Plastic Packages for Integrated Circuits Package Outline Drawing W9x9.62 9X9 ARRAY 62 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 0, 2/13 3.200 3.690±0.030 Y 0.400 X I H G F 3.690±0.030 3.200 E 0.400 D C B A 0.10 1 (4X) TOP VIEW 0.400 3 4 5 6 7 8 9 BOTTOM VIEW PIN 1 (A1 CORNER) 0.290 2 PACKAGE OUTLINE 0.240 0.500±0.050 0.265±0.035 x 62 0.200±0.030 0.10 0.05 ZXY Z SEATING Z PLANE 0.05 Z SIDE VIEW 3 NSMD TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. All dimensions are in millimeters. 2. Dimension and tolerance conform to ASMEY14.5-1994, and JESD 95-1 SPP-010. 3. NSMD refers to non-solder mask defined pad design per Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf