HFA1212/883 PRELIMINARY Dual, High Speed, Low Power, Video Closed Loop Buffer June 1994 Features Description • This Circuit is Processed in Accordance to MIL-STD883 and is Fully Conformant Under the Provisions of Paragraph 1.2.1. The HFA1212/883 is a dual closed loop Buffer featuring user programmable gain and high speed performance. Manufactured on Intersil’s proprietary complementary bipolar UHF-1 process, this device offers wide -3dB bandwidth of 340MHz, very fast slew rate, excellent gain flatness and high output current. • User Programmable For Closed-Loop Gains of +1, -1 or +2 Without Use of External Resistors • Standard Operational Amplifier Pinout • Low Supply Current. . . . . . . . . . 5.9mA/Op Amp (Typ) • Excellent Gain Accuracy . . . . . . . . . . . . . . 0.99V/V (Typ) • Wide -3dB Bandwidth . . . . . . . . . . . . . . . 340MHz (Typ) • Fast Slew Rate . . . . . . . . . . . . . . . . . . . . 1155V/µs (Typ) • High Input Impedance . . . . . . . . . . . . . . . . . . 1MΩ (Typ) • Excellent Gain Flatness (to 50MHz) . . . . ±0.02dB (Typ) • Fast Overdrive Recovery. . . . . . . . . . . . . . . <10ns (Typ) Applications A unique feature of the pinout allows the user to select a voltage gain of +1, -1, or +2, without the use of any external components. Gain selection is accomplished via connections to the inputs, as described in the “Application Information” section. The result is a more flexible product, fewer part types in inventory, and more efficient use of board space. Compatibility with existing op amp pinouts provides flexibility to upgrade low gain amplifiers, while decreasing component count. Unlike most buffers, the standard pinout provides an upgrade path should a higher closed loop gain be needed at a future date. Ordering Information • Flash A/D Driver • Video Switching and Routing PART NUMBER • Pulse and Video Amplifiers HFA1212MJ/883 TEMPERATURE RANGE PACKAGE -55oC to +125oC 8 Lead CerDIP • Wideband Amplifiers • RF/IF Signal Processing • Medical Imaging Systems Pinout HFA1212/883 (CERDIP) TOP VIEW OUT1 1 8 V+ 7 OUT2 6 -IN2 5 +IN2 -+ -IN1 2 +IN1 3 V- 4 +- CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 3-219 511111-883 File Number 3742 Spec Number Specifications HFA1212/883 Absolute Maximum Ratings Thermal Information Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V Voltage at Either Input Terminal . . . . . . . . . . . . . . . . . . . . . . V+ to VOutput Current (Note 1) . . . . . . . . . . . . . . . . Short Circuit Protected Output Current (50% Duty Cycle, Note 1) . . . . . . . . . . . . . . . . 60mA Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC ESD Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . > 2000V Storage Temperature Range . . . . . . . . . . . . . . -65oC ≤ TA ≤ +150oC Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300oC Thermal Resistance θJA θJC CerDIP Package . . . . . . . . . . . . . . . . . 115oC/W 30oC/W Maximum Package Power Dissipation at +75oC CerDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.87W Package Power Dissipation Derating Factor above +75oC CerDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.7mW/oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Operating Conditions Operating VSUPPLY (±VS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5V Operating Temperature Range . . . . . . . . . . . . . -55oC ≤ TA ≤ +125oC RL ≥ 50Ω TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS Device Tested at: VSUPPLY = ±5V, AV = +1, RSOURCE = 0Ω, RL = 100Ω, VOUT = 0V, Unless Otherwise Specified. LIMITS PARAMETERS Output Offset Voltage SYMBOL VOS CONDITIONS VCM = 0V GROUP A SUBGROUPS TEMPERATURE MIN MAX UNITS 1 +25oC -10 10 mV -20 20 mV -15 15 mV -30 30 mV 2, 3 Channel-to-Channel Output Offset Voltage Mismatch ∆VOS Common Mode Rejection Ratio CMRR Power Supply Rejection Ratio Channel-to-Channel +IN Current Mismatch 1 2, 3 PSRRP PSRRN Non-Inverting Input (+IN) Current VCM = 0V IBSP ∆IBSP +125oC, -55oC +25oC +125oC, -55oC ∆VCM = ±1.8V V+ = 3.2V, V- = -6.8V V+ = 6.8V, V- = -3.2V 1 +25oC 42 - dB 2 +125oC 39 - dB ∆VCM = ±1.2V V+ = 3.8V, V- = -6.2V V+ = 