VS-GB150YG120NT Datasheet

VS-GB150YG120NT
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Vishay Semiconductors
IGBT ECONO3 Module, 150 A
FEATURES
• Gen 5 non punch through (NPT) technology
• 10 μs short circuit capability
• Square RBSOA
• HEXFRED low Qrr, low switching energy
• Positive temperature coefficient
• Copper baseplate
• Operating frequencies 8 kHz to 60 kHz
• Low stray inductance design
• UL approved file E78996
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
ECONO3 4 pack
BENEFITS
• Benchmark efficiency for SMPS appreciation in particular
HF welding
PRODUCT SUMMARY
VCES
1200 V
IC(DC) at TC = 57 °C
150 A
VCE(on) typ. at 150 A
3.45 V
Package
ECONO3 4 pack
Circuit
4 pack with thermistor
• Rugged transient performance
• Low EMI, requires less snubbing
• Direct mounting to heatsink space saving
• PCB solderable terminals
• Low junction to case thermal resistance
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter voltage
VCES
Continuous collector current
IC
Pulsed collector current
ICM
Clamped inductive load current
ILM
Diode continuous forward current
IF
Diode maximum forward current
IFSM
Gate to emitter voltage
VGE
Maximum power dissipation
IGBT
PD
TEST CONDITIONS
MAX.
UNITS
1200
V
TC = 25 °C
182
TC = 80 °C
124
370
370
TC = 25 °C
TC = 80 °C
A
113
78
730
± 20
TC = 25 °C
892
TC = 80 °C
500
V
W
MODULE
TJ
-55 to +150
Storage temperature range
Operating junction temperature range
TStg
-40 to +125
RMS isolation voltage
VISOL
Any terminal to case, t = 1 s
3500
°C
V
Revision: 22-Apr-16
Document Number: 93631
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Collector to emitter breakdown voltage
Collector to emitter voltage
V(BR)CES
VCE(on)
Gate threshold voltage
VGE(th)
Temperature coefficient of threshold voltage VGE(th)/TJ
Collector to emitter leaking current
ICES
Diode forward voltage drop
VFM
Gate to emitter leakage current
IGES
MIN.
TYP.
MAX.
VGE = 0 V, IC = 500 μA
TEST CONDITIONS
1200
-
-
VGE = 15 V, IC = 150 A
-
3.45
4.0
VGE = 15 V, IC = 200 A
-
3.9
-
VGE = 15 V, IC = 150 A, TJ = 125 °C
-
3.87
-
VGE = 15 V, IC = 200 A, TJ = 125 °C
-
4.42
-
4.1
4.9
6.5
-
-12.3
-
VCE = VGE, IC = 1.5 mA
VCE = VGE, IC = 1 mA, (25 °C to 125 °C)
UNITS
V
mV/°C
VGE = 0 V, VCE = 1200 V
-
21
120
μA
VGE = 0 V, VCE = 1200 V, TJ = 125 °C
-
1.57
-
mA
IF = 100 A
-
2.73
3.5
IF = 150 A
-
3.18
-
IF = 100 A, TJ = 125 °C
-
2.8
-
IF = 150 A, TJ = 125 °C
-
3.4
-
VGE = ± 20 V
-
-
± 440
nA
MIN.
TYP.
MAX.
