FRDM-CR20A - User's Guide

Freescale Semiconductor, Inc.
User’s Guide
Document Number: FRDMCR20AUG
Rev. 0, 04/2015
Freescale Freedom Development
Board FRDM-CR20A User's Guide
1
About this guide
This User’s Guide describes the Freescale FRDM-CR20A
development board. The FRDM-CR20A is a 2.4 GHz
Industrial, Scientific, and Medical (ISM) intended for the
IEEE® 802.15.4 Standard, including Thread and
IPv6/6loWPAN protocols. The FRDM-CR20A contains the
MCR20A transceiver that is typically combined with a
software stack and a Freescale Kinetis MCU to implement
an IEEE 802.15.4 Standard platform solutions.
1.1
Audience
This manual is intended for system designers.
2
2.1
Safety information
FCC guidelines
This equipment is for use by developers for evaluation
purposes only and must not be incorporated into any other
device or system. This device may not be sold to the general
public. Integrators will be responsible for reevaluating the
end product (including the transmitter) and obtaining a
separate FCC authorization.
© 2015 Freescale Semiconductor, Inc. All rights reserved.
1.
1.1.
2.
2.1.
2.2.
2.3.
2.4.
3.
3.1.
3.2.
3.3.
4.
4.1.
4.2.
4.3.
5.
5.1.
5.2.
5.3.
5.4.
5.5.
5.6.
5.7.
5.8.
5.9.
6.
Contents
About this guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Safety information . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
FCC guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Regulatory approval for Canada (IC RSS 210) . . . . . 2
Electrostatic discharge considerations . . . . . . . . . . . . 3
Disposal instructions . . . . . . . . . . . . . . . . . . . . . . . . . 3
MCR20A transceiver overview and description . . . . 3
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Board features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Software and driver considerations . . . . . . . . . . . . . . 5
FRDM-CR20A development board . . . . . . . . . . . . . . 5
FRDM-CR20A board overview . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . . . . . . 9
Schematic, board layout, and bill of material . . . . . . 15
PCB manufacturing specifications . . . . . . . . . . . . . . 20
Single PCB construction . . . . . . . . . . . . . . . . . . . . . 21
Panelization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Solder mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Silk screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Electrical PCB testing . . . . . . . . . . . . . . . . . . . . . . . 23
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Hole specification/tool table . . . . . . . . . . . . . . . . . . . 23
File description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Safety information
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this manual, may violate the rules of the Federal
Communications Commission and Industry Canada and make operation of the product unlawful.
2.1.1
Labeling
FCC labels are physically located on the back of the board.
2.1.2
Operating conditions
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
• This device may not cause harmful interference.
• This device must accept any interference received, including interference that may cause undesired
operation.
2.1.3
Exposure limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8
inches (20cm) from all persons.
2.1.4
Antenna restrictions
An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible
party is used with the device. The use of a permanently attached antenna or of an antenna that uses a unique
coupling to the intentional radiator is considered sufficient to comply with the provisions of this Section.
The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of
a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier
current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or
15.221 of the IEEE 802.15.4 standard. Further, this requirement does not apply to intentional radiators that
must be professionally installed, such as perimeter protection systems and some field disturbance sensors,
or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the
installation site. However, the installer is responsible for ensuring that the proper antenna is employed so
that the limits in this Part are not exceeded.
2.2
Regulatory approval for Canada (IC RSS 210)
This equipment complies with Industry Canada liscence-exempt RSS standard(s). Operation is subject to
the following two conditions:
1. This board may not cause interference, and
2. This board must accept any interference, including interference that may cause undesired operation
of the device.
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MCR20A transceiver overview and description
2.2.1
26 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
2.3
Electrostatic discharge considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.
When operating or handling the development boards or components, Freescale strongly recommends
using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:
• Flexible fabric, solid fixed size, or disposable ESD wrist straps
• Static control workstations, static control monitors and table or floor static control systems
• Static control packaging and transportation materials and environmental systems
2.4
Disposal instructions
This product may be subject to special disposal requirements. For product disposal instructions, refer to
freescale.com/productdisposal.
3
3.1
MCR20A transceiver overview and description
Introduction
The FRDM-CR20A development board is an evaluation environment to support the Freescale
MCR20AVHM SoC transceiver (MCR20A), a 2.4 GHz Industrial, Scientific, and Medical (ISM)
transceiver intended for the IEEE 802.15.4 Standard.
The MCR20A is a highly-integrated, cost-effective radio transceiver operating in the 2.36 GHz to 2.48
GHz range, usually combined with a software stack and a Freescale Kinetis MCU to implement an IEEE
802.15.4 Standard platform solution.
Freescale supplements the MCR20A transceiver with tools and software that include hardware evaluation
and development boards, software development IDE and applications, drivers, custom PHY usable with
the Freescale IEEE 802.15.4 compatible MAC.