6.2V, V- = -3.8V 3 -55oC 39 - dB ∆VSUPPLY = ±1.8V V+ = 6.8V, V- = -5V V+ = 3.2V, V- = -5V 1 +25oC 45 - dB 2 +125oC 42 - dB ∆VSUPPLY = ±1.2V V+ = 6.2V, V- = -5V V+ = 3.8V, V- = -5V 3 -55oC 42 - dB ∆VSUPPLY = ±1.8V V+ = 5V, V- = -6.8V V+ = 5V, V- = -3.2V 1 +25oC 45 - dB 2 +125oC 42 - dB ∆VSUPPLY = ±1.2V V+ = 5V, V- = -6.2V V+ = 5V, V- = -3.8V 3 -55oC 42 - dB VCM = 0V 1 +25oC -15 15 µA 2, 3 +125oC, -55oC -25 25 µA 1 +25oC -15 15 µA 2, 3 +125oC, -55oC -25 25 µA VCM = 0V Spec Number 3-220 511111-883 Specifications HFA1212/883 TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) Device Tested at: VSUPPLY = ±5V, AV = +1, RSOURCE = 0Ω, RL = 100Ω, VOUT = 0V, Unless Otherwise Specified. LIMITS PARAMETERS SYMBOL +IN Current Common Mode Sensitivity CMSIBP +IN Resistance Gain +RIN AVP1 AVM1 AVP2 Channel-to-Channel Gain Mismatch ∆AVP1 ∆AVM1 ∆AVP2 Output Voltage Swing VOP100 VON100 Output Voltage Swing VOP50 VON50 GROUP A SUBGROUPS TEMPERATURE MIN MAX UNITS ∆VCM = ±1.8V V+ = 3.2V, V- = -6.8V V+ = 6.8V, V- = -3.2V 1 +25oC - 1.25 µA/V 2 +125oC - 2.85 µA/V ∆VCM = ±1.2V V+ = 3.8V, V- = -6.2V V+ = 6.2V, V- = -3.8V 3 -55oC - 2.85 µA/V Note 2 1 +25oC 800 - kΩ CONDITIONS AV = +1 VIN = -1V to +1V AV = -1 VIN = -1V to +1V AV = +2 VIN = -1V to +1V AV = +1 VIN = -1V to +1V AV = -1 VIN = -1V to +1V AV = +2 VIN = -1V to +1V o o 2, 3 +125 C, -55 C 350 - kΩ 1 +25oC 0.98 1.02 V/V o o 2, 3 +125 C, -55 C 0.975 1.025 V/V 1 +25oC -0.98 -1.02 V/V -0.975 -1.025 V/V 1.96 2.04 V/V 1.95 2.05 V/V -0.02 0.02 V/V -0.025 0.025 V/V -0.025 0.025 V/V -0.025 0.025 V/V -0.04 0.04 V/V -0.05 0.05 V/V 3 - V 2.8 - V - -3 V - -2.8 V 2, 3 1 2, 3 1 2, 3 1 2, 3 1 2, 3 -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC AV = -1 RL = 100Ω VIN = -3.2V AV = -1 RL = 100Ω VIN =+3.2V VIN = +3V 2, 3 AV = -1 RL = 50Ω VIN = -2.7V 1 +25oC 2.5 - V VIN = -2.25V 2 +125oC 2.0 - V VIN = -2.25V 3 -55oC 1.4 - V VIN = +2.7V 1 +25oC - -2.5 V VIN = +2.25 V 2 +125oC - -2.0 V VIN = +2.25 V 3 -55oC - -1.4 V AV = -1 RL = 50Ω VIN = -3V 1 +125oC, 2, 3 1 +125oC, -55oC +25oC +125oC, -55oC Spec Number 3-221 511111-883 Specifications HFA1212/883 TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) Device Tested at: VSUPPLY = ±5V, AV = +1, RSOURCE = 0Ω, RL = 100Ω, VOUT = 0V, Unless Otherwise Specified. LIMITS PARAMETERS SYMBOL Output Current +IOUT -IOUT Quiescent Power Supply Current ICC CONDITIONS GROUP A SUBGROUPS TEMPERATURE MIN MAX UNITS 1 +25oC 50 - mA 2 +125oC 40 - mA 3 -55oC 28 - mA 1 +25oC - -50 mA 2 +125oC - -40 mA 3 -55oC - -28 mA 1 +25oC 5.6 6.1 mA/Op Amp 5.2 6.5 mA/Op Amp -6.1 -5.6 mA/Op Amp -6.5 -5.2 mA/Op Amp Note 3 Note 3 RL = 100Ω +125oC, 2, 3 IEE RL = 100Ω -55oC +25oC 1 +125oC, 2, 3 -55oC NOTES: 1. Output is short circuit protected to ground. Brief short circuits to ground will not degrade reliability, however continuous (100% duty cycle) output current must not exceed 30mA for maximum reliability. 2. Guaranteed from +IN Common Mode Rejection Test, by: +RIN = 1/CMSIBP . 3. Guaranteed from VOUT Test with RL = 50Ω, by: IOUT = VOUT/50Ω. TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS Table 2 Intentionally Left Blank. TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS Table 3 Intentionally Left Blank. TABLE 4. ELECTRICAL TEST REQUIREMENTS MIL-STD-883 TEST REQUIREMENTS SUBGROUPS (SEE TABLE 1) Interim Electrical Parameters (Pre Burn-In) 1 Final Electrical Test Parameters 1(Note 1), 2, 3 Group A Test Requirements 1, 2, 3 Groups C and D Endpoints 1 NOTE: 1. PDA applies to Subgroup 1 only. Spec Number 3-222 511111-883 HFA1212/883 Die Characteristics DIE DIMENSIONS: 69 x 92 x 19 mils ± 1 mils 1750 x 2330 x 483µm ± 25.4µm METALLIZATION: Type: Metal 1: AICu(2%)/TiW Thickness: Metal 1: 8kÅ ± 0.4kÅ Type: Metal 2: AICu(2%) Thickness: Metal 2: 16kÅ ± 0.8kÅ GLASSIVATION: Type: Nitride Thickness: 4kÅ ± 0.5kÅ WORST CASE CURRENT DENSITY: TBD TRANSISTOR COUNT: 150 SUBSTRATE POTENTIAL (Powered Up): Floating (Recommend Connection to V-) Metallization Mask Layout HFA1212/883 -IN1 OUT1 NC V+ NC OUT2 +IN1 NC -IN2 V- NC +IN2 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Spec Number 3-223 511111-883