TVS Diodes Transient Voltage Suppressor Diodes ESD204-B1-02 Series Bi-directional Low Capacitance TVS Diode ESD204-B1-02ELS ESD204-B1-02EL Data Sheet Revision 1.2, 2013-05-17 Final Power Management & Multimarket Edition 2013-05-17 Published by Infineon Technologies AG 81726 Munich, Germany © 2013 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. ESD204-B1-02 Series Revision History: Rev. 1.1, 2013-02-06 Page or Item Subjects (major changes since previous revision) Revision 1.2, 2013-05-17 New type ESD204-B1-02EL inserted Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-06-09 Final Data Sheet 3 Revision 1.2, 2013-05-17 ESD204-B1-02 Series Bi-directional Low Capacitance TVS Diode 1 Bi-directional Low Capacitance TVS Diode 1.1 Features • • • • ESD / Transient protection of data lines in 3.3 / 5 / 12 V applications according to : – IEC61000-4-2 (ESD) : ±20 kV (air) and ±18 kV (contact) – IEC61000-4-4 (EFT) : ±40 A (5/50ns) Maximum working voltage: VRWM = -8 / +14 V Very low reverse current: IR < 1 nA (typical) Low capacitance CL = 4 pF I/O to GND (typical) 1.2 • • • Application Examples Keypad, touchpad, buttons, convenience keys LCD displays, Camera, audio lines, mobile communication, Consumer products (E-Book, MP3, DVD, DSC, ...) Notebooks tablets and desktop computers and their peripherals 1.3 Product Description Pin 1 marking (lasered) Pin 1 Pin 1 Pin 2 Pin 2 a) Pin configuration b) Schematic diagram P G-TS LP-2_Dual_Diode_S erie_P inConf_and_S chematicDiag. vsd Figure 1 a) Pin Configuration and b) Schematic Diagram Table 1 Ordering information Type Package Configuration Marking code ESD204-B1-02ELS TSSLP-2-3 1 line, bi-directional D ESD204-B1-02EL1) TSLP-2-19 1 line, bi-directional RR 1) Product not avialalble yet, target data Final Data Sheet 4 Revision 1.2, 2013-05-17 ESD204-B1-02 Series Characteristics 2 Characteristics Table 2 Maximum Rating at TA = 25 °C, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. VESD -20 – 20 kV VESD -18 – 18 kV IPP -1 – 1 A Operating temperature TOP -55 – 150 °C Storage temperage 1) VESD according to IEC61000-4-2 2) IPP according to IEC61000-4-5 Tstg -65 – 150 °C ESD air discharge 1) ESD contact discharge 1) Peak pulse current (tp = 8/20 µs) 2) Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 2.1 Electrical Characteristics at TA = 25 °C, unless otherwise specified Figure 2 ! ! ! Definitions of electrical characteristics Final Data Sheet 5 Revision 1.2, 2013-05-17 ESD204-B1-02 Series Characteristics Table 3 DC characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Reverse working voltage VRWM Breakdown voltage VBR Values Unit Note / Test Condition Min. Typ. Max. -8 – 14 V from Pin2 to Pin1 8.5 11 14 V IR = 1 mA, from Pin1 to Pin2 Breakdown voltage VBR 14.5 17 20 V IR = 1 mA, from Pin2 to Pin1 IR Reverse current Table 4 – <1 50 nA VR = 3.3 V Unit Note / Test Condition RF characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Values Min. Typ. Max. Line capacitance CL – 4 7 pF VR = 0 V, f = 1 MHz, I/O to GND Serie inductance LS – – 0.2 0.4 – – nH ESD204-B1-02ELS ESD204-B1-02EL Unit Note / Test Condition V IPP = 1 A Table 5 ESD characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol 1) Clamping voltage VCL Values Min. Typ. Max. – 17 22 from Pin1 to Pin2 VCL – 23 28 V IPP = 1 A from Pin2 to Pin1 1) According to IEC61000-4-5 (tp : 8 / 20 µs) Final Data Sheet 6 Revision 1.2, 2013-05-17 ESD204-B1-02 Series Characteristics 2.2 Typical Performance characteristics at TA = 25 °C, unless otherwise specified 3 10 D=0 D=0.005 D=0.01 2 10 Ppk [W] D=0.02 D=0.05 D=0.1 1 10 D=0.2 D=0.5 100 10-8 10-7 10-6 10-5 10-4 10-3 10-2 10-1 tp [s] Figure 3 100 Non-repetitive peak pulse power: Ppk = f (tp) 110 100 90 Ppk or IPP [%] 80 70 60 50 40 30 20 10 0 0 Figure 4 25 50 75 TA [°C] 100 125 150 Power derating curve: Ppk = f (TA) Final Data Sheet 7 Revision 1.2, 2013-05-17 ESD204-B1-02 Series Characteristics 10-8 TA=85°C -9 IR [A] 10 TA=25°C -10 10 10-11 0 Figure 5 2 4 6 8 VR [V] 10 12 14 Reverse characteristic, IR = (VR), TA = parameter 7 6 CL [pF] 5 4 3 2 1 0 0 Figure 6 2 4 6 8 VR [V] 10 12 14 Line capacitance CL = f(VR) Final Data Sheet 8 Revision 1.2, 2013-05-17 ESD204-B1-02 Series Application Information Application Information Connector 3 Protected data line with signal levels -8V up to +14V (bi-directional ) I/ O 2 1 Figure 7 ESD sensitive device The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible . Pin 1 should be connected directly to a ground plane on the board . 1 Line, bi-directional protection with ESD diode Final Data Sheet 9 Revision 1.2, 2013-05-17 ESD204-B1-02 Series Package Information 4 Package Information 4.1 TSSLP-2-3 Top view Bottom view 0.31 +0.01 -0.02 0.32 ±0.05 0.355 0.62 ±0.05 2 Cathode marking 0.05 MAX. 0.26 ±0.035 0.2 ±0.035 1) 1 1) 1) Dimension applies to plated terminals TSSLP-2-3, -4-PO V01 TSSLP-2-3: Package Overview 0.19 0.24 Solder mask 0.19 0.57 0.62 Copper 0.19 0.27 0.14 0.32 0.24 Figure 8 Stencil apertures TSSLP-2-3, -4-FP V02 Figure 9 TSSLP-2-3 Footprint 0.35 4 8 Ey Tape type Ex Ey Punched Tape 0.43 0.73 Embossed Tape 0.37 0.67 Deliveries can be both tape types (no selection possible). Specification allows identical processing (pick & place) by users. Cathode marking Figure 10 Ex TSSLP-2-3, -4-TP V03 TSSLP-2-3: Packing 1 Type code Cathode marking TSSLP-2-3, -4-MK V01 Figure 11 TSSLP-2-3: Marking (example) Final Data Sheet 10 Revision 1.2, 2013-05-17 ESD204-B1-02 Series Package Information 4.2 TSLP-2-19 Top view Bottom view 0.31 +0.01 -0.02 0.6 ±0.05 0.05 MAX. 1±0.05 0.65 ±0.05 2 0.25 ±0.035 1) 1 0.5 ±0.035 1) Cathode marking 1) Dimension applies to plated terminals TSLP-2-19, -20-PO V01 TSLP-2-19: Package Overview 0.35 0.28 0.38 0.93 1 Copper 0.28 0.45 0.3 0.6 0.35 Figure 12 Solder mask Stencil apertures TSLP-2-19, -20-FP V01 Figure 13 TSLP-2-19: Footprint 0.4 1.16 Cathode marking 8 4 0.76 TSLP-2-19, -20-TP V02 Figure 14 TSLP-2-19: Packing Type code 12 Cathode marking TSLP-2-19, -20-MK V01 Figure 15 TSLP-2-19: Marking (example) Final Data Sheet 11 Revision 1.2, 2013-05-17 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG