NTD5407N D

NTD5407N, STD5407N
Power MOSFET
40 V, 38 A, Single N−Channel, DPAK
Features
•
•
•
•
•
Low RDS(on)
High Current Capability
Low Gate Charge
STD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
These Devices are Pb−Free and are RoHS Compliant
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V(BR)DSS
RDS(ON) TYP
ID MAX
(Note 1)
40 V
21 m @ 10 V
38 A
N−Channel
Applications
D
• Electronic Brake Systems
• Electronic Power Steering
• Bridge Circuits
G
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
40
V
Gate−to−Source Voltage
VGS
±20
V
ID
38
A
Continuous Drain
Current − RJC
Steady
State
Power Dissipation −
RJC
Steady
State
TC = 25°C
Continuous Drain
Current RJA (Note 1)
Steady
State
TA = 25°C
Power Dissipation −
RJA (Note 1)
Steady
State
Pulsed Drain Current
TC = 25°C
TC = 100°C
tp = 10 s
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to Source Avalanche
Energy − (VDD = 50 V, VGS = 10 V, IPK = 17 A,
L = 1 mH, RG = 25 )
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
PD
75
W
ID
7.6
A
3
DPAK
CASE 369C
STYLE 2
MARKING DIAGRAM
1
PD
2.9
W
IDM
75
A
TJ,
TSTG
−55 to
175
°C
IS
36
A
EAS
150
mJ
TL
°C
260
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS (Note 1)
Symbol
Max
Unit
Junction−to−Case (Drain)
RθJC
2.0
°C/W
Junction−to−Ambient (Note 1)
RθJA
52
°C/W
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [2 oz] including traces).
August, 2014 − Rev. 6
1 2
5.3
TA = 25°C
© Semiconductor Components Industries, LLC, 2014
4
27
TA = 100°C
Parameter
S
1
A
Y
WW
5407N
G
AYWW
54
07NG
= Assembly Location*
= Year
= Work Week
= Specific Device Code
= Pb−Free Device
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
Device
Package
Shipping†
NTD5407NT4G
DPAK
(Pb−Free)
2500 / Tape & Reel
STD5407NT4G*
DPAK
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NTD5407N/D
NTD5407N, STD5407N
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise stated)
Parameter
Symbol
Test Condition
Min
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = 250 A
40
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V(BR)DSS/TJ
Typ
Max
Unit
OFF CHARACTERISTICS
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
V
39
IDSS
VGS = 0 V,
VDS = 40 V
mV/°C
TJ = 25°C
1.0
TJ = 100°C
10
IGSS
VDS = 0 V, VGS = ±30 V
VGS(TH)
VGS = VDS, ID = 250 A
±100
A
nA
ON CHARACTERISTICS (Note 2)
Gate Threshold Voltage
Gate Threshold Temperature
Coefficient
Drain−to−Source On Resistance
Forward Transconductance
VGS(TH)/TJ
1.5
3.5
−6.0
RDS(on)
gFS
V
mV/°C
VGS = 10 V, ID = 20 A
21
26
VGS = 5.0 V, ID = 10 A
32
40
VGS = 10 V, ID = 18 A
15
m
S
CHARGES AND CAPACITANCES
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
Total Gate Charge
615
VGS = 0 V, f = 1.0 MHz,
VDS = 32 V
QGS
Gate−to−Drain Charge
QGD
pF
173
80
QG(TOT)
Gate−to−Source Charge
1000
nC
20
VGS = 10 V, VDS = 32 V,
ID = 38 A
2.25
10.5
SWITCHING CHARACTERISTICS, VGS = 10 V (Note 3)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
td(ON)
ns
6.8
tr
VGS = 10 V, VDD = 32 V,
ID = 38 A, RG = 2.5 td(OFF)
tf
17
66
51
SWITCHING CHARACTERISTICS, VGS = 5 V (Note 3)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
td(ON)
ns
10
tr
VGS = 5 V, VDD = 20 V,
ID = 20 A, RG = 2.5 td(OFF)
tf
175
13
23
DRAIN−SOURCE DIODE CHARACTERISTICS (Note 2)
Forward Diode Voltage
Reverse Recovery Time
VSD
TJ = 25°C
0.9
TJ = 125°C
0.75
tRR
Charge Time
ta
Discharge Time
tb
Reverse Recovery Charge
VGS = 0 V,
IS = 5.0 A
38
VGS = 0 V, dIS/dt = 100 A/s,
IS = 15 A
QRR
1.1
V
ns
20.5
17
40
nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: pulse width ≤ 300 s, duty cycle ≤ 2%.
3. Switching characteristics are independent of operating junction temperatures.
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2
NTD5407N, STD5407N
TYPICAL PERFORMANCE CURVES
VGS = 7 V to 10 V
60
TJ = 25°C
VDS ≥ 10 V
6V
ID, DRAIN CURRENT (AMPS)
ID, DRAIN CURRENT (AMPS)
60
50
5.5 V
40
5V
30
4.5 V
20
4V
10
50
40
30
20
TJ = 100°C
10
TJ = 25°C
3.5 V
0
TJ = −55°C
0
0
2
1
3
5
4
6
7
9
8
10
0
VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
0.08
ID = 38 A
TJ = 25°C
0.07
0.06
0.05
0.04
0.03
0.02
0.01
3
5
4
6
7
8
9
10
11
12
0.105
TJ = 25°C
0.095
0.085
0.075
0.065
VGS = 5 V
0.055
0.045
0.035
VGS = 10 V
0.025
0.015
0.005
10
25
35
30
40
ID, DRAIN CURRENT (AMPS)
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
10000
2
ID = 20 A
VGS = 10 V
VGS = 0 V
TJ = 175°C
IDSS, LEAKAGE (nA)
RDS(on), DRAIN−TO−SOURCE
RESISTANCE (NORMALIZED)
20
15
VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)
1.8
8
Figure 2. Transfer Characteristics
RDS(on), DRAIN−TO−SOURCE RESISTANCE ()
RDS(on), DRAIN−TO−SOURCE RESISTANCE ()
Figure 1. On−Region Characteristics
3
5
6
7
1
2
4
VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)
1.6
1.4
1.2
1
1000
100
10
TJ = 100°C
0.8
0.6
−50
−25
0
25
50
75
100
125
150
175
1
5
10
15
20
25
30
35
TJ, JUNCTION TEMPERATURE (°C)
VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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3
40
NTD5407N, STD5407N
TYPICAL PERFORMANCE CURVES
VGS = 0 V
VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
VDS = 0 V
TJ = 25°C
Ciss
1200
Crss
Ciss
600
Coss
0
10
Crss
5
VGS
0
VDS
5
15
10
20
25
15
35
12
28
QT
9
VDS
QGS
6
7
ID = 36 A
TJ = 25°C
5
10
15
QG, TOTAL GATE CHARGE (nC)
0
td(on)
10
1
1
10
RG, GATE RESISTANCE (OHMS)
100
15
14 VGS = 0 V
13 TJ = 25°C
12
11
10
9
8
7
6
5
4
3
2
1
0
0.3
0.9
0.6
VSD, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
Figure 9. Resistive Switching Time
Variation vs. Gate Resistance
VGS = 10 V
SINGLE PULSE
TC = 25°C
100
10 s
100 s
10
1 ms
10 ms
dc
1
RDS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
0.1
0.1
1.2
Figure 10. Diode Forward Voltage vs. Current
1000
ID, DRAIN CURRENT (A)
t, TIME (ns)
IS, SOURCE CURRENT (AMPS)
1000
tr
0
20
Figure 8. Gate−To−Source and
Drain−To−Source Voltage vs. Total Charge
Figure 7. Capacitance Variation
100
21
14
0
30
td(off)
tf
QGD
3
GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS)
VDS = 32 V
ID = 38 A
VGS = 10 V
VGS
1
10
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
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4
V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS)
1800
100
NTD5407N, STD5407N
r(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE
TYPICAL PERFORMANCE CURVES
1
D = 0.5
0.2
0.1
0.05
0.02
0.1
P(pk)
0.01
SINGLE PULSE
t1
t2
DUTY CYCLE, D = t1/t2
0.01
0.00001
0.0001
0.001
0.01
t, TIME (s)
Figure 12. Thermal Response
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5
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) − TC = P(pk) RJC(t)
0.1
1
NTD5407N, STD5407N
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE E
A
E
C
A
b3
B
c2
4
L3
D
1
2
Z
Z
H
DETAIL A
3
L4
NOTE 7
b2
e
b
TOP VIEW
c
SIDE VIEW
0.005 (0.13)
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
BOTTOM VIEW
BOTTOM VIEW
ALTERNATE
CONSTRUCTION
C
H
L2
GAUGE
PLANE
C
L
L1
DETAIL A
SEATING
PLANE
A1
ROTATED 905 CW
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.72
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.90 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
SOLDERING FOOTPRINT*
6.20
0.244
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.028 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.114 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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For additional information, please contact your local
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NTD5407N/D