74LVC3G34-Q100 Triple buffer Rev. 1 — 16 May 2013 Product data sheet 1. General description The 74LVC3G34-Q100 provides three buffers. The inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the 74LVC3G34-Q100 as a translator in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down. This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications. 2. Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 1) Specified from 40 C to +85 C and from 40 C to +125 C Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant input/output for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8B/JESD36 (2.7 V to 3.6 V) ESD protection: MIL-STD-883, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) 24 mA output drive (VCC = 3.0 V) CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Multiple package options 74LVC3G34-Q100 NXP Semiconductors Triple buffer 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74LVC3G34DP-Q100 40 C to +125 C TSSOP8 74LVC3G34DC-Q100 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 4. Marking Table 2. Marking codes Type number Marking code[1] 74LVC3G34DP-Q100 V34 74LVC3G34DC-Q100 Y34 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 1 1A 1Y 3Y 3A 2A 2Y 1 1 A 001aah842 Fig 1. Logic symbol 74LVC3G34_Q100 Product data sheet 001aah843 Fig 2. IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 Y 001aac536 Fig 3. Logic diagram (one gate) © NXP B.V. 2013. All rights reserved. 2 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer 6. Pinning information 6.1 Pinning /9&*4 $ 9&& < < $ $ *1' < DDD Fig 4. Pin configuration SOT505-2 and SOT765-1 6.2 Pin description Table 3. Pin description Symbol Pin Description 1A, 2A, 3A 1, 3, 6 data input 1Y, 2Y, 3Y 7, 5, 2 data output GND 4 ground (0 V) VCC 8 supply voltage 7. Functional description Table 4. Function table[1] Input nA Output nY L L H H [1] H = HIGH voltage level; L = LOW voltage level. 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 3 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current Conditions VI < 0 V [1] output current ICC supply current IGND ground current Ptot total power dissipation Tstg storage temperature Unit 0.5 +6.5 V 50 - mA 0.5 +6.5 V - 50 mA 0.5 VCC + 0.5 V [1][2] 0.5 +6.5 V - 50 mA - 100 mA 100 - mA - 250 mW 65 +150 C Active mode Power-down mode IO Max [1] VO > VCC or VO < 0 V output voltage VO Min VO = 0 V to VCC Tamb = 40 C to +125 C [3] [1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. [3] For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K. 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter VCC Conditions Min Max Unit supply voltage 1.65 5.5 V VI input voltage 0 5.5 V VO output voltage Active mode 0 VCC V Power-down mode; VCC = 0 V 0 5.5 V 40 +125 C VCC = 1.65 V to 2.7 V - 20 ns/V VCC = 2.7 V to 5.5 V - 10 ns/V Tamb ambient temperature t/V input transition rise and fall rate 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 4 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit VCC = 1.65 V to 1.95 V 0.65 VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7 VCC - - V VCC = 1.65 V to 1.95 V - - 0.35 VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 VCC V IO = 100 A; VCC = 1.65 V to 5.5 V VCC 0.1 - - V IO = 4 mA; VCC = 1.65 V 1.2 - - V IO = 8 mA; VCC = 2.3 V 1.9 - - V IO = 12 mA; VCC = 2.7 V 2.2 - - V IO = 24 mA; VCC = 3.0 V 2.3 - - V IO = 32 mA; VCC = 4.5 V 3.8 - - V Tamb = 40 C to +85 C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VI = VIH or VIL VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V - - 0.1 V IO = 4 mA; VCC = 1.65 V - - 0.45 V IO = 8 mA; VCC = 2.3 V - - 0.3 V IO = 12 mA; VCC = 2.7 V - - 0.4 V IO = 24 mA; VCC = 3.0 V - - 0.55 V IO = 32 mA; VCC = 4.5 V - - 0.55 V II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - 0.1 5 A IOFF power-off leakage current VCC = 0 V; VI or VO = 5.5 V - 0.1 10 A ICC supply current VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A - 0.1 10 A ICC additional supply current per pin; VCC = 2.3 V to 5.5 V; VI = VCC 0.6 V; IO = 0 A - 5 500 A CI input capacitance VCC = 3.3 V; VI = GND