UNITS
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
Total gate charge (turn-on)
Qg
IC = 150 A
-
1260
-
Gate to emitter charge (turn-on)
Qge
-
130
-
Gate to collector charge (turn-on)
Qgc
VCC = 600 V
VGE = 15 V
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
IC = 150 A, VCC = 600 V, VGE = 15 V, 
Rg = 4.7 , L = 500 μH, TJ = 25 °C
VCC = 600 V, IC = 150 A, VGE = 15 V, 
Rg = 4.7 , L = 500 μH, TJ = 125 °C
IC = 150 A, VCC = 600 V, VGE = 15 V, 
Rg = 4.7 , L = 500 μH, TJ = 125 °C
tf
Reverse bias safe operating area
RBSOA
TJ = 150 °C, IC = 370 A, Rg = 4.7 , 
VGE = 15 V to 0, VCC = 600 V, VP = 1200 V
Short circuit safe operating area
SCSOA
TJ = 150 °C, VCC = 900 V, VP = 1200 V,
Rg = 10 , VGE = 15 V to 0
Diode reverse recovery time
Diode peak reverse current
Diode recovery charge
TJ = 25 °C
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
trr
Irr
Qrr
VR = 400 V, IF = 50 A
dI/dt = 200 A/μs
-
500
-
-
5.86
-
-
4.7
-
-
10.56
-
-
7.74
-
-
7.2
-
-
14.94
-
-
474
-
-
89
-
-
520
-
-
101
-
10
-
-
-
210
-
-
345
-
-
13.8
-
-
23.2
-
-
1448
-
-
3990
-
nC
mJ
ns
μs
ns
A
nC
Revision: 22-Apr-16
Document Number: 93631
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INTERNAL NTC - THERMISTOR SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUE
UNITS
R25
TC = 25 °C
5000
R100
TC = 100 °C
493 ± 5 %
R2 = R25 exp. [B25/50 (1/T2 - 1/(298.15 K))]
3375 ± 5 %
K
220
°C
Dissipation constant
2
mW/°C
Thermal time constant
8
s
UNITS
Resistance
B-value
B25/50
Maximum operating temperature

THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
IGBT - Junction to case (per switch)
RthJC
-
-
0.14
DIODE - Junction to case (per diode)
RthJC
-
-
0.3
Case to sink, flat, greased surface (per module)
RthJS
Mounting torque (M5)
Weight
-
0.015
-
3.0
-
6.0
Nm
-
290
-
g
300
240
TJ = 25 °C
IC (A)
180
150
TJ = 125 °C
120
90
60
30
0
Allowable Case Temperature (°C)
160
270
210
140
120
100
DC
80
60
40
20
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
0
VCE (V)
40
60
80 100 120 140 160 180 200
Fig. 3 - Maximum IGBT Continuous Collector Current vs.
Case Temperature
300
240
20
IC - Continuous Collector Current (A)
Fig. 1 - Typical IGBT Output Characteristics, VGE = 15 V
270
°C/W
4.9
VGE = 12 V
VGE = 15 V
VGE = 18 V
4.6
200 A
4.3
210
IC (A)
150
VGE = 9 V
120
VCE (V)
4.0
180
150 A
3.7
3.4
100 A
90
3.1
60
2.8
30
2.5
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
0
20
40
60
80
100
120
140
160
VCE (V)
TJ (°C)
Fig. 2 - Typical IGBT Output Characteristics, TJ = 125 °C
Fig. 4 - Collector to Emitter Voltage vs. Junction Temperature
Revision: 22-Apr-16
Document Number: 93631
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VS-GB150YG120NT
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300
10
VCE = 20 V
270
TJ = 150 °C
240
1
TJ = 125 °C
ICES (mA)
210
IC (A)
180
150
120
0.1
0.01
TJ = 25 °C
TJ = 125 °C
90
60
0.001
TJ = 25 °C
30
0.0001
0
3
4
5
6
7
8
9
10
11
0
200
400
800
1000
1200
VCES (V)
VGE (V)
Fig. 5 - Typical IGBT Transfer Characteristics
Fig. 8 - Typical IGBT Zero Gate Voltage Collector Current
5.5
300
5.2
270
4.9
240
TJ = 25 °C
4.6
210
4.3
TJ = 25 °C
180
IF (A)
VGE(th) (V)
600
4.0
3.7
TJ = 125 °C
150
120
TJ = 125 °C
3.4
90
3.1
60
2.8
30
2.5
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
IC (mA)
VFM (V)
Fig. 6 - Typical IGBT Gate Threshold Voltage
Fig. 9 - Typical Diode Forward Characteristics
160
Allowable Case Temperature (°C)
1000
IC (A)
100
10
Chip level
Module level
1
10
100
1000
10 000
140
120
100
DC
80
60
40
20
0
0
20
40
60
80
100
120
VCE (V)
IF - Continuous Forward Current (A)
Fig. 7 - IGBT Reverse BIAS SOA TJ = 150 °C, VGE = 15 V
Fig. 10 - Maximum Diode Continuous Forward Current vs.
