Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXC12DT1 Rev. 1.0, 09/2015 MPXC12DT1, 10 kPa, Uncompensated, Silicon Pressure Sensor MPXC12DT1 Freescale Semiconductor has developed high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the chip pak allows great flexibility in system design while providing an economic solution for the designer. This standard, uncompensated sensor permits manufacturers to design and add their own external temperature compensation and signal conditioning networks. Chip Pak package Back view Compensation techniques are simplified because of Freescale’s single element strain gauge design. Features MPXC12DT1 Case 98ASB13355C • Ratiometric to supply voltage • Polysulfone case material (ISO 10993) • Provided in easy-to-use tape and reel • Patented silicon shear stress strain gauge design Front view Typical applications Respiratory diagnostics NOTE 1 2 3 4 The die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. GND +VOUT +VS –VOUT • Pinout Ordering information Pressure type Device name Shipping Package Device marking Gauge MPXC12DTI Tape and reel 98ASB13355C Differential Absolute • Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2010, 2015 Freescale Semiconductor, Inc. All rights reserved. XXXX = Device code XXX = Trace code Contents 1 2 3 4 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Package description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 4 4 4 5 5 6 Related Documentation The MPXC12DT1 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MPXC12DT1. In the Refine Your Result pane on the left, click on the Documentation link. MPXC12DT1 2 Sensors Freescale Semiconductor, Inc. 1 General Description Freescale Semiconductor's biocompatible pressure sensors have been designed for medical usage by combining the performance of the shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The MPXC12DT1 does not come with gel on the backside of the device. This enables the customer to customize sensor with gel specific to the intended application space. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: ISO 10993-5:1999, ISO 10993-10:2002, and ISO 10993-11:1993. 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. +VS Sensing Element +VOUT –VOUT GND Figure 1. Block diagram 1.2 Pinout GND +VOUT +VS –VOUT 1 2 3 4 Figure 2. Device pinout (front view) Table 1. Pin functions Pin Name Function 1 GND 2 +VOUT Ground Output voltage 3 +VS Voltage supply 4 –VOUT Output voltage MPXC12DT1 Sensors Freescale Semiconductor, Inc. 3 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Symbol Value Unit Maximum pressure (backside) Rating Pmax 75 kPa Storage temperature Tstg -25 to +85 °C Operating temperature TA +15 to +40 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 3.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit POP 0 — 10 kPa Supply voltage VS — 3 6 VDC Supply current IO — 6.0 — mAdc Full-scale span(3) VFSS 45 65 80 mV Offset(4) VOFF 0 20 35 mV Sensitivity Pressure range(1) (2) ΔV/ΔP — 6.5 — mV/kPa Linearity — 0 — 10 %VFSS Pressure hysteresis (0 to 10 kPa) — — ±0.1 — %VFSS Temperature hysteresis (+15 °C to +40 °C) — — ±0.1 — %VFSS Input impedance Output impedance Response time (5) ZIN 400 — 550 Ω ZOUT 750 — 1250 Ω (10% to 90%) Warm-up(6) (7) Offset stability tR — 1.0 — ms — — 20 v ms — — ±0.5 — %VFSS 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXC12DT1 4 Sensors Freescale Semiconductor, Inc. 3 Package Dimensions 3.1 Package description This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB13355C.pdf. A M C L F N B 1 2 3 V 4 K DETAIL A –T– D1 G J H FRONT VIEW E END VIEW AC NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 3. Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4. F AA AB AD D2 DETAIL A BACK VIEW DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD INCHES MIN MAX 0.240 0.260 0.350 0.370 0.140 0.150 0.012 0.020 0.014 0.022 0.088 0.102 0.123 0.128 0.045 0.055 0.037 0.047 0.007 0.011 0.120 0.140 0.095 0.105 0.165 0.175 0.223 0.239 0.105 0.115 0.095 0.107 0.015 0.035 0.120 0.175 0.100 0.115 MILLIMETERS MIN MAX 6.10 6.60 8.89 9.40 3.56 3.81 0.30 0.51 0.36 0.56 2.24 2.59 3.12 3.25 1.14 1.40 0.94 1.19 0.18 0.28 3.05 3.56 2.41 2.67 4.19 4.45 5.66 6.07 2.67 2.92 2.41 2.72 0.38 0.89 3.05 4.45 2.54 2.92 Case 98ASB1335C, Chip Pak package MPXC12DT1 Sensors Freescale Semiconductor, Inc. 5 4 Revision History Table 4. Revision history Revision number Revision date 0 11/2010 • Initial release. 1 08/2015 • Updated format. Description MPXC12DT1 6 Sensors Freescale Semiconductor, Inc. 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All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logos are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2010, 2015 Freescale Semiconductor, Inc. Document Number: MPXC12DT1 Rev. 1.0 09/2015