to VCC - 2.5 - pF 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 5 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit VCC = 1.65 V to 1.95 V 0.65 VCC - - V Tamb = 40 C to +125 C HIGH-level input voltage VIH LOW-level input voltage VIL VOH HIGH-level output voltage LOW-level output voltage VOL VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7 VCC - - V VCC = 1.65 V to 1.95 V - - 0.35 VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 VCC V VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V VCC 0.1 - - V IO = 4 mA; VCC = 1.65 V 0.95 - - V IO = 8 mA; VCC = 2.3 V 1.7 - - V IO = 12 mA; VCC = 2.7 V 1.9 - - V IO = 24 mA; VCC = 3.0 V 2.0 - - V IO = 32 mA; VCC = 4.5 V 3.4 - - V IO = 100 A; VCC = 1.65 V to 5.5 V - - 0.1 V IO = 4 mA; VCC = 1.65 V - - 0.7 V IO = 8 mA; VCC = 2.3 V - - 0.45 V IO = 12 mA; VCC = 2.7 V - - 0.6 V IO = 24 mA; VCC = 3.0 V - - 0.8 V IO = 32 mA; VCC = 4.5 V VI = VIH or VIL - - 0.8 V II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 20 A IOFF power-off leakage current VCC = 0 V; VI or VO = 5.5 V - - 20 A ICC supply current VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A - - 40 A ICC additional supply current per pin; VCC = 2.3 V to 5.5 V; VI = VCC 0.6 V; IO = 0 A - - 5000 A [1] All typical values are measured at VCC = 3.3 V and Tamb = 25 C. 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 6 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter 40 C to +85 C Conditions Min Max Min Max VCC = 1.65 V to 1.95 V 1.0 3.8 8.6 1.0 10.8 ns VCC = 2.3 V to 2.7 V 0.5 2.4 4.4 0.5 5.5 ns VCC = 2.7 V 0.5 2.5 5.0 0.5 6.3 ns VCC = 3.0 V to 3.6 V 0.5 2.2 4.1 0.5 5.1 ns VCC = 4.5 V to 5.5 V 0.5 1.9 3.2 0.5 4.0 ns - 14 - - - pF propagation delay nA to nY; see Figure 5 tpd power dissipation capacitance CPD 40 C to +125 C Unit Typ[1] VI = GND to VCC; VCC = 3.3 V [2] [3] [1] Typical values are measured at Tamb = 25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively. [2] tpd is the same as tPLH and tPHL. [3] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 7 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer 12. AC waveforms VI nA input VM VEXT VM VCC GND tPLH VI tPHL VOH VM nY output DUT RT VM RL VO G RL CL VOL mnb072 mna616 Measurement points are given in Table 9. Test data is given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 5. The data input (nA) to output (nY) propagation delays Table 9. Fig 6. Test circuit for measuring switching times Measurement points Supply voltage Input Output VCC VM VM 1.65 V to 1.95 V 0.5 VCC 0.5 VCC 2.3 V to 2.7 V 0.5 VCC 0.5 VCC 2.7 V 1.5 V 1.5 V 3.0 V to 3.6 V 1.5 V 1.5 V 4.5 V to 5.5 V 0.5 VCC 0.5 VCC Table 10. Test data Supply voltage Input Load VEXT VCC VI tr = tf CL RL tPLH, tPHL 1.65 V to 1.95 V VCC 2.0 ns 30 pF 1 k open 2.3 V to 2.7 V VCC 2.0 ns 30 pF 500 open 2.7 V 2.7 V 2.5 ns 50 pF 500 open 3.0 V to 3.6 V 2.7 V 2.5 ns 50 pF 500 open 4.5 V to 5.5 V VCC 2.5 ns 50 pF 500 open 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 8 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 Fig 7. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Package outline SOT505-2 (TSSOP8) 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 9 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 Fig 8. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Package outline SOT765-1 (VSSOP8) 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 10 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MIL Military MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC3G34_Q100 v.1 20130516 Product data sheet - - 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 11 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74LVC3G34_Q100 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 12 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74LVC3G34_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 16 May 2013 © NXP B.V. 2013. All rights reserved. 13 of 14 74LVC3G34-Q100 NXP Semiconductors Triple buffer 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 16 May 2013 Document identifier: 74LVC3G34_Q100