Datasheet

AOT286L/AOB286L
80V N-Channel MOSFET
General Description
Product Summary
The AOT286L/AOB286L uses Trench MOSFET
VDS
technology that is uniquely optimized to provide the most
ID (at VGS=10V)
80V
70A
efficient high frequency switching performance. Both
RDS(ON) (at VGS=10V)
< 6.0mΩ (< 5.7mΩ∗)
conduction and switching power losses are minimized
RDS(ON) (at VGS=6V)
< 7.9mΩ (< 7.6mΩ∗)
due to an extremely low combination of RDS(ON), Ciss and
Coss. This device is ideal for boost converters and
synchronous rectifiers for consumer, telecom, industrial
power supplies and LED backlighting.
100% UIS Tested
100% Rg Tested
AOB286L
AOT286L
TO-263
TO220
Top View
Top View
Bottom View
D
Bottom View
D
D
D
D
G
G
D
S
S
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TC=25°C
Continuous Drain
Current G
Pulsed Drain Current C
Avalanche Current
C
Avalanche energy L=0.1mH C
TC=25°C
Power Dissipation B
TA=25°C
Power Dissipation
A
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Case
Steady-State
Steady-State
A
A
IAS
50
A
EAS
125
mJ
167
W
83
2.1
RθJA
RθJC
W
1.3
TJ, TSTG
Symbol
t ≤ 10s
V
13
PDSM
TA=70°C
±20
10.5
PD
TC=100°C
Units
V
245
IDSM
TA=70°C
Maximum
80
55
IDM
TA=25°C
Continuous Drain
Current
S
70
ID
TC=100°C
S
G
G
-55 to 175
Typ
12
48
0.7
°C
Max
15
60
0.9
Units
°C/W
°C/W
°C/W
* Surface mount package TO263
Rev.2 0: May 2013
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Page 1 of 6
AOT286L/AOB286L
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Min
ID=250µA, VGS=0V
Zero Gate Voltage Drain Current
V
Gate-Body leakage current
VDS=0V, VGS=±20V
Gate Threshold Voltage
VDS=VGS,ID=250µA
2.3
ID(ON)
On state drain current
VGS=10V, VDS=5V
245
±100
nA
2.7
3.3
V
5.0
6.0
8.1
9.8
6.1
7.9
mΩ
VGS=10V, ID=20A
TO263
4.7
5.7
mΩ
VGS=6V, ID=20A
TO263
5.8
7.6
mΩ
VGS=10V, ID=20A
TO220
VGS=6V, ID=20A
TO220
TJ=125°C
A
gFS
Forward Transconductance
VDS=5V, ID=20A
60
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.7
IS
Maximum Body-Diode Continuous Current G
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=40V, f=1MHz
VGS=10V, VDS=40V, ID=20A
Gate Source Charge
0.6
mΩ
S
1
V
70
A
3142
pF
435
pF
43
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg(10V)
Total Gate Charge
Qgs
µA
5
IGSS
Coss
Units
1
TJ=55°C
Static Drain-Source On-Resistance
Max
80
VDS=80V, VGS=0V
VGS(th)
RDS(ON)
Typ
pF
1.3
2.0
Ω
44.5
63
nC
12
nC
Qgd
Gate Drain Charge
8
nC
tD(on)
Turn-On DelayTime
13.5
ns
tr
Turn-On Rise Time
11
ns
tD(off)
Turn-Off DelayTime
32
ns
tf
Turn-Off Fall Time
11
ns
trr
Body Diode Reverse Recovery Time
IF=20A, dI/dt=500A/µs
29
Qrr
Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs
161
ns
nC
VGS=10V, VDS=40V, RL=2Ω,
RGEN=3Ω
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application
depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink,
assuming a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.
G. The maximum current limited by package.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev.2.0: May 2013
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Page 2 of 6
AOT286L/AOB286L
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
100
10V
VDS=5V
5V
80
80
6V
60
ID(A)
ID (A)
60
4.5V
40
40
20
20
125°C
Vgs=4V
25°C
0
0
0
1
2
3
4
1
5
3
4
5
6
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
10
Normalized On-Resistance
2.2
8
VGS=6V
RDS(ON) (mΩ
Ω)
2
6
4
VGS=10V
2
2
VGS=10V
ID=20A
1.8
1.6
1.4
VGS=6V
ID=20A
1.2
17
5
2
10
1
0.8
0
0
10
20
30
40
50
60
0
70
25
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
50
75
100
125
150
175
200
Temperature (°C)
0
Figure 4: On-Resistance vs. Junction Temperature
18
(Note E)
15
1.0E+02
ID=20A
1.0E+01
12
40
1.0E+00
9
IS (A)
RDS(ON) (mΩ
Ω)
125°C
125°C
1.0E-01
1.0E-02
6
1.0E-03
25°C
25°C
3
1.0E-04
1.0E-05
0
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Rev.2.0: May 2013
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0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
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AOT286L/AOB286L
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
4000
VDS=40V
ID=20A
3500
8
Capacitance (pF)
VGS (Volts)
3000
6
4
Ciss
2500
2000
1500
Coss
1000
2
500
0
Crss
0
0
10
20
30
40
50
0
60
80
TJ(Max)=175°C
TC=25°C
10µs
10µs
RDS(ON)
limited
10.0
DC
1.0
600
100µs
1ms
10ms
Power (W)
ID (Amps)
40
800
1000.0
100.0
20
VDS (Volts)
Figure 8: Capacitance Characteristics
Qg (nC)
Figure 7: Gate-Charge Characteristics
TJ(Max)=175°C
TC=25°C
0.1
0.0
0.01
0.1
1
17
5
2
10
400
200
10
100
0
0.0001
1000
0.001
0.01
0.1
1
10
0
Pulse Width (s)
18
Figure 10: Single Pulse Power Rating Junction-to-Case
VDS (Volts)
Figure 9: Maximum Forward Biased
Safe Operating Area (Note F)
(Note F)
Zθ JC Normalized Transient
Thermal Resistance
10
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
40
RθJC=0.9°C/W
1
PD
0.1
Single Pulse
Ton
T
0.01
1E-05
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Rev.2.0: May 2013
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Page 4 of 6
AOT286L/AOB286L
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
180
Power Dissipation (W)
IAR (A) Peak Avalanche Current
1000
TA=25°C
100
TA=100°C
TA=150°C
150
120
90
60
30
TA=125°C
10
0
1
10
100
1000
0
25
Time in avalanche, tA (µ
µs)
Figure 12: Single Pulse Avalanche capability
(Note C)
50
75
100
125
150
175
TCASE (°C)
Figure 13: Power De-rating (Note F)
1000
80
60
100
Power (W)
Current rating ID(A)
TA=25°C
40
17
5
2
10
10
20
0
0
25
50
75
100
125
150
1
0.001
175
TCASE (°C)
Figure 14: Current De-rating (Note F)
0.01
0.1
1
10
0100
1000
18
Pulse Width (s)
Figure 15: Single Pulse Power Rating Junction-toAmbient (Note H)
Zθ JA Normalized Transient
Thermal Resistance
100
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
40
RθJA=60°C/W
1
0.1
0.01
PD
0.001
Single Pulse
Ton
T
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)
Rev.2.0: May 2013
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Page 5 of 6
AOT286L/AOB286L
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
+ Vdd
DUT
Vgs
VDC
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
E AR = 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vds Isd
Vgs
Ig
Rev.2.0: May 2013
Vgs
L
Isd
+ Vdd
t rr
dI/dt
I RM
Vdd
VDC
-
IF
Vds
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Page 6 of 6