PANASONIC XN06214

Composite Transistors
XN06214 (XN6214)
Silicon NPN epitaxial planar type
Unit: mm
2.90+0.20
–0.05
1.9±0.1
(0.95) (0.95)
3
2
0.4±0.2
1
0.30+0.10
–0.05
0.50+0.10
–0.05
■ Basic Part Number
2.8+0.2
–0.3
6
(0.65)
• Two elements incorporated into one package
(Transistors with built-in resistor)
• Reduction of the mounting area and assembly cost by one half
5
1.50+0.25
–0.05
4
■ Features
5˚
For switching/digital circuits
0.16+0.10
–0.06
1.1+0.2
–0.1
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
50
V
Collector-emitter voltage (Base open)
VCEO
50
V
Collector current
IC
100
mA
Total power dissipation
PT
300
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
1: Collector (Tr1)
2: Base (Tr1)
3: Collector (Tr2)
EIAJ: SC-74
0 to 0.1
■ Absolute Maximum Ratings Ta = 25°C
1.1+0.3
–0.1
10˚
• UNR2214 (UN2214) × 2
4: Base (Tr2)
5: Emitter (Tr2)
6: Emitter (Tr1)
Mini6-G1 Package
Marking Symbol: AA
Internal Connection
4
5
6
Tr1
Tr2
3
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
VCBO
IC = 10 µA, IE = 0
50
Collector-emitter voltage (Base open)
VCEO
IC = 2 mA, IB = 0
50
Collector-base cutoff current (Emitter open)
ICBO
VCB = 50 V, IE = 0
Collector-emitter cutoff current (Base open)
ICEO
VCE = 50 V, IB = 0
0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 6 V, IC = 0
0.2
mA
hFE
VCE = 10 V, IC = 5 mA
80
hFE(Small
VCE = 10 V, IC = 5 mA
0.50
Forward current transfer ratio
Min
Typ
1
Collector-base voltage (Emitter open)
hFE ratio *
Conditions
2
Max
Unit
V
V
0.1
µA


0.99
/Large)
Collector-emitter saturation voltage
VCE(sat)
IC = 10 mA, IB = 0.3 mA
Output voltage high-level
VOH
VCC = 5 V, VB = 0.5 V, RL = 1 kΩ
Output voltage low-level
VOL
VCC = 5 V, VB = 2.5 V, RL = 1 kΩ
0.25
4.9
V
V
0.2
V
Input resistance
R1
−30%
10
+30%
kΩ
Resistance ratio
R1 / R 2
0.17
0.21
0.25

Transition frequency
fT
VCB = 10 V, IE = −2 mA, f = 200 MHz
150
MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Ratio between 2 elements
Note) The part number in the parenthesis shows conventional part number.
Publication date: July 2003
SJJ00103BED
1
XN06214
IC  VCE
VCE(sat)  IC
160
IB = 1.0 mA
400
Collector current IC (mA)
Total power dissipation PT (mW)
Ta = 25°C
300
200
120
0.9 mA
0.8 mA
0.7 mA
0.6 mA
0.5 mA
0.4 mA
80
0.3 mA
40
0.2 mA
100
0.1 mA
0
40
80
120
0
160
Ambient temperature Ta (°C)
0
Forward current transfer ratio hFE
VCE = 10 V
300
Ta = 75°C
200
25°C
−25°C
100
10
6
8
100
1 000
Collector current IC (mA)
6
5
3
2
0
0.1
1
10
Collector-base voltage VCB (V)
Input voltage VIN (V)
1
0.1
10
100
Output current IO (mA)
2
1
Ta = 75°C
25°C
0.1
−25°C
0.01
0.1
1
10
100
Collector current IC (mA)
104
VO = 5 V
Ta = 25°C
103
102
10
1
VO = 0.2 V
Ta = 25°C
1
10
IO  VIN
4
10
0.01
0.1
12
f = 1 MHz
IE = 0
Ta = 25°C
VIN  IO
100
10
IC / IB = 10
Cob  VCB
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
hFE  IC
1
4
100
Collector-emitter voltage VCE (V)
400
0
2
Output current IO (µA)
0
Collector-emitter saturation voltage VCE(sat) (V)
PT  Ta
500
SJJ00103BED
100
1
0.4
0.6
0.8
1.0
1.2
Input voltage VIN (V)
1.4
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
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permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL