MOTOROLA MPX2300

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by MPX2300D/D
SEMICONDUCTOR TECHNICAL DATA
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Motorola has developed a low cost, high volume, miniature pressure sensor package
which is ideal as a sub–module component or a disposable unit. The unique concept of
the Chip Pak allows great flexibility in system design while allowing an economic solution
for the designer. This new chip carrier package uses Motorola’s unique sensor die with its
patented, piezoresistive implant technology, along with the added feature of on–chip,
thin–film temperature compensation and calibration.
PRESSURE SENSORS
Features:
• Low Cost
• Patented piezoresistive strain gauge implant, temperature compensation
and calibration all integrated on a single, monolithic sensor die.
• Pressure Range Available: 0–300 mmHg
• Polysulfone (Mindell S–1000) Case Material (Medical, Class VI Approved)
CHIP PAK ELEMENT
CASE 423–03
Style 1
Motorola is offering the Chip Pak option package. Application–specific parts will have an “SPX” prefix, followed by a
four digit number, unique to the specific customer. Devices
will be shipped in a tape and reel packaging.
NOTE: The die and wire bonds are exposed on the front
side of the Chip Pak (pressure is applied to the backside of
the device). Front side die and wire protection must be
provided in the customer’s housing. Use caution when
handling the devices during all processes.
Pin Number, Style 1
1
2
3
4
VS
S+
S–
Ground
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Pmax
125
PSI
Burst Pressure
Pburst
1000
kPa
Supply Voltage
VSmax
10
Vdc
Tstg
85
°C
TA
+ 15 to + 40
°C
Overpressure (Backside)
Storage Temperature
Operating Temperature
Motorola’s MPX2300D Pressure Sensors. Motorola’s
MPX2300D pressure sensor has been designed for medical
usage by combining the performance of Motorola’s shear
stress pressure sensor design and the use of biomedically
approved materials. Materials with a proven history in
medical situations have been chosen to provide a sensor
that can be used with confidence in applications, such as
invasive blood pressure monitoring. It can be sterilized using
ethylene oxide. The portions of the pressure sensor that are
required to be biomedically approved are the rigid housing
and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
intracutaneous test in rabbits, and system toxicity, USP.
A silicone dielectric gel that has been used extensively in
implants covers the silicon piezoresistive sensing element.
The gel is a nontoxic, nonallergenic polymer system which
passes pyrogen testing, as well as meeting all USP XX Biological Testing Class VI requirements. The properties of the
gel allow it to transmit pressure uniformly to the diaphragm
surface, while isolating the internal electrical connections
from the corrosive effects of fluids, such as saline solution.
The gel provides electrical isolation sufficient to withstand
defibrillation testing, as specified in the proposed Association
for the Advancement of Medical Instrumentation (AAMI)
Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room
lights from affecting the performance of the sensor.
REV 1
Sensor
Motorola
Motorola, Inc.
1995 Device Data
1
MPX2300D
OPERATING CHARACTERISTICS (VS = 6 Vdc, TA = 25°C unless otherwise noted)
Characteristics
Symbol
Min
Typ
Max
Unit
POP
0
—
300
mmHg
Supply Voltage(8)
VS
—
6.0
10
Vdc
Supply Current
Io
—
1.0
—
mAdc
Voff
– 0.75
—
0.75
mV
—
4.95
5.0
5.05
µV/V/mmHg
VFSS
2.976
3.006
3.036
mV
—
– 2.0
—
2.0
TCS
– 0.1
—
+ 0.1
%/°C
TCVFSS
– 0.1
—
+ 0.1
%/°C
TCVoff
– 9.0
—
+ 9.0
µV/°C
Zin
1800
—
4500
Ω
Output Impedance
Zout
270
—
330
Ω
RCAL (150 kΩ)(9)
RCAL
97
100
103
mmHg
Response Time(5)
(10% to 90%)
tR
—
1.0
—
ms
Temperature Error Band
—
0
—
85
°C
Stability(6)
—
—
± 0.5
—
%VFSS
Symbol
Min
Typ
Max
Unit
Weight (Case 423)
—
—
170
—
mg
Warm–Up
—
—
15
—
Sec
Pressure Range
Zero Pressure Offset
Sensitivity
Full Scale Span(1)
Linearity + Hysteresis
Temperature Effect on Sensitivity
Temperature Effect on Full Scale Span
Temperature Effect on Offset(4)
Input Impedance
MECHANICAL CHARACTERISTICS
Characteristics
NOTES:
1. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference between full scale output and zero pressure offset.
