Plastic Packages for Integrated Circuits Package Outline Drawing W7x8.56A 56 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch) Rev 0, 6/14 X Y 2.400 3.22 ±0.030 H G 56x 0.265 ±0.035 F E 3.37 ±0.030 2.800 D 0.400 C B 0.285 A (4x) 0.10 1 2 3 4 5 6 7 PIN 1 (A1 CORNER) 0.410 0.400 TOP VIEW BOTTOM VIEW Z 0.05 Z PACKAGE OUTLINE SEATING PLANE 3 0.240 0.290 2 0.265 ±0.035 0.10 M Z X Y 0.05 M Z 0.400 4 0.200 ±0.030 6 NSMD TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. 2. 3. 4. 5. 6. 0.500 ±0.050 SIDE VIEW Dimensions and tolerance per ASME Y 14.5M - 1994. Dimension is measured at the maximum bump diameter parallel to primary datum Z . Primary datum Z and seating plane are defined by the spherical crowns of the bump. Bump position designation per JESD 95-1, SPP-010. All dimensions are in millimeters. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1