Si5997DU Datasheet

Si5997DU
Vishay Siliconix
Dual P-Channel 30 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 30
RDS(on) ()
ID (A)
0.054 at VGS = - 10 V
- 6a
0.088 at VGS = - 4.5 V
- 6a
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• New Thermally Enhanced PowerPAK®
ChipFET® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
• 100 % Rg Tested
• Compliant to RoHS Directive 2002/95/EC
Qg (Typ.)
4.8 nC
PowerPAK ChipFET Dual
1
2
S1
D1
8
APPLICATIONS
4
S2
D1
7
S2
G2
D2
6
• Load Switch for Portable Devices
• DC/DC Converters
S1
3
G1
Marking Code
D2
DF
5
G1
XXX
G2
Lot Traceability
and Date Code
Part #
Code
Bottom View
D1
Ordering Information: Si5997DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
D2
P-Channel MOSFET P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Source-Drain Diode Current
Maximum Power Dissipation
ID
TJ, Tstg
Operating Junction and Storage Temperature Range
d, e
V
- 6a
- 1.9b, c
10.4
6.7
IS
PD
Unit
- 6a
- 6a
- 5.1b, c
- 4.1b, c
- 25
IDM
Pulsed Drain Current (t = 300 µs)
Soldering Recommendations (Peak Temperature)
Limit
- 30
± 20
2.3b, c
1.5b, c
- 55 to 150
260
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
t5s
Steady State
Symbol
RthJA
RthJC
Typical
43
9.5
Maximum
55
12
Unit
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 67186
S10-2762-Rev. A, 29-Nov-10
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1
Si5997DU
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = - 250 µA
- 30
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS/TJ
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
VGS(th)/TJ
Gate-Source Threshold Voltage
ID = - 250 µA
VGS(th)
VDS = VGS, ID = - 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
RDS(on)
gfs
V
- 22
mV/°C
4.1
- 1.2
- 2.4
V
± 100
nA
VDS = - 30 V, VGS = 0 V
-1
VDS = - 30 V, VGS = 0 V, TJ = 55 °C
- 10
VDS - 5 V, VGS = - 10 V
- 20
µA
A
VGS = - 10 V, ID = - 3 A
0.045
0.054
VGS = - 4.5 V, ID = - 1 A
0.072
0.088
VDS = - 15 V, ID = - 3 A
7

S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
430
VDS = - 15 V, VGS = 0 V, f = 1 MHz
td(off)
pF
70
VDS = - 15 V, VGS = - 10 V, ID = - 5.1 A
VDS = - 15 V, VGS = - 4.5 V, ID = - 5.1 A
9.5
14.5
4.8
7.5
1.6
VDD = - 15 V, RL = 3.7 
ID  - 4.1 A, VGEN = - 4.5 V, Rg = 1 
2
8
16
35
70
25
50
17
35
tf
10
20
td(on)
10
20
10
20
20
40
10
20
tr
td(off)
nC
2.2
f = 1 MHz
td(on)
tr
90
VDD = - 15 V, RL = 3.7 
ID  - 4.1 A, VGEN = - 10 V, Rg = 1 
tf

ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
TC = 25 °C
-6
- 25
IS = - 4.1 A, VGS = 0 V
- 0.85
- 1.2
A
V
Body Diode Reverse Recovery Time
trr
15
30
ns
Body Diode Reverse Recovery Charge
Qrr
8
15
nC
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
IF = - 4 A, dI/dt = 100 A/µs, TJ = 25 °C
10.5
4.5
ns
Notes:
a. Pulse test; pulse width  300 µs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 67186
S10-2762-Rev. A, 29-Nov-10
Si5997DU
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
25
5
V GS = 10 V thru 6 V
V GS = 5 V
4
ID - Drain Current (A)
ID - Drain Current (A)
20
15
V GS = 4 V
10
3
2
T C = 25 °C
1
5
T C = 125 °C
V GS = 3 V
0
0.0
V GS = 2 V
0.5
1.0
1.5
2.0
2.5
T C = - 55 °C
0
0
3.0
1
VDS - Drain-to-Source Voltage (V)
2
3
4
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
800
0.14
V GS = 4.5 V
600
0.10
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
0.12
0.08
0.06
V GS = 10 V
0.04
Ciss
400
Coss
200
0.02
Crss
0
0.00
0
5
10
15
20
0
25
10
15
20
25
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
10
30
1.6
ID = 5.1 A
ID = 3 A
8
V GS = 10 V
V DS = 15 V
6
V DS = 7.5 V
V DS = 24 V
4
2
(Normalized)
1.4
RDS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
5
ID - Drain Current (A)
V GS = 4.5 V
1.2
1.0
0.8
0
0
2
4
6
8
10
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 67186
S10-2762-Rev. A, 29-Nov-10
150
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Si5997DU
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
100
0.18
ID = 3 A
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
0.15
10
T J = 150 °C
T J = 25 °C
1
0.12
0.09
T J = 125 °C
0.06
T J = 25 °C
0.03
0.1
0.0
0.00
0.2
0.4
0.6
0.8
1.0
0
1.2
2
VSD - Source-to-Drain Voltage (V)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
30
2.2
25
2.0
Power (W)
VGS(th) (V)
20
1.8
ID = 250 μA
1.6
15
10
1.4
5
1.2
- 50
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
1
10
100
1000
Time (s)
Single Pulse Power, Junction-to-Ambient
TJ - Temperature (°C)
Threshold Voltage
100
Limited by R DS(on)*
ID - Drain Current (A)
10
100 μs
1
1 ms
10 ms
0.1
TA = 25 °C
Single Pulse
0.01
0.1
BVDSS Limited
1
100 ms
1s
10 s
DC
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 67186
S10-2762-Rev. A, 29-Nov-10
Si5997DU
Vishay Siliconix
12
12
10
10
Power Dissipation (W)
ID - Drain Current (A)
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
8
Package Limited
6
4
2
8
6
4
2
0
0
0
25
50
75
100
TC - Case Temperature (°C)
Current Derating*
125
150
25
50
75
100
125
150
TC - Case Temperature (°C)
Power Derating
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 67186
S10-2762-Rev. A, 29-Nov-10
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Si5997DU
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Duty Cycle = 0.5
Thermal Impedance
Normalized Effective Transient
1
0.2
0.1
Notes:
0.1
PDM
t1
t2
t
1. Duty Cycle, D = t1
2
2. Per Unit Base = R thJA = 105 °C/W
0.05
0.02
3. TJM - TA = PDM Z thJA(t)
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.05
0.1
Single Pulse
0.01
10-4
0.02
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?67186.
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Document Number: 67186
S10-2762-Rev. A, 29-Nov-10
Package Information
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Vishay Siliconix
PowerPAK® ChipFET® Case Outline
D
(7)
(6)
(5)
(1)
(2)
(3)
(4)
E
(8)
Pin #1
indicator
Side view of single
e
b
H
D1
D(2)
D2
K
D(3)
L
G(4)
K1
D2
SI(1)
GI(2)
S2(3)
D1(8)
D1(7)
D2(6)
Detail Z
G2(4)
K2
L
D(1)
A1
C
A
Z
Side view of dual
E1
E2
E3
H
D3
D(8)
D(7)
D(6)
S(5)
K3
Backside view of dual pad
Backside view of single pad
DIM.
D2(5)
MILLIMETERS
INCHES
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.70
0.75
0.85
0.028
0.030
0.033
A1
0
-
0.05
0
-
0.002
b
0.25
0.30
0.35
0.010
0.012
0.014
C
0.15
0.20
0.25
0.006
0.008
0.010
D
2.92
3.00
3.08
0.115
0.118
0.121
D1
1.75
1.87
2.00
0.069
0.074
0.079
D2
1.07
1.20
1.32
0.042
0.047
0.052
D3
0.20
0.25
0.30
0.008
0.010
0.012
E
1.82
1.90
1.98
0.072
0.075
0.078
E1
1.38
1.50
1.63
0.054
0.059
0.064
E2
0.92
1.05
1.17
0.036
0.041
0.046
E3
0.45
0.50
0.55
0.018
0.020
0.022
e
0.65 BSC
0.026 BSC
H
0.15
0.20
0.25
0.006
0.008
0.010
K
0.25
-
-
0.010
-
-
K1
0.30
-
-
0.012
-
-
K2
0.20
-
-
0.008
-
-
K3
0.20
-
-
0.008
-
-
L
0.30
0.35
0.40
0.012
0.014
0.016
C14-0630-Rev. E, 21-Jul-14
DWG: 5940
Note
• Millimeters will govern
Document Number: 73203
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 21-Jul-14
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR PowerPAK® ChipFET® Dual
2.700
(0.106)
0.300
(0.012)
0.350
(0.014)
0.650
(0.026)
1.900
(0.075)
0.300
(0.012)
1.050
(0.041)
0.350
(0.014)
0.200
(0.008)
0.300
(0.012)
0.225
(0.009)
0.650
(0.026)
1.175
(0.046)
1.525
(0.060)
Recommended Minimum Pads
Dimensions in mm/(Inches)
APPLICATION NOTE
Note: This is Flipped Mirror Image
Pin #1 Location is Top Left Corner
Return to Index
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Document Number: 69949
Revision: 21-Jan-08
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Revision: 02-Oct-12
1
Document Number: 91000