SEMiX453GD176HDc Absolute Maximum Ratings Symbol Conditions Values Unit IGBT VCES IC Tj = 150 °C 1700 V Tc = 25 °C 444 A Tc = 80 °C 315 A 300 A ICnom ICRM SEMiX® 33c Trench IGBT Modules ICRM = 2xICnom 600 A -20 ... 20 V 10 µs -55 ... 150 °C Tc = 25 °C 545 A Tc = 80 °C 365 A 300 A VGES tpsc VCC = 1000 V VGE ≤ 20 V VCES ≤ 1700 V Tj = 125 °C Tj Inverse diode IF SEMiX453GD176HDc Tj = 150 °C IFnom Features IFRM IFRM = 2xIFnom 600 A IFSM tp = 10 ms, sin 180°, Tj = 25 °C 2900 A -40 ... 150 °C • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • UL recognised file no. E63532 Module Typical Applications* Visol • AC inverter drives • UPS • Electronic welders Characteristics Tj It(RMS) Tstg Symbol AC sinus 50Hz, t = 1 min Conditions min. 600 A -40 ... 125 °C 4000 V typ. max. Unit Tj = 25 °C 2 2.45 V Tj = 125 °C 2.45 2.9 V Tj = 25 °C 1 1.2 V Tj = 125 °C 0.9 1.1 V Tj = 25 °C 3.3 4.2 mΩ 5.2 6.0 mΩ 5.8 6.4 V 3 mA IGBT VCE(sat) IC = 300 A VGE = 15 V chiplevel VCE0 rCE VGE = 15 V Tj = 125 °C VGE(th) VGE=VCE, IC = 12 mA ICES VGE = 0 V VCE = 1700 V Cies Coes Cres VCE = 25 V VGE = 0 V QG VGE = - 8 V...+ 15 V RGint Tj = 25 °C VCC = 1200 V IC = 300 A td(on) tr Eon RG on = 4.3 Ω RG off = 4.3 Ω 5.2 Tj = 25 °C Tj = 125 °C mA f = 1 MHz 26.4 nF f = 1 MHz 1.10 nF f = 1 MHz Tj = 125 °C 0.88 nF 2799 nC 2.50 Ω 335 ns Tj = 125 °C 70 ns Tj = 125 °C 215 mJ Tj = 125 °C 990 ns tf Tj = 125 °C 150 ns Eoff Tj = 125 °C 125 mJ td(off) Rth(j-c) per IGBT 0.071 K/W GD © by SEMIKRON Rev. 1 – 24.06.2010 1 SEMiX453GD176HDc Characteristics Symbol Conditions Inverse diode VF = VEC IF = 300 A VGE = 0 V chip VF0 rF SEMiX® 33c IRRM Qrr Trench IGBT Modules Err Rth(j-c) SEMiX453GD176HDc • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • UL recognised file no. E63532 Typical Applications* • AC inverter drives • UPS • Electronic welders Tj = 25 °C Tj = 125 °C typ. max. Unit 1.5 1.70 V 1.4 1.6 V Tj = 25 °C 0.9 1.1 1.3 V Tj = 125 °C 0.7 0.9 1.1 V Tj = 25 °C 1.3 1.3 1.3 mΩ 1.8 1.8 mΩ Tj = 125 °C IF = 300 A Tj = 125 °C di/dtoff = 4700 A/µs T = 125 °C j VGE = -15 V T j = 125 °C VCC = 1200 V per diode 1.8 350 A 115 µC 65 mJ 0.11 K/W Module LCE RCC'+EE' Features min. res., terminal-chip Rth(c-s) per module Ms to heat sink (M5) 20 nH TC = 25 °C 0.7 mΩ TC = 125 °C 1 mΩ 0.014 to terminals (M6) Mt K/W 3 5 Nm 2.5 5 Nm Nm w 900 g Temperatur Sensor R100 Tc=100°C (R25=5 kΩ) B100/125 R(T)=R100exp[B100/125(1/T-1/T100)]; T[K]; 493 ± 5% Ω 3550 ±2% K GD 2 Rev. 1 – 24.06.2010 © by SEMIKRON SEMiX453GD176HDc Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC) Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG) Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic © by SEMIKRON Rev. 1 – 24.06.2010 3 SEMiX453GD176HDc Fig. 7: Typ. switching times vs. IC Fig. 8: Typ. switching times vs. gate resistor RG Fig. 9: Typ. transient thermal impedance Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE' Fig. 11: Typ. CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode recovery charge 4 Rev. 1 – 24.06.2010 © by SEMIKRON SEMiX453GD176HDc SEMiX 33c pinout This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. © by SEMIKRON Rev. 1 – 24.06.2010 5