Freescale Semiconductor Data Sheet: Technical Data Document Number: MPX2300DT1 Rev. 11, 09/2015 MPX2300DT1, 0 to 40 kPa, Differential Compensated Pressure Sensor MPX2300DT1 Freescale Semiconductor has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. Chip Pak package Back view Features • Integrated temperature compensation and calibration • Ratiometric to supply voltage • Polysulfone case material (ISO 10993) • Provided in easy-to-use tape and reel MPX2300DT1 Case 98ASB13355C Typical applications • Medical diagnostics • Infusion pumps • Blood pressure monitors • Pressure catheter applications • Patient monitoring Front view 1 2 3 4 NOTE VS VOUT+ VOUT– GND The die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. Pinout Ordering information Pressure type Device name Shipping Package Device marking Gauge MPX2300DT1 Tape and Reel Differential 98ASB13355C Absolute • Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2010, 2012, 2014, 2015 Freescale Semiconductor, Inc. All rights reserved. XXXX = Device code XXX = Trace code Contents 1 2 3 4 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Package description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 4 4 4 5 5 6 Related Documentation The MPX2300DT1 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MPX2300DT1. In the Refine Your Result pane on the left, click on the Documentation link. MPX2300DT1 2 Sensors Freescale Semiconductor, Inc. 1 General Description The MPX2300DT1 pressure sensor has been designed for medical usage by combining the performance of Freescale's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: ISO 10993-5:1999, ISO 10993-10:2002, and ISO 10993-11:1993. A silicone dielectric gel covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance of the sensor. 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 1 Thin Film Temperature Compensation and Calibration Circuitry Transducer Sensing Element 2 3 VOUT+ VOUT– 4 GND Figure 1. Block diagram 1.2 Pinout VS VOUT+ VOUT– GND 1 2 3 4 Figure 2. Device pinout (front view) Table 1. Pin functions Pin Name 1 VS Function Voltage supply 2 VOUT+ Output voltage 3 VOUT– Output voltage 4 GND Ground MPX2300DT1 Sensors Freescale Semiconductor, Inc. 3 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Rating Symbol Value Unit Maximum pressure (backside) Pmax 125 PSI Storage temperature Tstg -25 to +85 °C Operating temperature TA +15 to +40 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 6 VDC, TA = 25 °C unless otherwise noted) Characteristics Symbol Min Typ Max Unit POP 0 — 300 mmHg Supply voltage VS — 6.0 10 VDC Supply current IO — 1.0 — mAdc VOFF -0.75 — 0.75 mV — 4.95 5.0 5.05 μV/V/mmHg VFSS 2.976 3.006 3.036 mV Linearity + Hysteresis — -1.5 — 1.5 %VFSS Accuracy VS = 6 V, P = 101 to 200 mmHg — -1.5 — 1.5 % Accuracy VS = 6 V, P = 201 to 300 mmHg — -3.0 — 3.0 % TCS -0.1 — +0.1 %/°C TCVFSS -0.1 — +0.1 %/°C TCVOFF -9.0 — +9.0 μV/°C ZIN 1800 — 4500 Ω ZOUT 270 — 330 Ω RCAL 97 100 103 mmHg tR — 1.0 — ms Pressure range (1) Zero pressure offset Sensitivity Full-scale span (2) (3) Temperature effect on sensitivity Temperature effect on full-scale span Temperature effect on offset(5) Input impedance Output impedance RCAL (150 kΩ)(6) Response time (7) (10% to 90%) (4) 1. Recommended voltage supply: 6 V ± 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above +10 V may induce additional error due to device self-heating. 2. Measured at 6.0 VDC excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference between full scale output and zero pressure offset. 3. Maximum deviation from end-point straight line fit at 0 and 200 mmHg. 4. Slope of end-point straight line fit to full scale span at 15 °C and +40 °C relative to +25 °C. 5. Slope of end-point straight line fit to zero pressure offset at 15 °C and +40 °C relative to +25 °C. 6. Offset measurement with respect to the measured sensitivity when a 150 k resistor is connected to VS and VOUT+ output. 7. For a 0 to 300 mmHg pressure step change. MPX2300DT1 4 Sensors Freescale Semiconductor, Inc. 3 Package Dimensions 3.1 Package description This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB13355C.pdf. A M C L F N B 1 2 3 V 4 K DETAIL A –T– D1 G J H FRONT VIEW E END VIEW AC NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 3. Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4. F AA AB AD D2 DETAIL A BACK VIEW DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD INCHES MIN MAX 0.240 0.260 0.350 0.370 0.140 0.150 0.012 0.020 0.014 0.022 0.088 0.102 0.123 0.128 0.045 0.055 0.037 0.047 0.007 0.011 0.120 0.140 0.095 0.105 0.165 0.175 0.223 0.239 0.105 0.115 0.095 0.107 0.015 0.035 0.120 0.175 0.100 0.115 MILLIMETERS MIN MAX 6.10 6.60 8.89 9.40 3.56 3.81 0.30 0.51 0.36 0.56 2.24 2.59 3.12 3.25 1.14 1.40 0.94 1.19 0.18 0.28 3.05 3.56 2.41 2.67 4.19 4.45 5.66 6.07 2.67 2.92 2.41 2.72 0.38 0.89 3.05 4.45 2.54 2.92 Case 98ASB1335C, Chip Pak package MPX2300DT1 Sensors Freescale Semiconductor, Inc. 5 4 Revision History Table 4. Revision history Revision number Revision date 9 10/2012 • Added Table 1. Pin Numbers on page 1. 10 09/2015 • Updated format. 11 09/2015 • Corrected pinout on first page and Section 1.2 and Table 1. • Replaced Figure 1, Block diagram. Description MPX2300DT1 6 Sensors Freescale Semiconductor, Inc. How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logos are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2010, 2012, 2014, 2015 Freescale Semiconductor, Inc. Document Number: MPX2300DT1 Rev. 11 09/2015