Plastic Packages for Integrated Circuits Package Outline Drawing W6x7.42 42 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.40mm PITCH) Rev 0, 2/15 X Y 0.400 2.80 ±0.030 G 42x 0.265 ±0.035 F E 3.20 ±0.030 D C B 0.400 A 1 0.10 (4X) PIN 1 (A1 CORNER) 2 4 5 6 0.200 TOP VIEW 0.400 BOTTOM VIEW Z PACKAGE OUTLINE 0.240 3 0.05 Z SEATING PLANE 3 0.290 2 0.400 6 NSMD 0.200 ±0.030 0.500 ±0.050 TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES: 1. 2. 3. 4. 5. 6. Dimensions and tolerance per ASME Y 14.5M - 1994. Dimension is measured at the maximum bump diameter parallel to primary datum Z . Primary datum Z and seating plane are defined by the spherical crowns of the bump. Bump position designation per JESD 95-1, SPP-010. All dimensions are in millimeters. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1 0.265 ±0.035 0.10 ZXY 0.05 Z 4