Plastic Packages for Integrated Circuits Package Outline Drawing W5x8.40A 40 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH) Rev 0, 2/15 X 2.06 ± 0.030 1.600 Y H 40x 0.265 ±0.035 G F 2.800 E 3.26 ± 0.030 D C B (4X) 0.230 A 0.10 1 PIN 1 (A1 CORNER) TOP VIEW 2 3 4 5 0.230 0.400 BOTTOM VIEW PACKAGE OUTLINE 0.240 0.05 Z Z SEATING PLANE 3 0.400 0.290 2 0.265 ±0.035 0.10 0.05 ZXY Z 4 6 NSMD 0.200 ±0.030 TYPICAL RECOMMENDED LAND PATTERN 0.500 ±0.050 SIDE VIEW NOTES: 1. Dimensions and tolerance per ASME Y14.5 - 1994. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z . 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. All dimensions are in millimeters. 6. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1