s11141-10 s11142-10 kspd1083e

Electron beam detector Si photodiodes
S11141-10
S11142-10
High sensitivity, direct detection of low
energy (1 keV or more) electron beams
Features
Applications
Direct detection of low energy (1 keV or more) electron
beams with high sensitivity
Backscattered electron detector for scanning electron
microscope (SEM)
High gain: 300 times,
high detection efficiency: 72 % (incident electron energy: 1.5 keV)
Large active area size
S11141-10: 10 × 10 mm
S11142-10: 14 × 14 mm (6.925 × 6.925 mm/1 ch)
ϕ2.0 mm hole in center of active area
Design is suitable for use with backscattered electron
detector of SEM.
S11142-10: 4-element photodiode
Detects reflection electron beam position (angle)
Thin ceramic package
Allows short-distance arrangement between the electron gun and a sample in a SEM
Uses a wiring board made of less magnetic materials
that are unlikely to affect electron beam trajectories.
Structure
Parameter
Photosensitive area
Number of elements
Package
Window material
S11141-10
10 × 10
1
S11142-10
14 × 14
4
Unit
mm
-
Value
20
-20 to +60
-20 to +80
260 °C or less, within 5 s
Unit
V
°C
°C
-
Ceramic
None
Absolute maximum ratings
Parameter
Reverse voltage
Operating temperature*1
Storage temperature*1
Soldering condition
Symbol
VR max.
Topr
Tstg
Tsol
Condition
Ta=25 °C
*1: No condensation
Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the
product within the absolute maximum ratings.
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1
Si photodiodes
S11141-10, S11142-10
Electrical and optical characteristics (Ta=25 °C)
Parameter
Symbol
Incident electron energy range
S11141-10
Min. Typ. Max.
1
30
Condition
-
Output current
Isc
Dark current
ID
Terminal capacitance
Ct
Cut-off frequency
fc
Electron multiplying gain
-
Electron energy 1.5 keV
Ip=100 pA*3
VR=10 mV
VR=5 V
VR=0 V, f=10 kHz
VR=5 V, f=10 kHz
VR=0 V, RL=50 Ω
λ=400 nm, -3 dB
VR=5 V, RL=50 Ω
λ=400 nm, -3 dB
Electron energy 1.5 keV
Ip=100 pA*3
S11142-10*2
Min. Typ. Max.
1
30
-
30
-
-
30
-
-
0.5
5
1700
450
3
60
2500
680
-
0.2
3
800
200
1.2
60
1200
300
-
0.4
-
-
0.8
-
-
2.5
-
-
5
-
-
300
-
-
300
-
Unit
keV
nA
nA
pF
MHz
-
*2: Per 1 element
*3: Injection current (probe current)
Gain vs. electron energy
Detection efficiency vs. electron energy
(Typ. Ta=25 °C, Ip=100 pA)
10000
(Typ. Ta=25 °C, Ip=100 pA)
100
Detection efficiency (%)
Gain
90
1000
80
70
60
50
40
30
20
100
10
0
10
20
30
Electron energy (keV)
0
10
20
30
Electron energy (keV)
KSPDB0344EA
Gain = Isc/Ip
Detection efficiency = (Gain/GTH) × 100
GTH = Electorn energy/3.62
KSPDB0347EA
2
Si photodiodes
S11141-10, S11142-10
Electron multiplication principle
Output current
Silicon
Si photodiode
Vacuum
Electron
Dead
layer
Generation of
electron-hole pairs
(electron multiplication)
Detail
Electrons generate ions as they pass through silicon. This ionization process generates a
large number of electron-hole pairs that then multiply the number of electrons.
The electron multiplication can boost the output current by approximately 300 times at an
input electron energy of 1.5 keV (refer to "Gain vs. electron energy").
KSPDC0089EA
Dark current vs. reverse voltage
(typical example)
Terminal capacitance vs. reverse voltage
(Ta=25 °C)
1 μA
100 nA
100 nF
Terminal capacitance
Dark current
10 nA
S11141-10
1 nA
S11142-10
100 pA
10 pA
1 pA
100 fA
0.1
(Typ. Ta=25 °C)
1 μF
10 nF
S11141-10
1 nF
100 pF
S11142-10
10 pF
1 pF
1
10
100
Reverse voltage (V)
100 fF
0.1
1
10
100
Reverse voltage (V)
KSPDB0345EA
KSPDB0346EA
3
Si photodiodes
S11141-10, S11142-10
Dimensional outlines (unit: mm, tolerance unless otherwise noted: ±0.2)
S11141-10
25.0
10.0
(2 ×) 3.0 (2 ×) 0.2
5.08
Light shield Al
10.0
5.5 ± 0.2
Wire protection
resin
Photosensitive area
0.5 ± 0.1
(0.25)
ɸ2.0
Chip hole
1.0 max.
11.0-0
Ceramic
+0.2
ɸ2.3
(2 ×) 1.5
(0.5)
ɸ7.0
Ceramic hole
KSPDA0187EA
4
Si photodiodes
S11141-10, S11142-10
S11142-10
35.0
7.5 ± 0.2
ɸ2.3
1.8 0.3
P2.54 × 4 = 10.16
Anode common
0.15
Wire protection resin
Photosensitive area
1.0 max.
14.0
0.5 ± 0.1
(0.25)
ɸ2.0
Chip hole
2.54
(4 ×) 6.925
0.15
14.0
15.0-0
Ceramic
+0.2
1.2
Light shield Al
ɸ7.0
Ceramic hole
KSPDA0188EA
5
Si photodiodes
S11141-10, S11142-10
Recommend soldering conditions
· Soldering temperature: below 260 °C
· Soldering time: within 5 seconds
Related information
www.hamamatsu.com/sp/ssd/doc_en.html
Precautions
∙ Notice
∙ Unsealed products
Technical information
∙ Si photodiode / Application circuit examples
Information described in this material is current as of November, 2014.
Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the
information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always
contact us for the delivery specification sheet to check the latest specifications.
The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that
one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use.
Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission.
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HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184
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Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39) 02-93581733, Fax: (39) 02-93581741
China: Hamamatsu Photonics (China) Co., Ltd.: B1201, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866
Cat. No. KSPD1083E01 Nov. 2014 DN
6