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MCR20A transceiver overview and description
The FRDM-CR20A development board consists of one board that contains the MCR20A device with a 32
MHz reference oscillator crystal, RF circuitry including an antenna, and supporting circuitry to be
mounted into the popular Freescale Freedom development board form factor. The board is not a standalone
product; it requires an external MCU to support applications development, via SPI connection.
3.2
3.2.1
Board features
FRDM-CR20A board
The FRDM-CR20A development board can be plugged-into the Freescale Freedom development platform
as a shield. It contains the MCR20AVHM device and all necessary I/O connections to connect with the
Freedom system.
Figure 1 shows the FRDM-CR20A development board.
Figure 1. FRDM-CR20A
The FRDM-CR20A development board includes the following features:
• The Freescale ultra-low-power MCR20AVHM 802.15.4 transceiver
• Full IEEE 802.15.4 compliant wireless node
• Reference design area with small footprint, low cost RF node
— RF circuitry includes a Balun to convert the differential input/output pin of the MCR20 to
single-ended for on-board signal routing
— Low off-chip component count
— Programmable output power from –35 dBm to +8 dBm at the SMA connector, no trap
— Receiver sensitivity: –102 dBm, typical (@1% PER for 20 byte payload packet)
• Integrated PCB inverted F-type antenna and footprint for SMA RF port
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•
•
•
•
•
•
•
•
•
32 MHz reference oscillator
2.4 GHz frequency operation (ISM band)
1 RGB LED indicator driven by external MCU
2 Push button switches driven by external MCU
1 Reset button driven by XCVR or external MCU
Power translator for GPIOs, freescale MCU support 3.3V or external sources such as Arduino 5V
Bit stream mode (BSM) to monitor packet data with synchronization clock
Low-power operating modes with single SPI command device wake-up (SPI communication is
enabled in LP mode
Provides access to the MCR20AVHM set of GPIOs
Figure 2 shows the main board features and Input/Output headers for the Freescale FRDM-CR20A board.
Figure 2. FRDM-CR20A callouts and I/O headers
3.3
Software and driver considerations
No special software required. This is not a standalone board; an external MCU is required for enablement.
4
4.1
FRDM-CR20A development board
FRDM-CR20A board overview
The FRDM-CR20A is an evaluation board based on the Freescale MCR20A transceiver. The
FRDM-CR20A provides a platform to evaluate the MCR20A transceiver, and develop software and
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FRDM-CR20A development board
applications. The device is accompanied by a 32 MHz reference oscillator crystal, RF circuitry including
antenna, and supporting circuitry.
The FRDM-CR20A board is intended as the core PCB for MCR20A device evaluation and application
development, and can be used as daughter card to other development boards within the Freescale Freedom
development platform, as an application specific such as a shield card.
4.1.1
PCB features
The FRDM-CR20A board provides the following features:
• The Freescale Freedom development platform form factor
• Two-layer metal, 0.062-inch thick FR4 board
• LGA footprint
• Printed metal F-Antenna and footprint to add an SMA connector
• 32 MHz reference oscillator crystal
• Standard Freescale Freedom daughter card mounting interface (shield)
• Power level translators to support multiple voltages inputs
4.1.2
Form factor
Figure 3 shows the FRDM-CR20A connector and header locations.
Figure 3. FRDM-CR20A
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Figure 3 also shows a footprint of the FRDM-CR20A with the location of the IO headers. The following
list gives these details:
• J1, J2, J3 and J4:
— Headers have standard 0.1 in / 2.54 mm pin spacing
— J2 is 10-pin
— J1 and J3 are 8-pin
— J4 is 6-pin
— Pin headers mounted on the top side of the FRDM-CR20A board and are intended to plug into
matching receptacles on the Freescale Freedom platform board.
• J6:
— Header has standard 0.1 in / 2.54 mm pin spacing
— J6 is a 1x2 pin, with a cut-trace on bottom side
— Pin headers mounted on the top side of the FRDM-CR20A and is intended to isolate for a IC
current measurements.
• J7:
— Header has standard 0.1 in / 2.54 mm pin spacing
— J7 is 1x3 pin
— Pin headers mounted on the top side of the FRDM-CR20A board and intended to select the
Reset target main MCU or transceiver.
Figure 4. FRDM-CR20A top side (component side) footprint
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FRDM-CR20A development board
4.1.3
Board level specifications
Table 1. FRDM-CR20A board specifications
Parameter
Min
Typ
Max
Units
Notes/Conditions
General
Size (PCB: X, Y)
81.2 x 53.3
3.20 x 2.10
Layer build (PCB)
1.57
0.062
mm
inches
mm
inches
Dielectric material (PCB)
Two-layer
FR4
Temperature
Operating temperature (see
note)
-40
+25
+70
°C
Storage temperature
-30
+25
+70
°C
Operating temperature is limited to +70 °C due to
switches. Basic circuit is good for a maximum
temperature of +85 °C.
RF
802.15.4 frequency range
2405
2480
MHz
Operation frequency
2360
2480
MHz
All 16 channels in the 2450 MHz band
RF Receiver
Saturation (maximum input
level)
Sensitivity for 1% packet error
rate (PER) (+25 °C) 802.15.4
+0
dBm
Refer to data sheet
-102
dBm
Refer to data sheet
RF Transmitter
RF Power Output
-35
+8
dBm
Programmable in steps. At the antenna feed with no
trap. 1
2nd harmonic
<-50
<-40
dBm
Refer to data sheet
3rd harmonic
<-50
<-40
dBm
Refer to data sheet
Regulatory Approval
FCC
Product is approved according to the FCC part 15
standard
CE (ETSI)
Product is approved according to the EN 300 328
V1.7.1 (2006-10) standard
CE (EMC)
Product is approved according to the EN 301 489-1
V1.6.1 (2005-09) and EN 301 489-17 V1.2.1
(2002-08) standards
Safety
UL
Product is approved according to the IEC 60950-1
and EN 60950-1, first edition standards
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Table 1. FRDM-CR20A board specifications (continued)
Parameter
Min
Typ
Max
Units
Notes/Conditions
Environment
RoHS
Product complies with the EU Directive 2002/95/EC
of 27 January 2003
WEEE
Product complies with the EU Directive 2002/95/EC
of 27 January 2003
1
Trap will add 1 to 2 dB of loss.
4.2
Functional description
The FRDM-CR20A is built around the Freescale FRDM-CR20A transceiver with a 32-pin LGA package.
This board is intended as a simple evaluation platform and as a building block for application development.
The two-layer board provides the MCR20A transceiver with the required RF circuitry and 32 MHz
reference oscillator crystal. The layout for this base level functionality can be used as a reference layout
for the user’s target board. Figure 5 shows a simple block diagram.
Figure 5. FRDM-CR20A block diagram
4.2.1
RF performance and considerations
The FRDM-CR20A development board includes the Freescale MCR20 2.4 GHz transceiver. Key
specifications for the FRDM-CR20A development board are:
• Programmable output power from –35 dBm to +8 dBm at the SMA, no trap
• Typical sensitivity is -102 dBm (@1% PER for 20 byte payload packet)
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FRDM-CR20A development board
•
•
•
•
Frequency range is 2360 to 2480 MHz
The MCR20 transceiver features an integrated transmit/receive switch to its differential
bidirectional RF input/output pin
Board features a low component count RF matching network with off-chip 1:1 Balun
“F” printed metal antenna for a small footprint, low-cost design
The layout has provision for out-of-band signal suppression (components L1 and C5) if required. Figure 6
shows the typical topology for the RF circuitry. A footprint is available to install RF connector J5 for
measurement purposes. When using J5, C1 should be installed and C4 removed.
Figure 6. FRDM-CR20A RF circuitry
4.2.2
Clocks
The FRDM-CR20A provides two clocks:
• 32 MHz Reference Oscillator - Figure 7 shows the external 32 MHz external crystal Y1. This
mounted crystal must meet the specifications outlined in the AN3251 application note. The IEEE
802.15.4 Standard requires that the frequency be accurate to less that +/-40 ppm.
— At 25°C, it is desired to have the frequency accurate to +/-10 ppm or less to allow for
temperature variation.
— Capacitors C16 and C17 provide the bulk of the crystal load capacitance.
— To measure the 32 MHz oscillator frequency, signal CLKOUT (pin-16) can optionally be
configured to provide a buffered output clock signal.
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Figure 7. FRDM-CR20A 32 MHz reference oscillator circuit
4.2.3
Power management
The FRDM-CR20A development board must be powered through the edge connectors from the Freescale
Freedom development platform board that it is plugged into. The FRDM-CR20A power management
circuit is shown in Figure 8.
Figure 8. FRDM-CR20A power management circuit
The two-pin header J6 provides the means to supply current to various board components and current
measurements if desired. The red LED marked as LED1 is available as a power indicator. The power
header/0 ohm resistor provides the means to supply either the IC or board circuits. Current measurements
can be made by inserting a current meter in place of a designated jumper. Connections configurations are
described in Table 2.
Table 2. Power distribution headers
Supply Designation
Header Pins
Description
P3V3_BRD
R4
1-2
Supply voltage to LEDs
• Normally jumpered
• Jumper used to enable LEDs, SW’s and Level Translator on board
• Leave open for lowest power
• Usage: Measure board current
P3V3_IC
J6
1-2
Supply voltage to MCR20A
• Normally jumpered
• Supplies the MCR20A tranceiver
• Usage: Measure or supply radio current
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4.2.4
FRDM-CR20A peripheral functions
The FRDM-CR20A development board includes the Freescale Freedom board headers enabling interface
to general purpose functions to assist with to assist with application implementations. The FRDM-CR20A
board also has alternate port functions routed to those interface headers where off-board Freescale
Freedom development platform peripherals can be used if desired.
4.2.4.1
RGB LED
The LED feature includes an RGB (Red, Green, Blue) LED. The RGB LED is driven by the MCU on
another board and not the transceiver, and therefore can be used with any application. Figure 9 shows the
RGB circuit, The RGB LED circuity offers the following features:
• RGB power supply is P3V3_BRD
• GPIO driven, externally by J4 Header, J4-4 Blue, J4-5 Green, J4-6 Red
• Optionally a 0 ohm resistor can be populated (R22-R24) and be driven by GPIO6 - 8 of the
transceiver
Figure 9. RGB LED feature
4.2.4.2
Push buttons
Push buttons can be used by the application to trigger events and are normally driven by an external MCU
or transceiver IC. Figure 10 shows the push buttons circuit implementation.
•
•
No power supply is required, however a pull-up circuit is feasible.
Connected to the D4 and D3 signals of connector J1 for interface to off-board circuitry.
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Figure 10. Push buttons
4.2.4.3
Level translator
The on-board level translator, U2, is used as a level shifter is useful when use with the Arduino system. It
provides the voltage translation from the Arduino 5V system to the Freescale MCU plus transceiver 3.3V
system. The level translator is supplied by the VCC_3V3 source. Figure 11 shows the translator circuit.
Figure 11. TXB0108 level translators
4.2.4.4
Interface connectors J1, J2, J3 and J4
The four connectors J1, J2, J3 and J4 are 100 mil pin headers mounted on the top (component side)
supporting the FDRM standard connector.
•
Voltage rails VCC_3V3, VCC_5V and V_IN(5-9V) are routed via header J3
— To avoid damage, the exact same voltage should supply peripherals on the FRDM-CR20A that
interface to the Freescale Freedom board supply, except where the level translator (U2) is used.
The pin definitions for the headers are shown in Table 3 and Table 4 respectively.
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Table 3. J1 & J2 connector
J1
Header
Pin
Number
Board Pin Name
J2
Description
Header
Pin
Number
Board Pin Name
Description
1
GPIO1
(D0/Rx/int)
1
GPIO4
(D8/Int)
2
GPIO2
(D1/Tx/int)
2
GPIO5
(D9/Int)
3
IRQ_B
(D2/int)
3
SPI_SS
(D10/SPI_SS)
4
SW2
(D3/PWM/int)
4
SPI_MOSI
(D11/MOSI)
5
SW1
(D4/int)
5
SPI_MISO
(D12/MISO)
6
RST
(D5/PWM/int)
6
SPI_CLK
(D13/SCK)
7
RX_Switch
(D6/PWM/Int)
7
GND
VSS (GND)board ground
8
GPIO3
(D7/CMP/int)
8
NC
VREF (NC)
9
GPIO6
(D14/Ana/Int)
10
CLK_OUT
(D15/Ana/Int)
Table 4. J3 & J4 connector
J3
J4
Header
Pin
Number
Board Pin Name
Description
Header
Pin
Number
Board Pin Name
Description
1
NC
NC
1
VDD_REGD
A0
2
IO_REF
FRDM-xxxxx = 3V3
Arduino UNO = 5V
2
P3V3_IC
A1
3
CPU_RSTb
RESET External
MCU
3
VDD_RF/VDD_IF/VDD
_PA
A2
4
VCC_3v3
3V3 V_IN
4
RGB_BLUE
A3
5
VCC_5V
5V V_IN
5
RGB_GREEN
A4
6
GND
GND
6
RGB_RED
A5
7
GND
GND
8
V_IN
5V - 9V Unregulated
Voltage
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5
4
3
2
1
4.3
25
26
TP9
R13
0
R14
0
IRQ_B
15
16
TP8
CLK_OUT
RX_SWITCH
TX_SWITCH
RF_P
SPI:MISO
SPI:MOSI
R1
CAD NOTE:
Embed pads into
50 Ohm line.
0
Z_RF_P
C2
1PF
Z_CAP
C3
10PF
TP13
C1
10PF
DNP
Z1
TP11
TP12
RF_SMA
R_MISO
R_MOSI
SPI:CLK
SPI:SS
4
6
2
5
3
1
C4
RF_50
1
RX_SWITCH
TX_SWITCH
ANT_A
ANT_B
11
12
13
14
RF_OUTP
RF_OUTN
28
29
RF_N
R2
35
L1
4.3nH
C5
1.2pF
DNP
100 Ohm controlled
impedance from DUT
to balun.
RST
33
Z_RF_N
DNP
U1
MCR20A
50 ohm controlled
impedence line from
Balun to SMA and F_Antenna
VCC_3V3
P3V3_BRD
3
Default Confing 1-2
RST_b_XCVR
LED1
RED
TP16
32MHZ
V_IN
C17
11pF
IO_REF
VCC_5V
VCC_3V3
1
2
3
TP17
TP27
HDR 1X2 TH
2
TL1015AF160QG
TP20
HDR TH 1X3
R5
220
DNP
SW3
1
C20
1000pF
TP26
J6
P3V3_BRD
R8
10.0K
DNP
J7
P3V3_IC
XTAL_32M
C
2
TP15
0
1
2
C16
11pF
R4
C
A
P3V3_BRD
4
CAD NOTE:
Open Solder Mask
Bottom below
F-Antenna on
"feedpoint" via
HARMONIC TRAP
Y1
1
ANT1
F_Antenna
CAD NOTE:
SMA - F-Antenna:
Place both
capacitor
sharing pin 1
C
EXTAL_32M
RF_ANT
10PF
2400MHz 50OHM
0
2
XTAL_32M
EXTAL_32M
D
1
SHORTING HEADER ON BOTTOM LAYER
TP25
DNP
TP24
DNP
TP21
DNP
Jumper is shorted by a cut-trace
on bottom layer. Cutting the trace
will effectively isolate for a IC current measurements
TP23
DNP
TP22
DNP
CPU_RSTb
Forces reset down,
1 - 2 XCVR
2 - 3
Arduino/FRDM host board
B
R17
D7/CMP/Int
D15/Ana/int
R21
D14/Ana/Int
0
DNP
0
D6/PWM/Int
GPIO6
IO_REF
D5/PWM/Int
P3V3_BRD
VCC_3V3
C21
P3V3_BRD
D13/SCK
0.1UF
D9/Int
R15
0
DNP GPIO5
R16
0
DNP
GPIO4
D1/Int/Rx
R18
0
DNP GPIO2
D0/Int/Tx
R19
0
DNP GPIO1
TP18
C18
1000pF
DNP
1
2
1
D3/PWM/Int
TL1015AF160QG
TP19
C19
1000pF
DNP
TL1015AF160QG
J1
J2
NOTE:
GPIO Signals come up (unbuffered)
from the host board, from Arduino
is 5V from FRDM is 3.3V
SKT_1X8
SKT_1X8
NOTE:
GPIO Signals come up (unbuffered)
from the host board, from Arduino
is 5V from FRDM is 3.3V
20
18
17
16
15
14
13
12
2
B1
B2
B3
B4
B5
B6
B7
B8
SKT_1X6
J3
J4
VCC_5V
A5
SH10
0
RGB_RED
A4
SH9
0
RGB_GREEN
OE
R20
SH6
CLK
MISO SH5
MOSI SH4
SS
SH3
Rx_SW SH7
RTS SH1
IRQ
SH2
1
3
4
5
6
7
8
9
10
0
0
0
0
0
0
0
0
CLK_OUT
SPI:CLK
SPI:MISO
SPI:MOSI
SPI:SS
RX_SWITCH
RST_b_XCVR
IRQ_B
VCC_3V3
TXB0108
CAD NOTE:
R20 closed to IC to reduce
the circuit trace parasitic
0
RGB_BLUE
A3
SH8
LED2
RGB_RED
A
R10
220
A2 DNP1
CPU_RSTb
A1
A0
5
A1
A2
A3
A4
A5
A6
A7
A8
V_IN
VCC_3V3
C14
2.2UF
NOTE:
On Arduino UNO, IO_REF is 5V
ON FRDM-xxxxx, IO_REF is 3.3V
U2
1
2
3
4
5
6
IO_REF
C13
10uF
D15/Ana/int
D13/SCK
D12/MISO
D11/MOSI
D10/SPI_SS
D6/PWM/Int
D5/PWM/Int
D2/int
11
SKT_1X10
19
2
8
7
6
5
4
3
2
1
10
9
8
7
6
5
4
3
2
1
D8/Int
D4/Int
SW2
VCCA
D2/int
0.1UF
VCCB
D11/MOSI
R7
10.0K
DNP
SW1
GND
R6
10.0K
DNP
D3/PWM/Int
D10/SPI_SS
B
C26
D4/Int
D12/MISO
DNP GPIO3
DNP 1
DNP1
L2
10nH
L3
10nH
L4
10nH
2
DNP 1
L5
10nH
2
DNP 1
L6
10nH
DNP 1
L7
10nH
2
C23
10uF
DNP
C25
10uF
DNP
C24
10uF
DNP
4
2 VDD_RF/VDD_IF/VDD_PA
2
P3V3_IC
2
VDD_REGD
NOTE:
Place componentes
to filtered powers
for host monitoring
LEDRGB_RED 1
P3V3_BRD
2
Z
4
LEDRGB_GREEN
R11
3
LEDRGB_BLUE
R12
RGB_GREEN
220
'
A
RGB_BLUE
220
CLV1A-FKB-CJ1M1F1BB7R4S3
RGB_RED
R22
0
DNP
RGB_GREEN
R23
0
DNP
GPIO8
RGB_BLUE
R24
0
DNP
GPIO7
3
ICAP Classification:
Drawing Title:
GPIO6
FCP: ___
FIUO: X
PUBI: ___
FRDM-MCR20A
Page Title:
FRDM-MCR20A Shield
2
Size
C
Document Number
Date:
Wednesday, November 19, 2014
Rev
B
SCH-28535 PDF: SPF28535
1
Sheet
3
of
3
Figure 12. FRDM-CR20A schematic RevB
VDD_RF/VDD_IF/VDD_PA
2
18
31
17
CLK_OUT
VSS_RF
10
IRQ
23
24
9
10
11
12
13
14
15
16
9
10
11
12
13
14
15
16
BMI-S-103
DNP
VSS_PA3
RST_b_XCVR
DTM0
DTM1
DTM2
DTM3
DTM4
DTM5
DTM6
VSSA_PA2
3
4
ANT_A
ANT_B
1
2
3
4
5
6
7
8
J5 DNP
SMA
Place both
resistors
with the same orientation
and provide same airgap
between MISO to MOSI resistors
terminals in a square fashion.
