Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
W9x9.62
9X9 ARRAY 62 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
Rev 0, 2/13
3.200
3.690±0.030
Y
0.400
X
I
H
G
F
3.690±0.030
3.200
E
0.400
D
C
B
A
0.10
1
(4X)
TOP VIEW
0.400
3
4
5
6
7
8
9
BOTTOM VIEW
PIN 1
(A1 CORNER)
0.290
2
PACKAGE
OUTLINE
0.240
0.500±0.050
0.265±0.035 x 62
0.200±0.030
0.10
0.05
ZXY
Z
SEATING
Z PLANE
0.05 Z
SIDE VIEW
3 NSMD
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1
1.
All dimensions are in millimeters.
2.
Dimension and tolerance conform to ASMEY14.5-1994,
and JESD 95-1 SPP-010.
3.
NSMD refers to non-solder mask defined pad design per
Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf