SQP90P06-07L Datasheet

SQP90P06-07L
www.vishay.com
Vishay Siliconix
Automotive P-Channel 60 V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• TrenchFET® power MOSFET
-60
RDS(on) (Ω) at VGS = -10 V
0.0067
RDS(on) (Ω) at VGS = -4.5 V
0.0088
ID (A)
• Package with low thermal resistance
• AEC-Q101 qualified d
• 100 % Rg and UIS tested
-120
Configuration
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
Single
TO-220AB
S
G
Top View
G
D
S
D
P-Channel MOSFET
ORDERING INFORMATION
Package
TO-220
Lead (Pb)-free and Halogen-free
SQP90P06-07L-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-Source Voltage
VDS
-60
Gate-Source Voltage
VGS
± 20
Continuous Drain Current a
TC = 25 °C a
TC = 125 °C
Continuous Source Current (Diode Conduction) a
Pulsed Drain
Current b
Single Pulse Avalanche Current
L = 0.1 mH
Single Pulse Avalanche Energy
Maximum Power Dissipation b
TC = 25 °C
TC = 125 °C
Operating Junction and Storage Temperature Range
ID
UNIT
V
-120
-87
IS
-120
IDM
-480
IAS
-80
EAS
320
PD
A
mJ
300
W
100
TJ, Tstg
-55 to +175
°C
SYMBOL
LIMIT
UNIT
RthJA
40
RthJC
0.5
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
Junction-to-Case (Drain)
PCB Mount c
°C/W
Notes
a. Package limited.
b. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
c. When mounted on 1" square Pcb (Fr-4 material).
d. Parametric verification ongoing.
S14-0585-Rev. A, 17-Mar-14
Document Number: 62665
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQP90P06-07L
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current a
Drain-Source On-State Resistance a
Forward
Transconductance b
VDS
VGS = 0, ID = -250 μA
-60
-
-
VGS(th)
VDS = VGS, ID = -250 μA
-1.5
-2.0
-2.5
IGSS
VDS = 0 V, VGS = ± 20 V
-
-
± 100
-1
IDSS
ID(on)
RDS(on)
gfs
VGS = 0 V
VDS = -60 V
-
-
VGS = 0 V
VDS = -60 V, TJ = 125 °C
-
-
-50
VGS = 0 V
VDS = -60 V, TJ = 175 °C
-
-
-250
VGS = -10 V
VDS ≤ -5 V
-120
-
-
VGS = -10 V
ID = -30 A
-
0.0056
0.0067
VGS = -10 V
ID = -30 A, TJ = 125 °C
-
-
0.0110
VGS = -10 V
ID = -30 A, TJ = 175 °C
-
-
0.0130
VGS = -4.5 V
ID = -20 A
-
0.0070
0.0088
-
90
-
-
11 423
14 280
VDS = -15 V, ID = -30 A
V
nA
μA
A
Ω
S
Dynamic b
Input Capacitance
Ciss
Output Capacitance
Coss
-
1034
1295
Reverse Transfer Capacitance
Crss
-
809
1015
Total Gate Charge c
Qg
-
180
270
Gate-Source Charge c
Qgs
-
31
-
Gate-Drain
Charge c
Gate Resistance
Turn-On Delay Time c
Rise Time c
Turn-Off Delay
Fall Time c
VGS = -10 V
VDS = -25 V, f = 1 MHz
VDS = -30 V, ID = -110 A
Qgd
Rg
f = 1 MHz
td(on)
tr
Time c
VGS = 0 V
td(off)
VDD = -30 V, RL = 0.27 Ω
ID ≅ -110 A, VGEN = -10 V, Rg = 1 Ω
tf
pF
nC
-
43
-
1.1
2.27
3.5
-
15
23
-
23
35
-
97
146
-
32
48
-
-
-480
A
-
-0.95
-1.5
V
Ω
ns
Source-Drain Diode Ratings and Characteristics b
Pulsed Current a
ISM
Forward Voltage
VSD
IF = -100 A, VGS = 0
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S14-0585-Rev. A, 17-Mar-14
Document Number: 62665
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQP90P06-07L
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
150
200
V GS = 10 V thru 5 V
120
ID - Drain Current (A)
ID - Drain Current (A)
160
V GS = 4 V
120
80
90
60
T C = 25 °C
30
40
T C = 125 °C
V GS = 3 V
T C = - 55 °C
0
0
0
3
6
9
12
VDS - Drain-to-Source Voltage (V)
0
15
1
2
3
4
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
200
0.020
160
0.016
RDS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
Output Characteristics
T C = - 55 °C
120
T C = 25 °C
80
T C = 125 °C
40
0.012
V GS = 4.5 V
0.008
V GS = 10 V
0.004
0
0
0
16
32
48
ID - Drain Current (A)
64
80
0
20
Transconductance
40
60
80
ID - Drain Current (A)
100
120
On-Resistance vs. Drain Current
10
15 000
ID = 110 A
VGS - Gate-to-Source Voltage (V)
Ciss
12 500
C - Capacitance (pF)
5
10 000
7500
5000
2500
Coss
8
V DS = 30 V
6
4
2
Crss
0
0
0
10
20
30
40
50
VDS - Drain-to-Source Voltage (V)
Capacitance
S14-0585-Rev. A, 17-Mar-14
60
0
20
40
60
80
100 120 140 160 180 200
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 62665
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQP90P06-07L
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
100
ID = 30 A
10
1.7
V GS = 10 V
IS - Source Current (A)
RDS(on) - On-Resistance (Normalized)
2.0
1.4
1.1
0.8
T J = 150 °C
1
T J = 25 °C
0.1
0.01
0.5
- 50
0.001
- 25
0
25
50
75
100
125
150
0
175
0.2
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
1.2
Source Drain Diode Forward Voltage
0.05
1.2
0.9
0.04
ID = 250 μA
VGS(th) Variance (V)
RDS(on) - On-Resistance (Ω)
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
0.03
0.02
0.6
ID = 5 mA
0.3
0
T J = 150 °C
0.01
- 0.3
T J = 25 °C
0
0
2
4
6
8
VGS - Gate-to-Source Voltage (V)
10
- 0.6
- 50
- 25
0
On-Resistance vs. Gate-to-Source Voltage
25
50
75 100
TJ - Temperature (°C)
125
150
175
Threshold Voltage
- 60
VDS - Drain-to-Source Voltage (V)
ID = 10 mA
- 64
- 68
- 72
- 76
- 80
- 50
- 25
0
25
50
75 100 125
TJ - Junction Temperature (°C)
150
175
Drain Source Breakdown vs. Junction Temperature
S14-0585-Rev. A, 17-Mar-14
Document Number: 62665
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQP90P06-07L
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
1000
100 μs
IDM Limited
ID - Drain Current (A)
100
1 ms
ID Limited
10
10 ms
100 ms, 1 s, 10 s, DC
Limited by RDS(on)*
1
BVDSS Limited
TC = 25 °C
Single Pulse
0.1
0.01
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
Normalized Effective Transient
Thermal Impedance
1
0.1
0.01
0.001
0.0001
10-4
10-3
10-2
10-1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
S14-0585-Rev. A, 17-Mar-14
Document Number: 62665
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQP90P06-07L
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Case (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?62665.
S14-0585-Rev. A, 17-Mar-14
Document Number: 62665
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Ordering Information
www.vishay.com
Vishay Siliconix
TO-220
Ordering codes for the SQ rugged series power MOSFETs in the TO-220 package:
DATASHEET PART NUMBER
OLD ORDERING CODE a
NEW ORDERING CODE
SQP100N04-3m6
-
SQP100N04-3M6_GE3
SQP100P06-9m3L
-
SQP100P06-9M3L_GE3
SQP120N06-06
-
SQP120N06-06_GE3
SQP120N06-3m5L
SQP120N06-3M5L-GE3
SQP120N06-3M5L_GE3
SQP120N10-09
SQP120N10-09-GE3
SQP120N10-09_GE3
SQP120N10-3m8
SQP120N10-3M8-GE3
SQP120N10-3M8_GE3
SQP25N15-52
-
SQP25N15-52_GE3
SQP50N06-09L
SQP50N06-09L-GE3
SQP50N06-09L_GE3
SQP50P03-07
SQP50P03-07-GE3
SQP50P03-07_GE3
SQP60N06-15
SQP60N06-15-GE3
SQP60N06-15_GE3
SQP90P06-07L
SQP90P06-07L-GE3
SQP90P06-07L_GE3
Note
a. Old ordering code is obsolete and no longer valid for new orders
Revision: 12-Nov-15
Document Number: 67167
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
TO-220AB
MILLIMETERS
A
E
F
D
H(1)
Q
ØP
3
2
L(1)
1
M*
L
b(1)
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
4.25
4.65
0.167
0.183
b
0.69
1.01
0.027
0.040
b(1)
1.20
1.73
0.047
0.068
c
0.36
0.61
0.014
0.024
D
14.85
15.49
0.585
0.610
D2
12.19
12.70
0.480
0.500
E
10.04
10.51
0.395
0.414
e
2.41
2.67
0.095
0.105
e(1)
4.88
5.28
0.192
0.208
F
1.14
1.40
0.045
0.055
H(1)
6.09
6.48
0.240
0.255
0.115
J(1)
2.41
2.92
0.095
L
13.35
14.02
0.526
0.552
L(1)
3.32
3.82
0.131
0.150
ØP
3.54
3.94
0.139
0.155
Q
2.60
3.00
0.102
0.118
ECN: T14-0413-Rev. P, 16-Jun-14
DWG: 5471
Note
* M = 1.32 mm to 1.62 mm (dimension including protrusion)
Heatsink hole for HVM
C
b
e
J(1)
e(1)
D2
Document Number: 71195
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revison: 16-Jun-14
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
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all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000