R_MISO
R_MOSI
R_SCLK
R_SSEL
VSSA_PA
XTAL_32M
EXTAL_32M
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
C8
0.1UF
CAD NOTE:
MISO/MOSI POKA-YOKE:
34
22
36
37
38
39
40
41
1
2
3
4
5
6
7
8
Schematic, board layout, and bill of material
TP7
VDD_RF
VDD_IF
TP3
TP4
TP5
VSS_RF2
TP6
TP10
5
6
7
8
9
19
20
21
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
TP1
TP2
VDD_REGD
1
32
D
C7
1000pF
C6
5pF
VBAT
VBAT2
C12
33PF
C11
0.33UF
30
C10
33PF
27
C9
0.47UF
P3V3_IC
VDD_PA/VDD_PA2
VDD_REGD
VDD_RF/VDD_IF/VDD_PA
VDD_REGD
VDD_RF/VDD_IF/VDD_PA
VDD_RF/VDD_IF/VDD_PA
S1
1
2
3
4
5
6
7
8
FRDM-CR20A development board
Figure 13. FRDM-CR20A reference board PCB component location (top view)
Figure 14. FRDM-CR20A reference board PCB test points
Freescale Freedom Development Board FRDM-CR20A User’s Guide, Rev. 0, 04/2015
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Freescale Semiconductor, Inc.
FRDM-CR20A development board
Figure 15. FRDM-CR20A reference board PCB layout (top view)
Figure 16. FRDM-CR20A reference board PCB layout (bottom view)
Freescale Freedom Development Board FRDM-CR20A User’s Guide, Rev. 0, 04/2015
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17
FRDM-CR20A development board
4.3.1
Bill of materials
Table 5. Bill of materials (Common parts for all frequency bands) (Sheet 1 of 3)
Item Qty Reference
Value
Description
Mfg. Name
Mfg. Part Number
1
1
ANT1
F_Antenna
PCB F ANTENNA, NO PART
ORDER
2
1
C1
10PF
CAP CER 10PF 50V 5% C0G 0402 AVX
04025A100JAT2A
3
1
C2
1PF
CAP CER 1PF 50V 5% C0G 0402 MURATA
GRM1555C1H1R0CA
01B
4
2
C3,C4
10PF
CAP CER 10PF 50V 5% C0G 0402 AVX
04025A100JAT2A
5
1
C5 DNP
1.2pF
CAP CER 1.2PF 50V 21% C0G
0402
C0402C129C5GAC
6
1
C6
5pF
CAP CER 5pF 50V 5% C0G 0402 MURATA
GJM1555C1H5R0CB0
1D
7
2
C7,C20
1000pF
CAP CER 1000PF 50V 5% C0G
0402
MURATA
GRM1555C1H102JA0
1D
8
3
C8,C21,C2 0.1UF
6
CAP CER 0.1UF 16V 10% X7R
0402
KEMET
C0402C104K4RAC
9
1
C9
0.47UF
CAP CER 0.47UF 6.3V 10% X5R
0402
MURATA
GRM155R60J474KE1
9D
10
2
C10,C12
33PF
CAP CER 33PF 50V 5% C0G 0402 VENKEL COMPANY
C0402C0G500-330JN
E
11
1
C11
0.33UF
CAP CER 0.33UF 6.3V 10% X5R
0402
MURATA
GRM155R60J334KE0
1D
12
1
C13
10uF
CAP CER 10UF 10V 20% X5R
0603
TAIYO YUDEN
LMK107BJ106MALTD
13
1
C14
2.2UF
CAP CER 2.2UF 10V 10% X7R
0603
TAIYO YUDEN
LMK107B7225KA-T
14
2
C16,C17
11pF
CAP CER 11pF 50V 1% C0G 0402 AVX
04025U110FAT2A
15
2
C18,C19
DNP
1000pF
CAP CER 1000PF 50V 5% C0G
0402
MURATA
GRM1555C1H102JA0
1D
16
3
C23,C24,C 10uF
25 DNP
CAP CER 10UF 6.3V 20% X5R
0402
TDK
C1005X5R0J106M050
BC
17
2
J1,J3
SKT_1X8
CON 1X8 SKT TH 100MIL SP
340H AU 394L
SAMTEC
SSQ-108-03-F-S
18
1
J2
SKT_1X10
CON 1X10 SKT TH 100MIL SP
340H AU 394L
SAMTEC
SSQ-110-03-F-S
19
1
J4
SKT_1X6
CON 1X6 SKT TH 100MIL SP
340H AU 394L
SAMTEC
SSQ-106-03-F-S
20
1
J5 DNP
SMA
CON, SMA, EDGE 0.062IN, 50
OHM FEMALE 18GHZ
EMERSON
NETWORK POWER
CONNECTIVITY
