Plastic Packages for Integrated Circuits Package Outline Drawing W5x5.25E 5X5 ARRAY 25 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (With BSC) Rev 0, 1/14 Y X 2.070 ± 0.030 25x 0.265 ± 0.035 E D 1.600 C 2.330 ± 0.030 B 0.400 A 0.365 0.10 1 (4X) 2 3 4 5 0.400 PIN 1 (A1 CORNER) TOP VIEW 0.235 BOTTOM VIEW SEATING PLANE Z 3 0.05 Z PACKAGE OUTLINE 0.240 0.0400 BSC (BACK SIDE COATING) 0.400 0.265 ± 0.035 0.10 0.05 0.290 ZXY Z 3 NSMD 0.200 ± 0.03 TYPICAL RECOMMENDED LAND PATTERN 0.540 ± 0.050 SIDE VIEW NOTES: 1. All dimensions are in millimeters. 2. Dimension and tolerance per ASMEY 14.5M-1994, and JESD 95-1 SPP-010. 3. NSMD refers to Non-Solder Mask Defined pad design per Intersil Tech Brief TB451 located at: http://www.intersil.com/content/dam/Intersil/documents/ tb45/tb451.pdf 1