2. Maximum deviation from end–point straight line fit at 0 and 300 mmHg.
3. Slope of end–point straight line fit to full scale span at 0°C and + 85°C relative to + 25°C.
4. Slope of end–point straight line fit to zero pressure offset at 0°C and + 85°C relative to + 25°C.
5. For a 0 to 300 mmHg pressure step change.
6. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +10°C to + 85°C after:
a. 1000 temperature cycles, –40°C to +125°C.
b. 1.5 million pressure cycles, 0 to 300 mmHg.
7. Operating characteristics based on positive pressure differential relative to the vacuum side (gauge/differential).
8. Recommended voltage supply: 6 V ± 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above +10 V may
induce additional error due to device self–heating.
9. Offset measurement with respect to the measured sensitivity when a 150k ohm resistor is connected to VS and S+ output.
2
Motorola Sensor Device Data
MPX2300D
PACKAGE DIMENSIONS
A
M
RADIUS
R
C
Z
L
F
N
B
S
1
2 3
V
4
K
Q
Z
W
–X–
0.36 (0.014)
M
T X Y
0.13 (0.005)
M
T
M
–T–
23 PL
J
D
G
U
H
–Y–
E
NOTE 4
SECTION Z–Z
FRONT VIEW
NOTES:
10. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
11. CONTROLLING DIMENSION: INCH.
12. 24 UNITS PER STRIP AT 8.89 (0.350) PITCH.
13. OVERALL LENGTH OF STRIP EQUALS
212.7-214.00 (8.375-8.425).
AC
F
AA
AB
AD
BACK VIEW
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
S
U
V
W
AA
AB
AC
AD
STYLE 1:
PIN 1.
2.
3.
4.
INCHES
MIN
MAX
0.240
0.260
0.350
0.370
0.140
0.150
0.012
0.020
0.088
0.102
0.123
0.128
0.045
0.055
0.037
0.047
0.007
0.011
0.120
0.140
0.095
0.105
0.165
0.175
0.223
0.239
0.055
0.065
0.048
0.052
0.745
0.755
0.175 BSC
0.105
0.115
0.050 BSC
0.095
0.107
0.015
0.035
0.120
0.175
0.100
0.115
MILLIMETERS
MIN
MAX
6.10
6.60
8.89
9.40
3.56
3.81
0.30
0.51
2.24
2.59
3.12
3.25
1.14
1.40
0.94
1.19
0.18
0.28
3.05
3.56
2.41
2.67
4.19
4.45
5.66
6.07
1.40
1.65
1.22
1.32
18.92
19.18
4.44 BSC
2.67
2.92
1.27 BSC
2.41
2.72
0.38
0.89
3.05
4.45
2.54
2.92
VCC
+OUT
–OUT
GROUND
CASE 423–03
ISSUE B
Motorola Sensor Device Data
3
MPX2300D
PACKAGE DIMENSIONS — CONTINUED
A
M
C
L
F
N
B
1
2 3
V
4
K
–T–
D
G
J
H
FRONT VIEW
E
END VIEW
NOTES:
14. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
15. CONTROLLING DIMENSION: INCH.
AC
F
AA
AB
AD
STYLE 1:
PIN 5.
6.
7.
8.
BACK VIEW
VCC
+OUT
–OUT
GROUND
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
V
AA
AB
AC
AD
INCHES
MIN
MAX
0.240
0.260
0.350
0.370
0.140
0.150
0.012
0.020
0.088
0.102
0.123
0.128
0.045
0.055
0.037
0.047
0.007
0.011
0.120
0.140
0.095
0.105
0.165
0.175
0.223
0.239
0.055
0.065
0.048
0.052
0.105
0.115
0.095
0.107
0.015
0.035
0.120
0.175
0.100
0.115
MILLIMETERS
MIN
MAX
6.10
6.60
8.89
9.40
3.56
3.81
0.30
0.51
2.24
2.59
3.12
3.25
1.14
1.40
0.94
1.19
0.18
0.28
3.05
3.56
2.41
2.67
4.19
4.45
5.66
6.07
1.40
1.65
1.22
1.32
2.67
2.92
2.41
2.72
0.38
0.89
3.05
4.45
2.54
2.92
CASE 423A–01
ISSUE O
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
Literature Distribution Centers:
USA: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036.
EUROPE: Motorola Ltd.; European Literature Centre; 88 Tanners Drive, Blakelands, Milton Keynes, MK14 5BP, England.
JAPAN: Nippon Motorola Ltd.; 4–32–1, Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan.
ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong.
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*MPX2300D/D*
Motorola Sensor
Device Data
MPX2300D/D