Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
W7x8.56A
56 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)
Rev 0, 6/14
X
Y
2.400
3.22 ±0.030
H
G
56x 0.265 ±0.035
F
E
3.37 ±0.030
2.800
D
0.400
C
B
0.285
A
(4x)
0.10
1
2
3
4
5
6
7
PIN 1 (A1 CORNER)
0.410
0.400
TOP VIEW
BOTTOM VIEW
Z
0.05 Z
PACKAGE OUTLINE
SEATING PLANE
3
0.240
0.290
2
0.265 ±0.035
0.10 M Z X Y
0.05 M Z
0.400
4
0.200 ±0.030
6 NSMD
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
2.
3.
4.
5.
6.
0.500 ±0.050
SIDE VIEW
Dimensions and tolerance per ASME Y 14.5M - 1994.
Dimension is measured at the maximum bump diameter parallel to primary datum Z .
Primary datum Z and seating plane are defined by the spherical crowns of the bump.
Bump position designation per JESD 95-1, SPP-010.
All dimensions are in millimeters.
NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451.
1