ETC NP062A1

Composite Transistors
NP062A1
Silicon NPN epitaxial planar transistor
Unit: mm
For digital circuits
0.12+0.03
-0.02
4
1
2
0 to 0.02
3
0.10
• Two elements incorporated into one package
• Suitable for high-density mounting and downsizing of the equipment
• Contribute to low power consumption
0.80±0.05
■ Features
0.10
5
1.00±0.05
6
(0.35) (0.35)
1.00±0.05
■ Basic Part Number of Element
0.37+0.03
-0.02
• UNR32A1 × 2 elements
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Rating
of
element
Overall
(0.10)
Display at No.1 lead
Symbol
Rating
Unit
Collector-base voltage
(Emitter open)
VCBO
50
V
Collector-emitter voltage
(Base open)
VCEO
50
V
Collector current
IC
80
mA
Total power dissipation
PT
125
mW
Junction temperature
Tj
125
°C
Storage temperature
Tstg
−55 to +125
°C
1: Emitter (Tr1)
2: Emitter (Tr2)
3: Base (Tr2)
4: Collector (Tr2)
5: Base (Tr1)
6: Collector (Tr1)
SSSMini6-F1 Package
Marking Symbol: 7Z
Internal Connection
6
5
Tr1
Note) *: Measuring on substrate at 17 mm × 10 mm × 1 mm
1
■ Electrical Characteristics Ta = 25°C ± 3°C
Conditions
Min
4
Tr2
2
Typ
3
Parameter
Symbol
Max
Unit
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
50
V
Collector-emitter voltage (Base open)
VCEO
IC = 2 mA, IB = 0
50
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 50 V, IE = 0
0.1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = 50 V, IB = 0
0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 6 V, IC = 0
0.5
mA
Forward current transfer ratio
hFE
VCE = 10 V, IC = 5 mA
35
hFE Ratio *
hFE(Small/
VCE = 10 V, IC = 5 mA
0.5
Collector-emitter saturation voltage
VCE(sat)


0.99
Large)
IC = 10 mA, IB = 0.3 mA
Output voltage high level
VOH
VCC = 5 V, VB = 0.5 V, RL = 1 kΩ
Output voltage low level
VOL
VCC = 5 V, VB = 2.5 V, RL = 1 kΩ
Input resistance
R1
Resistance ratio
R1 / R 2
Transition frequency
fT
0.25
4.9
−30%
0.8
VCB = 10 V, IE = −2 mA, f = 200 MHz
V
V
0.2
V
10
+30%
kΩ
1.0
1.2
150

MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Ratio between one and another
Publication date: December 2002
SJJ00271AED
1
NP062A1
120
0.9 mA
70 0.8 mA
100
80
60
40
20
VCE(sat)  IC
IB = 1.0 mA
0.7 mA
0.6 mA
0.5 mA
0.4 mA
0.3 mA
60
50
0.2 mA
40
30
20
0.1 mA
10
Ta = 25°C
0
0
20
40
60
80
0
100 120 140
0
Ambient temperature Ta (°C)
2
4
−25°C
50
0
1
10
100
Collector current IC (mA)
10
1
0
5
10
15
20
25
Input voltage VIN (V)
10
10
100
Output current IO (mA)
2
0.1
−25°C
25°C
IC / IB = 10
0.01
1
10
SJJ00271AED
100
1 000
IO  VIN
30
35
Collector-base voltage VCB (V)
VO = 0.2 V
Ta = 25°C
1
Ta = 85°C
Collector current IC (mA)
100
f = 1 MHz
Ta = 25°C
VIN  IO
100
1
0.1
12
Output current IO (mA)
25°C
150
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
Forward current transfer ratio hFE
Ta = 85°C
100
10
1
Cob  VCB
VCE = 10 V
200
8
10
Collector-emitter voltage VCE (V)
hFE  IC
250
6
Collector-emitter saturation voltage VCE(sat) (V)
IC  VCE
80
Collector current IC (mA)
Total power dissipation PT (mW)
PT  Ta
140
40
VO = 5 V
Ta = 25°C
10
1
0.1
0
0.5
1.0
1.5
2.0
Input voltage VIN (V)
2.5
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and semiconductors described in this material
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if any of the products or technologies described in this material and controlled under the "Foreign
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product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
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2002 JUL