SOLUTIONS, INC
142-0701-851
KEMET
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FRDM-CR20A development board
Table 5. Bill of materials (Common parts for all frequency bands) (Sheet 2 of 3)
Item Qty Reference
Value
Description
Mfg. Name
Mfg. Part Number
21
1
J6 DNP
HDR 1X2
TH
HDR 1X2 TH 100MIL SP 339H AU SAMTEC
98L
TSW-102-07-G-S
22
1
J7
HDR TH
1X3
HDR 1X3 TH 100MIL SP 339H AU SAMTEC
100L
TSW-103-07-G-S
23
1
LED1
RED
LED RED CLEAR SGL 30MA SMT LITE ON
0805
LTST-C171KRKT
24
1
LED2
CLV1A-FKB LED RED BL GRN SGL
-CJ1M1F1B 50/25/25mA SMT
B7R4S3
CREE, INC
CLV1A-FKB-CJ1M1F1
BB7R4S3
25
1
L1 DNP
4.3nH
IND -- 4.3NH@500MHZ 160MA
2% 0402
MURATA
LQP15MN4N3B02
26
6
L2,L3,L4,L
5,L6,L7
DNP
10nH
IND -- 0.010uH@100MHZ 350MA
5% 0402
TDK
MLK1005S10NJT000
27
3
R1,R2,R20 0
RES MF ZERO OHM 1/16W 5%
0402
ROHM
MCR01MZPJ000
28
3
R4,R13,R1 0
4
RES MF ZERO OHM 1/10W -0603
VISHAY
CRCW06030000Z0EA
INTERTECHNOLOGY
29
4
R5,R10,R1 220
1,R12
RES MF 220 OHM 1/10W 5% 0603 KOA SPEER
30
3
R6,R7,R8
DNP
RES MF 10.0K 1/16W 1%
AEC-Q200 0402
VISHAY
CRCW040210K0FKE
INTERTECHNOLOGY D
31
9
R15,R16,R 0
17,R18,R1
9,R21,R22,
R23,R24
DNP
RES MF ZERO OHM 1/16W 5%
0402
ROHM
MCR01MZPJ000
32
10
SH1,SH2,S 0
H3,SH4,SH
5,SH6,SH7
,SH8,SH9,
SH10
ZERO OHM CUT TRACE 0402
PADS; NO PART TO ORDER
LAYOUT ELEMENT
ONLY
LAYOUT ELEMENT
ONLY
33
3
SW1,SW2,
SW3
TL1015AF1
60QG
SW SPST PB 50MA 12V SMT
E SWITCH
TL1015AF160QG
34
1
S1 DNP
BMI-S-103
SHIELD RF 1032X1032MIL 1
PIECE
LAIRD
TECHNOLOGIES
BMI-S-103
10.0K
RK73B1JTTD221J
Freescale Freedom Development Board FRDM-CR20A User’s Guide, Rev. 0, 04/2015
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19
PCB manufacturing specifications
Table 5. Bill of materials (Common parts for all frequency bands) (Sheet 3 of 3)
Item Qty Reference
Description
Mfg. Name
Mfg. Part Number
35
18
TP1,TP2,T TPAD_040
P3,TP4,TP
5,TP6,TP7,
TP8,TP9,T
P10,TP11,
TP12,TP13
,TP15,TP1
6,TP17,TP
26,TP27
TEST POINT PAD 40MIL DIA SMT, NOTACOMPONENT
NO PART TO ORDER
NOTACOMPONENT
36
3
TP18,TP19 TPAD_030
,TP20
TEST POINT PAD 30MIL DIA SMT, NOTACOMPONENT
NO PART TO ORDER
NOTACOMPONENT
37
5
TP21,TP22 TEST
,TP23,TP2 POINT
4,TP25
WHITE
DNP
TEST POINT WHITE 40 MIL
DRILL 180 MIL TH 109L
KEYSTONE
ELECTRONICS
5002
38
1
U1
MCR20A
IC XCVR 2.4GHZ 250KBPS
O-QPSK 1.8-3.6V MAPLGA41
FREESCALE
SEMICONDUCTOR
MCR20AVHM
39
1
U2
TXB0108
IC VXLTR 8BIT BIDIR 15KV ESD
1.2-3.6V/1.65-5.5V TSSOP20
TEXAS
INSTRUMENTS
TXB0108PWR
40
1
Y1
32MHZ
XTAL 32MHZ 9PF -- SMT
3.2X2.5MM
NDK
EXS00A-CS02368
41
1
Z1
2400MHz
50OHM
XFMR BALUN 2400 +/-100MHZ
SMT
MURATA
LDB212G4005C-001
•
•
•
•
•
5
Value
NOTES
FRDM-CR20A includes neither J5 (the SMA connector) nor the
external antenna.
For external measurements and/or external antenna usage, J5 should be
installed and soldered in place.
A 50 ohm SMA jack connector is required; recommended part number
142-0701-851 from Emerson/Johnson.
