SUB85N08-08 Datasheet

SUP/SUB85N08-08
New Product
Vishay Siliconix
N-Channel 75-V (D-S) 175C MOSFET
V(BR)DSS (V)
rDS(on) ()
ID (A)
75
0.008 @ VGS = 10 V
85 a
D
TO-220AB
TO-263
G
DRAIN connected to TAB
G
D S
Top View
G D S
S
SUB85N08-08
Top View
SUP85N08-08
N-Channel MOSFET
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
75
Gate-Source Voltage
VGS
20
TC = 25C
Continuous Drain Current (TJ = 175C)
175 C)
TC = 125C
Pulsed Drain Current
IDM
Avalanche Current
Repetitive Avalanche Energyb
Maximum Power Dissipationb
ID
L = 0.1 mH
TC = 25C (TO-220AB and TO-263)
TA = 25C (TO-263)d
Operating Junction and Storage Temperature Range
V
85a
67a
A
240
IAR
75
EAR
280
PD
Unit
250c
3.7
mJ
W
TJ, Tstg
–55 to 175
C
Symbol
Limit
Unit
Parameter
PCB Mount (TO-263)d
Junction-to-Ambient
Free Air (TO-220AB)
Junction-to-Case
40
RthJA
RthJC
62.5
C/W
0.6
Notes
a. Package limited.
b. Duty cycle 1%.
c. See SOA curve for voltage derating.
d. When mounted on 1” square PCB (FR-4 material).
Document Number: 71165
S-01884—Rev. B, 28-Aug-00
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SUP/SUB85N08-08
New Product
Vishay Siliconix
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VDS = 0 V, ID = 250 mA
75
VGS(th)
VDS = VGS, ID = 250 mA
2.5
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 60 V, VGS = 0 V
1
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero
Gate
Voltage
Drain
Z
G
V l
D i Current
C
On-State Drain Currenta
IDSS
ID(on)
V
VDS = 60 V, VGS = 0 V, TJ = 125C
50
VDS = 60 V, VGS = 0 V, TJ = 175C
250
VDS w 5 V, VGS = 10 V
120
VGS = 10 V, ID = 30 A
a
D i S
Drain-Source
On-State
O S
Resistance
R i
rDS(on)
gfs
VGS = 10 V, ID = 30 A, TJ = 125C
VDS = 15 V, ID = 30 A
mA
A
A
0.0063
0.008
0.014
VGS = 10 V, ID = 30 A, TJ = 175C
Forward Transconductancea
nA
W
0.018
30
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
5800
VGS = 0 V, VDS = 25 V, f = 1 MHz
pF
F
900
285
100
VDS = 35 V,
V VGS = 10 V
V, ID = 85 A
150
nC
C
35
Gate-Drain Chargec
Qgd
Turn-On Delay Timec
td(on)
20
30
tr
115
175
50
75
80
120
Rise Timec
Turn-Off Delay Timec
Fall Timec
td(off)
25
VDD = 35 V
V,, RL = 0
0.4
4W
ID ^ 85 A,
A VGEN = 10 V
V, RG = 2
2.5
5W
tf
ns
Source-Drain Diode Ratings and Characteristics (TC = 25C)b
Continuous Current
IS
85
Pulsed Current
ISM
240
Forward Voltagea
VSD
A
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 85 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 85 A
A, di/d
di/dt = 100 A/
A/ms
1.0
1.5
V
70
120
ns
4
7
A
0.14
0.30
mC
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
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Document Number: 71165
S-01884—Rev. B, 28-Aug-00
SUP/SUB85N08-08
New Product
Vishay Siliconix
Output Characteristics
Transfer Characteristics
250
250
VGS = 10 thru 7 V
6V
200
I D – Drain Current (A)
I D – Drain Current (A)
200
150
100
5V
50
150
100
TC = 125C
50
25C
–55C
4, 3 V
0
0
0
2
4
6
8
10
0
VDS – Drain-to-Source Voltage (V)
1
2
3
4
5
6
7
VGS – Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
0.010
240
TC = –55C
r DS(on) – On-Resistance ( )
g fs – Transconductance (S)
200
25C
160
125C
120
80
40
0
0.008
VGS = 10 V
0.006
0.004
0.002
0
0
20
40
60
80
0
100
20
40
ID – Drain Current (A)
80
100
120
ID – Drain Current (A)
Capacitance
Gate Charge
20
8000
V GS – Gate-to-Source Voltage (V)
7000
Ciss
6000
C – Capacitance (pF)
60
5000
4000
3000
2000
Crss
Coss
1000
0
VDS = 35 V
ID = 85 A
16
12
8
4
0
0
15
30
45
60
VDS – Drain-to-Source Voltage (V)
Document Number: 71165
S-01884—Rev. B, 28-Aug-00
75
0
50
100
150
200
Qg – Total Gate Charge (nC)
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SUP/SUB85N08-08
New Product
Vishay Siliconix
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
2.5
100
2.0
I S – Source Current (A)
r DS(on) – On-Resistance (W)
(Normalized)
VGS = 10 V
ID = 30 A
1.5
1.0
TJ = 150C
0.5
0
–50
1
–25
0
25
50
75
100
125
150
175
0
0.3
TJ – Junction Temperature (C)
90
V(BR)DSS (V)
IAV (A) @ TA = 25C
I Dav (a)
1.2
95
100
10
IAV (A) @ TA = 150C
ID = 250 mA
85
80
1
75
0.1
0.0001
0.001
0.01
tin (Sec)
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0.9
Drain Source Breakdown vs.
Junction Temperature
1000
0.00001
0.6
VSD – Source-to-Drain Voltage (V)
Avalanche Current vs. Time
2-4
TJ = 25C
10
0.1
1
70
–50
–25
0
25
50
75
100
125
150
175
TJ – Junction Temperature (C)
Document Number: 71165
S-01884—Rev. B, 28-Aug-00
SUP/SUB85N08-08
New Product
Vishay Siliconix
Maximum Avalanche and Drain Current
vs. Case Temperature
Safe Operating Area
1000
100
10 ms
80
I D – Drain Current (A)
I D – Drain Current (A)
100
60
40
10
0
Limited
by rDS(on)
1 ms
10 ms
100 ms
dc
1
20
100 ms
TC = 25C
Single Pulse
0.1
0
25
50
75
100
125
150
175
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
TC – Ambient Temperature (C)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
10
Square Wave Pulse Duration (sec)
Document Number: 71165
S-01884—Rev. B, 28-Aug-00
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2-5
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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or in any other disclosure relating to any product.
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therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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