BGA Package 88-Lead (15mm × 11.25mm × 3.42mm) (Reference LTC DWG # 05-08-1928 Rev B) A DETAIL A Z 8 A2 aaa Z SEE NOTES 7 6 5 4 3 2 7 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE H Z // bbb Z G H1 H2 DETAIL B J K e Øb (88 PLACES) L ddd M Z X Y eee M Z aaa Z 3 PACKAGE BOTTOM VIEW DETAIL A 4.445 3.175 1.905 0.000 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 0.635 0.635 1.905 3.175 SEE NOTES G DETAIL B PACKAGE SIDE VIEW PACKAGE TOP VIEW 4.445 e b X Y E 2. ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS 6.350 0.630 ±0.025 Ø 88x 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 3.22 0.50 2.72 0.60 0.60 0.27 2.45 NOM 3.42 0.60 2.82 0.75 0.63 15.00 11.25 1.27 12.70 8.89 0.32 2.50 MAX 3.62 0.70 2.92 0.90 0.66 0.37 2.55 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 88 NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION BGA 88 0613 REV B