SUM85N15-19 Datasheet

SUM85N15-19
Vishay Siliconix
N-Channel 150-V (D-S) 175_C MOSFET
FEATURES
D
D
D
D
PRODUCT SUMMARY
V(BR)DSS (V)
rDS(on) (W)
ID (A)
150
0.019 @ VGS = 10 V
85 a
TrenchFETr Power MOSFET
175_C Junction Temperature
New Low Thermal Resistance Package
100% Rg Tested
APPLICATIONS
D Primary Side Switch
D Automotive
− 42-V EPS and ABS
− DC/DC Conversion
− Motor Drives
D
TO-263
G
G
D S
Top View
S
Ordering Information: SUM85N15-19
SUM85N15-19-E3 (Lead Free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
150
Gate-Source Voltage
VGS
"20
TC = 25_C
Continuous Drain Current (TJ = 175_C)
TC = 125_C
Pulsed Drain Current
ID
IDM
Avalanche Current
Repetitive Avalanche Energyb
L = 0.1 mH
TC = 25_C
Maximum Power Dissipationb
TA = 25_Cd
Operating Junction and Storage Temperature Range
V
85a
50a
180
IAR
50
EAR
125
PD
Unit
375c
3.75
A
mJ
W
TJ, Tstg
−55 to 175
_C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient
Junction-to-Case (Drain)
PCB Mount
(TO-263)d
RthJA
40
RthJC
0.4
_C/W
Notes
a. Package limited.
b. Duty cycle v 1%.
c. See SOA curve for voltage derating.
d. When mounted on 1” square PCB (FR-4 material).
Document Number: 71703
S-32523—Rev. B, 08-Dec-03
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SUM85N15-19
Vishay Siliconix
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VDS = 0 V, ID = 250 mA
150
VGS(th)
VDS = VGS, ID = 250 mA
2
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 150 V, VGS = 0 V
1
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage
g Drain Current
On-State Drain Currenta
IDSS
VDS = 150 V, VGS = 0 V, TJ = 125_C
50
VDS = 150 V, VGS = 0 V, TJ = 175_C
250
ID(on)
VDS w 5 V, VGS = 10 V
rDS(on)
VGS = 10 V, ID = 30 A, TJ = 125_C
120
VGS = 10 V, ID = 30 A
Drain-Source On-State Resistancea
4
gfs
VDS = 15 V, ID = 30 A
nA
mA
m
A
0.015
0.019
0.038
VGS = 10 V, ID = 30 A, TJ = 175_C
Forward Transconductancea
V
W
0.050
25
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
Gate-Drain
Chargec
Gate Resistance
Turn-On Delay Timec
Rise Timec
Turn-Off Delay Timec
Fall Timec
4750
530
VGS = 0 V, VDS = 25 V, f = 1 MHz
pF
220
76
110
21
VDS = 75 V,, VGS = 10 V,, ID = 85 A
Qgd
nC
26
Rg
0.5
1.8
3.0
td(on)
22
35
tr
170
250
40
60
170
250
td(off)
VDD = 75 V, RL = 0.9 W
ID ^ 85 A, VGEN = 10 V, Rg = 2.5 W
tf
W
ns
Source-Drain Diode Ratings and Characteristics (TC = 25_C)b
Continuous Current
IS
85
Pulsed Current
ISM
180
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 85 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 50 A, di/dt = 100 A/ms
A
1.0
1.5
V
130
200
ns
8
12
A
0.52
1.2
mC
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
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Document Number: 71703
S-32523—Rev. B, 08-Dec-03
SUM85N15-19
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
180
180
VGS = 10 thru 7 V
150
6V
I D − Drain Current (A)
I D − Drain Current (A)
150
120
90
60
5V
30
120
90
60
TC = 125_C
30
25_C
−55_C
4V
0
0
0
2
4
6
8
10
0
VDS − Drain-to-Source Voltage (V)
1
2
3
4
5
6
7
VGS − Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
180
0.04
TC = −55_C
r DS(on) − On-Resistance ( W )
g fs − Transconductance (S)
150
25_C
120
125_C
90
60
30
0
0.03
0.02
VGS = 10 V
0.01
0.00
0
20
40
60
80
100
0
120
20
40
ID − Drain Current (A)
V GS − Gate-to-Source Voltage (V)
C − Capacitance (pF)
Ciss
4000
3000
2000
Crss
1000
100
120
125
150
Gate Charge
20
6000
5000
80
ID − Drain Current (A)
Capacitance
7000
60
Coss
0
VDS = 75 V
ID = 85 A
16
12
8
4
0
0
25
50
75
100
125
VDS − Drain-to-Source Voltage (V)
Document Number: 71703
S-32523—Rev. B, 08-Dec-03
150
0
25
50
75
100
Qg − Total Gate Charge (nC)
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SUM85N15-19
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
2.8
100
Source-Drain Diode Forward Voltage
VGS = 10 V
ID = 30 A
2.0
I S − Source Current (A)
r DS(on) − On-Resistance (W)
(Normalized)
2.4
On-Resistance vs. Junction Temperature
1.6
1.2
0.8
TJ = 150_C
10
TJ = 25_C
0.4
0.0
−50
−25
0
25
50
75
100
125
150
1
0
175
0.3
TJ − Junction Temperature (_C)
1000
1.2
Drain Source Breakdown vs.
Junction Temperature
190
180
V(BR)DSS (V)
100
I Dav (a)
0.9
VSD − Source-to-Drain Voltage (V)
Avalanche Current vs. Time
IAV (A) @ TA = 25_C
10
0.6
ID = 1.0 mA
170
160
1
150
IAV (A) @ TA = 150_C
0.1
0.00001
0.0001
0.001
0.01
tin (Sec)
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0.1
1
140
−50
−25
0
25
50
75
100
125
150
175
TJ − Junction Temperature (_C)
Document Number: 71703
S-32523—Rev. B, 08-Dec-03
SUM85N15-19
Vishay Siliconix
THERMAL RATINGS
Maximum Avalanche and Drain Current
vs. Case Temperature
Safe Operating Area
1000
90
Limited
by rDS(on)
75
10 ms
I D − Drain Current (A)
I D − Drain Current (A)
100
60
45
30
100 ms
10
1
15
0
10 ms
100 ms
dc
TC = 25_C
Single Pulse
0.1
0
25
50
75
100
125
150
175
0.1
1
10
100
1000
VDS − Drain-to-Source Voltage (V)
TC − Ambient Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Case
2
1
Normalized Effective Transient
Thermal Impedance
1 ms
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
10−3
10−2
10−1
1
Square Wave Pulse Duration (sec)
Document Number: 71703
S-32523—Rev. B, 08-Dec-03
www.vishay.com
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Document Number: 91000
Revision: 18-Jul-08
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