For an external antenna, the screw terminal 2.4 GHz antenna, part
number B4844-01 from Antenova is recommended.
Other external components can be found via suppliers/distributors such
as Mouser, Digikey, Newark, etc.
PCB manufacturing specifications
This section provides the specifications used to manufacture the FRDM-CR20A development printed
circuit board (PCB) described in this guide.
The FRDM-CR20A development platform PCBs must comply with the following:
• The PCB must comply with Perfag1D/3C (www.perfag.dk/en/)
Freescale Freedom Development Board FRDM-CR20A User’s Guide, Rev. 0, 04/2015
20
Freescale Semiconductor, Inc.
PCB manufacturing specifications
•
•
•
The PCB manufacturer’s logo is required
The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask
— The PCB manufacturer cannot insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
The required Underwriter’s Laboratory (UL) Flammability Rating
— The level is 94V-0 (www.ul.com/plastics/flame.html)
— The UL information must be stamped on the back of the PCB solder mask
•
•
•
5.1
NOTE
A complete set of design files is available for the MCR20AVHM
transceiver at the Freescale website (freescale.com/MCR20A) under the
“Software and Tools.” These reference designs should be used as a
starting point for a custom application.
The Application Note (AN5003) is also available at the same web site to
provide additional design guidance
The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
Single PCB construction
This section describes individual PCB construction details.
•
•
•
The FRDM-CR20A PCBs are two-layer, multi layer designs
The PCBs contain no blind, buried, or micro vias
PCB data:
— FRDM-CR20A size: Approximately 73x 53mm (2.88 x 2.10 inches)
— FRDM-CR20A final thickness (Cu/Cu): 1.57 mm (0.62 inches) +/- 10% (excluding solder
mask)
Table 6 defines some of the layers of the completed PCB. The artwork identification refers to the name of
the layer in commonly used terms.
Table 6. MCR20AVHM Layer by Layer Overview
Layer
Artwork Identification
File Name
1
Silkscreen Top
PSS.art
2
Top Layer Metal
L1_PS.art
3
Bottom Layer Metal
L2_SS.art
4
Silkscreen Bottom
SSS.art
Freescale Freedom Development Board FRDM-CR20A User’s Guide, Rev. 0, 04/2015
Freescale Semiconductor, Inc.
21
PCB manufacturing specifications
IMPORTANT: The FRDM-CR20A development board contains high frequency 2.4 GHz RF circuitry.
As a result, RF component placement, line geometries and layout, and spacing to the ground plane are
critical parameters. BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper thicknesses
and spacing must not be changed; follow the stackup (see Figure 17) information provided with the
reference design.
Figure 17. FRDM-CR20A PCB stackup cross-section (four layer)
•
•
5.2
Solder mask is required
Silk screen is required
Panelization
The panel size can be negotiated depending on production volume.
5.3
Materials
The PCB composite materials must meet the following requirements:
• Laminate—the base laminate material must be FR4. If the laminate material is changed, the RF
electrical characteristics may change and degrade RF performance.
• Copper foil
— Top and bottom copper layers must be 1 oz. copper
• Plating—All pad plating must be Hot Air Levelling (HAL)
5.4
Solder mask
The solder mask must meet the following requirements:
•
•
5.5
Solder mask type: Liquid Film Electra EMP110 or equivalent
Solder mask thickness: 10 – 30 µm
Silk screen
The silk screen must meet the following requirements:
• Silk screen color: White
• Silk screen must be applied after application of solder mask if solder mask is required
• The silk screen ink must not extend into any plated-thru-holes
• The silk screen must be clipped back to the line of resistance
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22
Freescale Semiconductor, Inc.
Revision history
5.6
•
•
5.7
Electrical PCB testing
All PCBs must be 100 percent tested for opens and shorts
Impedance measurement - An impedance measurement report is not mandatory
Packaging
Packaging for the PCBs must meet the following requirements:
• Finished PCBs must remain in panel
• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
5.8
Hole specification/tool table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28535.pdf file.
5.9
File description
Files included with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format.
Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
• FAB-28535.pdf—FRDM- Board fabrication drawing
• GRB-28535.zip—FRDM- Metal layers, solder mask, solder paste and silk screen
• SPF-28535.pdf—FRDM- Schematic
Design files are in Allegro format with OrCAD schematic capture.
6
Revision history
Rev.
number
Date
Substantive change(s)
0
03/2015
Initial public release.
Freescale Freedom Development Board FRDM-CR20A User’s Guide, Rev. 0, 04/2015
Freescale Semiconductor, Inc.
23
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Information in this document is provided solely to enable system and software
Home Page:
freescale.com
implementers to use Freescale products. There are no express or implied copyright
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information in this document.
licenses granted hereunder to design or fabricate any integrated circuits based on the
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
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vary over time. All operating parameters, including “typicals,” must be validated for
each customer application by customer’s technical experts. Freescale does not convey
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© 2015 Freescale Semiconductor, Inc.
Document Number: FRDMCR20AUG
Rev. 0
04/2015