Fujitsu Microelectronics Europe MCU-AN-389024-E-V11 Application Note EMC Design Guide F2MC-8L Family © Fujitsu Mikroelektronik GmbH, Microcontroller Application Group History 04th Jul 02 18th Jul. 02 NFL NFl MCU-AN-389024-E-V11 V1.0 V1.1 Initial draft Description DeCap added -1- © Fujitsu Microelectronics Europe GmbH Warranty and Disclaimer To the maximum extent permitted by applicable law, Fujitsu Mikroelektronik GmbH restricts its warranties and its liability for all products delivered free of charge (eg. software include or header files, application examples, application Notes, target boards, evaluation boards, engineering samples of IC’s etc.), its performance and any consequential damages, on the use of the Product in accordance with (i) the terms of the License Agreement and the Sale and Purchase Agreement under which agreements the Product has been delivered, (ii) the technical descriptions and (iii) all accompanying written materials. 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Should one of the above stipulations be or become invalid and/or unenforceable, the remaining stipulations shall stay in full effect. . © Fujitsu Microelectronics Europe GmbH -2- MCU-AN-389024-E-V11 Table of Contents: 1 INTRODUCTION 4 2 RULES TO CREATE A GOOD LAYOUT 4 3 CRYSTAL OSCILLATOR CIRCUIT 5 4 POWER SUPPLY ROUTING 6 5 NOISE REDUCTION FOR GENERAL IO PINS 9 6 FUNCTION OF CERTAIN MCU PINS 9 7 EMI MEASUREMENT FOR F2MC-8L FAMILY 7.1 Measurement setup 10 7.2 Measurement procedure 10 7.3 Measurements 10 7.4 Blank check 11 7.5 Noise measurements on VCC 11 MCU-AN-389024-E-V111 -3- 10 © Fujitsu Microelectronics Europe GmbH 1 Introduction In the following description, the EMC design guide of 8-bit Fujitsu microcontroller will be discussed. It describes how external power supply should be connected to the Vcc and Vss pins and offers some suggestions. An overview of internal supply of MCU is made as well to have a better understanding of the design. The EMI measurements in the following described tests are just example measurements. The measured emissions are no data, which are specified in the DS of the microcontroller series. During the last designs the EMI of the Fujitsu F2MC-8L microcontroller series could be reduced step by step. The PLL multiplier circuit allows the usage of low crystal frequency to reduce high-frequency noise from the oscillator circuit. The clock tree is mostly the cause of the noise. Therefore the driver capability of clock buffers is optimised and for one big buffer are used several small clock buffers. The integration of On-chip bypass capacitors reduces the noise ripple on the internal power supply net so that the broadband noise on the IO pins is improved. The following description is based on the MB89530 series, but the same situation exists for all current devices of the F2MC-8L family, with or without an external bus interface. 2 Rules to create a good Layout 1. Use max. trace-width and min. length to connect VSS and VDD :C-pins to decoupling capacitors (DeCap) 2. Don’t use stub line to connect the DeCap to :C-pins, let flows the noise current direct through pads of DeCap 3. Use close ground plane direct below MCU package as shield 4. Use different ground systems for analogue, digital, power-driver and connector ground 5. Avoid loop current in the ground system, check for ground loops. 6. Use a star point ground below MCU for analogue and digital ground, use a second star point ground below 5V regulator for MCU, power-driver and connector ground 7. Don't create signal loop on the PCB, minimize trace length 8. Partitioned system into analogue, digital and power-driver section 9. Place series resistor or RC-block for the IO-circuit nearby MCU-pin to reduce the noise on the signal line. 10. Use a capacitor for each connector pin to reduce the noise of external lines, place this capacitor close to connector pin © Fujitsu Microelectronics Europe GmbH -4- MCU-AN-389024-E-V11 3 Crystal Oscillator Circuit Figure 1 shows the oscillator for the 8-bit