Case Temperature
Revision: 22-Apr-16
Document Number: 93631
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VS-GB150YG120NT
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10 000
11
10
td(off)
Switching Time (ns)
9
Energy (mJ)
8
7
Eon
6
5
Eoff
4
3
2
td(on)
1000
tr
100
tf
1
0
10
40
60
80
0
100 120 140 160 180 200 220
5
10
15
IC (A)
td(on)
tf
trr (ns)
Switching Time (ns)
td(off)
100
tr
10
80
30
35
40
45
50
Fig. 14 - Typical IGBT Switching Time vs. Rg
TJ = 125 °C, VCC = 600 V, IC = 150 A, VGE = 15 V, L = 500 μH
1000
60
25
Rg (Ω)
Fig. 11 - Typical IGBT Energy Loss vs. IC
TJ = 125 °C, VCC = 600 V, Rg = 4.7 , VGE = 15 V, L = 500 μH
40
20
460
440
420
400
380
360
340
320
300
280
260
240
220
200
180
160
140
120
100
100 120 140 160 180 200 220
TJ = 125 °C
TJ = 25 °C
100
200
300
400
500
IC (A)
dIF/dt (A/μs)
Fig. 12 - Typical IGBT Switching Time vs. IC
TJ = 125 °C, VCC = 600 V, Rg = 4.7 , VGE = 15 V, L = 500 μH
Fig. 15 - Typical Diode Reverse Recovery Time vs. dIF/dt
Vrr = 400 V, IF = 50 A
45
40
37
40
34
35
31
25
20
Irr (A)
Energy (mJ)
TJ = 125 °C
28
30
Eon
25
22
TJ = 25 °C
19
16
15
13
10
10
Eoff
5
7
4
0
0
5
10
15
20
25
30
35
40
45
50
100
200
300
400
500
Rg (Ω)
dIF/dt (A/μs)
Fig. 13 - Typical IGBT Energy Loss vs. Rg
TJ = 125 °C, VCC = 600 V, IC = 150 A, VGE = 15 V, L = 500 μH
Fig. 16 - Typical Diode Reverse Recovery Current vs. dIF/dt
Vrr = 400 V, IF = 50 A
Revision: 22-Apr-16
Document Number: 93631
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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VS-GB150YG120NT
Qrr (nC)
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4700
4400
4100
3800
3500
3200
2900
2600
2300
2000
1700
1400
1100
800
500
200
TJ = 125 °C
TJ = 25 °C
100
200
300
400
500
dIF/dt (A/μs)
Fig. 17 - Typical Diode Reverse Recovery Charge vs. dIF/dt, Vrr = 400 V, IF = 50 A
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.01
0.001
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 18 - Maximum Thermal Impedance ZthJC Characteristics (IGBT)
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.01
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 19 - Maximum Thermal Impedance ZthJC Characteristics (Diode)
Revision: 22-Apr-16
Document Number: 93631
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VS-GB150YG120NT
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ORDERING INFORMATION TABLE
Device code
VS-
G
B
150
Y
G
120
N
T
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Insulated gate bipolar transistor (IGBT)
3
-
B = IGBT Generation 5 NPT
4
-
Current rating (150 = 150 A)
5
-
Circuit configuration (Y = 4 pack)
6
-
Package indicator (G = ECONO3)
7
-
Voltage rating (120 = 1200 V)
8
-
Speed / type (N = ultrafast with reduced diode, speed 8 kHz to 60 kHz)
9
-
NTC Thermistor
CIRCUIT CONFIGURATION
CIRCUIT
CIRCUIT CONFIGURATION CODE
CIRCUIT DRAWING
23 24
13 14
QB1
QB3
3
4
4 pack with thermistor
19
20
21
22
Y
QB2
9
10
QB4
1
2
15
16
17
18
7
8
25 26
5
Ntc
6
11 12
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95686
Revision: 22-Apr-16
Document Number: 93631
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Outline Dimensions
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Vishay Semiconductors
ECONO3 4 Pack
DIMENSIONS in millimeters and inches
22 21 20 19
18 17 16 15
23
24
14
13
25
26
12
11
1 2
3 4
5 6
7 8
9 10
Revision: 21-Apr-16
Document Number: 95686
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
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Revision: 02-Oct-12
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Document Number: 91000