Datasheet

UNISONIC TECHNOLOGIES CO., LTD
9N90-Q
Power MOSFET
9A, 900V N-CHANNEL
POWER MOSFET

DESCRIPTION
The UTC 9N90-Q uses UTC’s advanced proprietary, planar
stripe, DMOS technology to provide excellent RDS(ON), low gate
charge and operation with low gate voltages. This device is suitable
for use as a load switch or in PWM applications.

FEATURES
* RDS(ON) < 1.4Ω @ VGS = 10V, ID = 4.5A
* Fast Switching Capability
* Avalanche Energy Specified
* Improved dv/dt Capability, High Ruggedness

SYMBOL
2.Drain
1.Gate
3.Source

ORDERING INFORMATION
Ordering Number
Lead Free
Halogen Free
9N90L-TA3-T
9N90G-TA3-T
9N90L-T3P-T
9N90G-T3P-T

Package
TO-220
TO-3P
Pin Assignment
1
2
3
G
D
S
G
D
S
Packing
Tube
Tube
MARKING
www.unisonic.com.tw
Copyright © 2014 Unisonic Technologies Co., Ltd
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9N90-Q

Power MOSFET
ABSOLUTE MAXIMUM RATING (TC =25°C, unless otherwise specified)
PARAMETER
SYMBOL
RATINGS
UNIT
Drain-Source Voltage
VDSS
900
V
Gate-Source Voltage
VGSS
±30
V
Continuous Drain Current (TC = 25°C)
ID
9.0
A
Pulsed Drain Current (Note 2)
IDM
36
A
Avalanche Current (Note 2)
IAR
9.0
A
Single Pulsed(Note 3)
EAS
500
mJ
Avalanche Energy
Repetitive(Note 2)
EAR
28
mJ
Peak Diode Recovery dv/dt (Note 4)
dv/dt
4.0
V/ns
TO-220
147
W
Power Dissipation
TO-3P
208
W
PD
1.176
W/°C
Linear Derating Factor above TC = TO-220
25°C
TO-3P
1.66
W/°C
Junction Temperature
TJ
150
°C
Storage Temperature
TSTG
-55 ~ +150
°C
Notes: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
2. Repetitive Rating : Pulse width limited by maximum junction temperature
3. L = 12.35mH, IAS = 9.0A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
4. ISD ≤ 9.0A, di/dt ≤ 200A/μs, VDD≤ BVDSS, Starting TJ = 25°C

THERMAL DATA
Junction to Ambient
Junction to Case
PARAMETER
TO-220
TO-3P
TO-220
TO-3P
UNISONIC TECHNOLOGIES CO., LTD
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SYMBOL
θJA
θJC
RATINGS
62.5
40
0.85
0.6
UNIT
°C/W
°C/W
°C/W
°C/W
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
Power MOSFET
ELECTRICAL CHARACTERISTICS (TJ =25°C, unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNIT
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
VGS = 0 V, ID = 250μA
900
V
Drain-Source Leakage Current
IDSS
VDS = 900 V, VGS = 0 V
10
μA
VGS = 30 V, VDS = 0 V
100 nA
Forward
IGSSF
Gate-Body Leakage Current
Reverse
IGSSR
VGS = -30 V, VDS = 0 V
-100 nA
Breakdown Voltage Temperature Coefficient △BVDSS/△TJ ID=250μA, Referenced to 25°C
0.99
V/°C
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(TH)
VDS = VGS, ID = 250μA
3.0
5.0
V
Static Drain-Source On-Resistance
RDS(ON)
VGS = 10V, ID = 4.5A
1.26 1.4
Ω
DYNAMIC PARAMETERS
1450 2730 pF
Input Capacitance
CISS
VDS = 25V, VGS = 0V,
Output Capacitance
COSS
157 230 pF
f = 1.0 MHz
Reverse Transfer Capacitance
CRSS
21
26
pF
SWITCHING CHARACTERISTICS
Turn-On Delay Time
tD(ON)
95 110 ns
Turn-On Rise Time
tR
200 250 ns
VDD = 30V, ID =0.5 A,
RG = 25Ω (Note 1, 2)
Turn-Off Delay Time
tD(OFF)
340 390 ns
Turn-Off Fall Time
tF
200 250 ns
Total Gate Charge
QG
56
70
nC
VDS =50V, ID = 1.3A,
Gate-Source Charge
QGS
7.4
nC
VGS = 10 V (Note 1,2)
Gate-Drain Charge
QGD
17
nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
Drain-Source Diode Forward Voltage
VSD
VGS = 0 V, IS = 9.0 A
1.4
V
Maximum Continuous Drain-Source Diode
IS
9.0
A
Forward Current
Maximum Pulsed Drain-Source Diode
ISM
36
A
Forward Current
Notes: 1. Pulse Test : Pulse width≤300μs, Duty cycle≤2%
2. Essentially independent of operating temperature
UNISONIC TECHNOLOGIES CO., LTD
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
Power MOSFET
TEST CIRCUITS AND WAVEFORMS
Peak Diode Recovery dv/dt Test Circuit & Waveforms
+
DUT
VDS
RG
L
ISD
VGS
VDD
Driver
Same Type
as DUT
dv/dt controlled by RG
ISD controlled by pulse period
VGS
(Driver)
D=
Gate Pulse Width
Gate Pulse Period
10V
IFM, Body Diode Forward Current
ISD
(DUT)
di/dt
IRM
Body Diode Reverse Current
VDS
(DUT)
Body Diode Recovery dv/dt
VSD
VDD
Body Diode Forward
Voltage Drop
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9N90-Q

Power MOSFET
TEST CIRCUITS AND WAVEFORMS(Cont.)
VGS
Same Type
as DUT
12V
QG
10V
200nF
50kΩ
VDS
300nF
QGS
QGD
VGS
DUT
3mA
Charge
Gate Charge Test Circuit
Gate Charge Waveforms
2
EAS= 1
2 LIAS
VDS
RG
BVDSS
BVDSS-VDD
BVDSS
ID
L
IAS
10V
ID(t)
DUT
tP
VDD
Unclamped Inductive Switching Test Circuit
UNISONIC TECHNOLOGIES CO., LTD
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VDD
VDS(t)
Time
tP
Unclamped Inductive Switching Waveforms
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TYPICAL CHARACTERISTICS
300
Drain Current vs. Drain-Source
Breakdown Voltage
Drain Current vs. Gate Threshold Voltage
300
250
250
200
200
150
150
100
100
50
50
0
0
0
0.7
1.4 2.1
2.8 3.5 4.2
Gate Threshold Voltage, VTH (V)
Continuous Drain-Source Current, ISD (A)
400
0
200
600
800 1000
Drain-Source Breakdown Voltage, BVDSS (V)
Drain Current, ID (A)

Power MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
UNISONIC TECHNOLOGIES CO., LTD
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