family. For best performance, the PCB layout of this circuit should cover only a very small area. For the layout is recommended a PCB with two or more layers. Make sure to provide bypass capacitors via shortest distance from X0, X1 pins, crystal oscillator, and ground lines. The lines of the oscillation circuit should not cross lines of other circuits. X1 X0 Microcontroller Oscillator Figure 1: Principle of the Oscillator circuit It is necessary to avoid coupling noise into the power supply (pin 81/84) of the clock circuit. The crystal oscillator has to be connected with short lines to X0/X1 and Vss. Note that pin X1 is the output of inverter. Particularly this track should have a short length. Decoupling capacitor C B on the back side of the PCB Decoupling capacitor C B on the back side of the PCB Via to ground island and system ground CB Vss Vss Vcc X0 Connection to ground layer Via to system Vcc CB Vcc X0 X1 C1 C2 Via to ground island on the back side Quartz Crystal X1 Single ground island on the back side Connection to ground layer SMD Quartz Crystal C1 Quartz Crystal package has to be grounded C2 Connection to ground layer b) Layout example for a SMD quartz crystal better layout design, because C1 and C2 are connected to Vss and than after with the system ground a) Layout example for a leaded quartz crystal worse layout design, because C1 and C2 are wrong connected to VSS Figure 2: Layout example for oscillator circuit MCU-AN-389024-E-V111 -5- © Fujitsu Microelectronics Europe GmbH 4 Power supply routing One topic our noise reduction technology is the bypass capacitors. By placing of modules inside the chip, it is possible to connect a bypass capacitor with low impedance where power supply lines are short, effectively reducing the noise to very low flow levels. These bypass capacitors are place into power supply of IO and logic. I/O-PORT ROM Vcc Vss CPU RAM SCI / TIMER / etc. A/D+D/A AVcc AVss Figure 3: Structure of power supply for MCU core and IO-Port VCC VCC :C DeCap DeCap GND a) VCC and GND lead to supply noise current flows not via DeCap, DeCap has not effect DeCap GND b) GND lead noise to system GND noise current flows partly via DeCap, DeCap has hardly effect :C :C DeCap GND VCC VCC :C c) GND lead noise to System GND noise current flows partly via DeCap, DeCap has hardly effect VCC :C VCC :C DeCap DeCap GND GND GND GND d) VCC and GND lead to supply noise current flows not via DeCap, DeCap has not effect e) GND is not short connected to DeCap. between GND and DeCap flows a loop current DeCap has hardly effect f) DeCap correct connected to :C and power supply. high speed current will be supported from DeCap Figure 4: The exactly use of the DeCap (decoupling capacitor) © Fujitsu Microelectronics Europe GmbH -6- MCU-AN-389024-E-V11 The high-speed current (di/dt) will be supported from the decoupling capacitor only. Therefore use traces with max. width and min. length between Vss/Vcc pin and DeCap. After DeCap use thin traces to route the trace to the power supply system. use EMC filter for :C-supply short length max. width high Z :C low Z VCC C GND Figure 5: The noise current flows return over the ground line The exactly use of decoupling capacitors for the Vcc and Vss pins is the basis to reduce the noise, but also the return way between load and MCU ground is not neglect. high-Z choking coil min. length max. width min. length max. width :C VCC C I slow clock unit & core VSS HVCC IO-driver HVSS I fast low-Z I supply C I return I crossbar dt/di R C Load I load Figure 6: The noise current flows return over the ground line To ensure an efficient decoupling of the power supply, two capacitors should be placed close on each Vcc pin. The values of both capacitors should have a relationship of about 1:100. Typical values are e.g. 100nF (XR7) and 1nF (COG). The accurate value is depended on the application board, e.g. impedance of PCB or the length of supply lines. However, all of the DeCaps on the PCB should have the same value. Lboard Lboard VDD IC2 DeCap Cn