Plastic Packages for Integrated Circuits Package Outline Drawing W7x8.46 7X8 ARRAY 46 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 0, 11/12 2.400 2.820±0.030 1.600 X 0.400 Y H PRELIMINARY G 0.200 F E 3.310±0.030 2.000 D 2.800 C B A (4X) 0.10 1 TOP VIEW 2 3 4 5 6 7 BOTTOM VIEW PIN 1 (A1 CORNER) 0.290 PACKAGE OUTLINE 0.400 0.240 0.550 MAX 0.200±0.030 0.265±0.035 x 46 0.10 ZXY 0.05 Z Z SEATING 0.05 Z PLANE SIDE VIEW NOTES: 3 NSMD 1. All dimensions are in millimeters. TYPICAL RECOMMENDED LAND PATTERN 2. Dimension and tolerance conform to ASMEY14.5-1994, and JESD 95-1 SPP-010. 3. NSMD refers to non-solder mask defined pad design per Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf 1