VSMG2000 VSMY2850RG 3.05 ± 0.1 II 12 ± 0.3 Terminal position in tape 1.75 ± 0.1 Empty (400 mm min.) 4 ± 0.1 Drawing-No.: 9.800-5100.01-4 Issue: 2; 18.03.10 21572 Rev. 1.0, 05-Aug-14 Document Number: 84229 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMG285011RG, VSMG285011G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMG285011G Reel X Unreel direction 5± Ø 62 ± 0.5 2. Ø 13 ± 0.5 Ø 330 ± 1 0.5 Tape position coming out from reel 6000 pcs/reel Label posted here technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Ø 1.55 ± 0.05 Devicce Lead I Lead II Collector Emitter Cathode Anode Anode Cathode I VEMT2020 VEMT2520 X 2:1 4 ± 0.1 2 ± 0.05 VSMB2020 VEMD2020 VEMD2520 VSMY2850G 3.05 ± 0.1 II 4 ± 0.1 5.5 ± 0.05 VSMG2020 12 ± 0.3 Terminal position in tape 1.75 ± 0.1 Empty (400 mm min.) Drawing-No.: 9.800-5091.01-4 Issue: 3; 18.03.10 21571 Rev. 1.0, 05-Aug-14 Document Number: 84229 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000