IC1 DeCap C2 Cboard DeCap C1 A ICn f GND Figure 7: The use of several values of DeCaps lead to undefined resonance frequencies, that’s why all DeCaps should have the same value. MCU-AN-389024-E-V111 -7- © Fujitsu Microelectronics Europe GmbH For 2-layer boards should be used a closed ground plane (located directly below the MCU). The Vcc supplies should be taken from the bottom layer. For 4-layer boards should be used the inside layers for GND and Vcc supplies. In this case, both layers form additional capacitor (broadband behaviour) for the power supply. star point and noise filter for Vcc and ground on the back side Connection to power supply Vcc Figure 8 shows a layout example for the connection of powers supply on the MCU. This method of Vcc connection reduces the loop of the Vcc lines around the MCU, thus reducing noise emission. A variation of this circuit may be needed, if separate filtered supply voltages are routed to the A/D supplies (pin AVCC/AVSS). Decoupling capacitor C B on the back side of the PCB CB LB CB ground plan below package on the top side Via to ground island and system ground Decoupling capacitor C B on the back side of the PCB CB AVcc AVR AVss X0A Via to ground island and system ground X1A C1 32kHz C2 Rs C1 Single ground island on the back side Via to ground island on the back side C2 Vss X1 X0 Quartz Crystal 2 Figure 8: F MC-8L family with main- and subclock, recommended layout for multiple layers PCB Note: All decoupling capacitors on the Vcc pins should have the same value. These capacitors should be placed close to the Vcc pin. The Vcc/Vss current should flows through the pad of the capacitor. © Fujitsu Microelectronics Europe GmbH -8- MCU-AN-389024-E-V11 5 Noise reduction for general IO pins To reduce noise, make sure to connect the Vss or Vcc with smoothed power supply, because the noise on the power supply will also distributed via IO-pin, which is configured as static low or high output. Figure 9 shows an example to reduce the noise on output lines. :C IO-Port :C IO-Port Noise length of trace length of trace Figure 9: Place the series resistor close to IO pin because so will be reduced the noise of output Note: To reduce noise, make sure to connect unused input pins to Vss or Vcc (Use pull-down or pull-up resistor, please check the DS of the microcontroller series). Also, especially if CMOS Logic is used, floating gates could generate problems regarding high input currents and latch up. 6 Function of certain MCU pins Pin name Function VDD Main supply for IO buffer and MCU core VSS Main supply for IO buffer and MCU core close to crystal oscillator Power supply for the A/D converter Reference voltage input for the A/D converter Power supply for the A/D converter Oscillator input, if not used so shall be connected with pull-up or pull-down resistor (see please DS) Oscillator output, the crystal and bypass capacitor must be connected via shortest distance with X1 pin, if not used so shall be open AVCC AVR AVSS X0 X0A X1 X1A MCU-AN-389024-E-V111 -9- © Fujitsu Microelectronics Europe GmbH 7 7.1 EMI Measurement for F2MC-8L family Measurement setup Figure 10: Set-up for noise measurement on power supply 7.2 - 7.3 Measurement procedure RF- voltage, measured on VCC power supply by BI mode RUN RF- voltage, measured on VCC power supply by BI mode RESET Measurements Sample: MB89538A, MB89538AL, MB89535A Measurement condition: Ta = 25 deg.C Power supply: Vcc = 5.0V / 3.0V Crystal: 8MHz (FAR) Frequency range: 0MHz to 120MHz, BW: 120kHz © Fujitsu Microelectronics Europe GmbH - 10 - MCU-AN-389024-E-V11 7.4 Blank check Figure 11: Noise measured on VCC power supply, blank check 7.5 Noise measurements on VCC Figure 12: MB89538A - Noise measured on VCC power supply, BI-mode RUN MCU-AN-389024-E-V111 - 11 - © Fujitsu Microelectronics Europe GmbH Figure 13: MB89538AL - Noise measured on VCC power supply, BI-mode RUN Figure 14: MB89535A - Noise measured on VCC power supply, BI-mode RUN © Fujitsu Microelectronics Europe GmbH - 12 - MCU-AN-389024-E-V11