VISHAY SUM110P06-07L

SUM110P06-07L
Vishay Siliconix
P-Channel 60-V (D-S) 175_C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
rDS(on) (W)
−60
ID
(A)d
0.0069 @ VGS = −10 V
−110
0.0088 @ VGS = −4.5 V
−110
D TrenchFETr Power MOSFET
D New Package with Low Thermal Resistance
APPLICATIONS
D Automotive
− 12-V Boardnet
− High-Side Switches
− Motor Drives
S
TO-263
G
G
D S
Top View
D
Ordering Information: SUM110P06-07L
SUM110P06-07L—E3 (Lead Free)
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
−60
Gate-Source Voltage
VGS
"20
TC = 25_C
Continuous Drain Currentd
(TJ = 175_C)
TC = 125_C
Pulsed Drain Current
Avalanche Current
Single Pulse Avalanche
L = 0.1
0 1 mH
Energya
TC = 25_C
Power Dissipation
TA = 25_Cb
Operating Junction and Storage Temperature Range
ID
V
−110
−95
IDM
−240
IAS
−75
EAS
281
PD
Unit
375c
3.75
A
mJ
W
TJ, Tstg
−55 to 175
_C
Symbol
Limit
Unit
Junction-to-Ambient PCB Mountb
RthJA
40
Junction-to-Case
RthJC
0.4
THERMAL RESISTANCE RATINGS
Parameter
_C/W
Notes:
a. Duty cycle v 1%.
b. When mounted on 1” square PCB (FR-4 material).
c. See SOA curve for voltage derating.
d. Limited by package.
Document Number: 72439
S-40842—Rev. B, 03-May-04
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SUM110P06-07L
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VGS = 0 V, ID = −250 mA
−60
VGS(th)
VDS = VGS, ID = −250 mA
−1
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = −60 V, VGS = 0 V
−1
VDS = −60 V, VGS = 0 V, TJ = 125_C
−50
VDS = −60 V, VGS = 0 V, TJ = 175_C
−250
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage
g Drain Current
On-State Drain Currenta
IDSS
ID(on)
VDS = −5 V, VGS = −10 V
−120
VGS = −10 V, ID = −30 A
Drain Source On-State
Drain-Source
On State Resistancea
rDS(on)
DS( )
gfs
0.0055
nA
mA
m
0.0069
0.0115
VGS = −10 V, ID = −30 A, TJ = 175_C
0.0138
VDS = −15 V, ID = −50 A
V
A
VGS = −10 V, ID = −30 A, TJ = 125_C
VGS = −4.5 V, ID = −20 A
Forward Transconductancea
−3
0.007
W
0.0088
20
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reversen Transfer Capacitance
Crss
900
Total Gate Chargec
Qg
230
Gate-Source
Chargec
Qgs
Gate-Drain Chargec
Qgd
Gate Resistance
Rg
Turn-On Delay
Timec
Rise Timec
Turn-Off Delay Timec
Fall Timec
11400
VGS = 0 V, VDS = −25 V, f = 1 MHz
VDS = −30 V,, VGS = −10 V,, ID = −110 A
1200
pF
345
50
nC
60
f = 1.0 MHz
3
td(on)
20
30
tr
VDD = −30
30 V, RL = 0.27 W
160
240
td(off)
ID ] −110 A, VGEN = −10 V, Rg = 2.5 W
200
300
240
360
tf
W
ns
Source-Drain Diode Ratings and Characteristics (TC = 25_C)b
Continuous Current
Is
−110
Pulsed Current
ISM
−240
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = −85 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = −85 A,, di/dt = 100 A/ms
m
A
−1.0
−1.5
V
65
100
ns
−4.2
−6.3
A
0.14
0.32
mC
Notes:
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
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Document Number: 72439
S-40842—Rev. B, 03-May-04
SUM110P06-07L
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
200
200
VGS = 10 thru 5 V
160
4V
I D − Drain Current (A)
I D − Drain Current (A)
160
120
80
40
120
80
TC = 125_C
40
25_C
3V
−55_C
0
0
0
2
4
6
8
10
0
1
VDS − Drain-to-Source Voltage (V)
Transconductance
4
5
On-Resistance vs. Drain Current
0.016
TC = −55_C
200
0.014
r DS(on) − On-Resistance ( W )
25_C
150
125_C
100
50
0
0.012
0.010
0.008
VGS = 4.5 V
0.006
VGS = 10 V
0.004
0.002
0.000
0
15
30
45
60
75
0
90
20
40
ID − Drain Current (A)
12000
V GS − Gate-to-Source Voltage (V)
10000
8000
6000
Coss
Crss
2000
80
100
120
Gate Charge
20
Ciss
4000
60
ID − Drain Current (A)
Capacitance
14000
C − Capacitance (pF)
3
VGS − Gate-to-Source Voltage (V)
250
g fs − Transconductance (S)
2
0
VDS = 30 V
ID = 110 A
16
12
8
4
0
0
10
20
30
40
50
VDS − Drain-to-Source Voltage (V)
Document Number: 72439
S-40842—Rev. B, 03-May-04
60
0
50
100
150
200
250
300
350
400
450
Qg − Total Gate Charge (nC)
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SUM110P06-07L
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
rDS(on) − On-Resiistance
(Normalized)
1.7
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
100
VGS = 10 V
ID = 30 A
I S − Source Current (A)
2.0
1.4
1.1
0.8
0.5
−50
−25
0
25
50
75
100
125
150
TJ = 150_C
1
175
0.0
0.3
TJ − Junction Temperature (_C)
1000
TJ = 25_C
10
0.6
0.9
1.2
VSD − Source-to-Drain Voltage (V)
Drain Source Breakdown vs.
Junction Temperature
Avalanche Current vs. Time
75
72
ID = 250 mA
V (BR)DSS (V)
I Dav (a)
100
IAV (A) @ TA = 25_C
10
69
66
1
IAV (A) @ TA = 150_C
63
0.1
0.00001
0.0001
0.001
0.01
tin (Sec)
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0.1
1
60
−50
−25
0
25
50
75
100
125
150
175
TJ − Junction Temperature (_C)
Document Number: 72439
S-40842—Rev. B, 03-May-04
SUM110P06-07L
Vishay Siliconix
THERMAL RATINGS
Maximum Avalanche and Drain Current
vs. Case Temperature
Safe Operating Area
1000
200
Limited by rDS(on)
10 ms
Limited
by Package
100
50
0
1 ms
10
1
10 ms
100 ms, dc
TC = 25_C
Single Pulse
0.1
0
25
50
75
100
125
150
175
0.1
10
100
Normalized Thermal Transient Impedance, Junction-to-Case
2
1
1
VDS − Drain-to-Source Voltage (V)
TC − Case Temperature (_C)
Normalized Effective Transient
Thermal Impedance
100 ms
100
I D − Drain Current (A)
I D − Drain Current (A)
150
Duty Cycle = 0.5
0.2
Notes:
PDM
0.1
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
Single Pulse
t1
t2
2. Per Unit Base = RthJA = 62.5_C/W
3. TJM − TA = PDMZthJA(t)
4. Surface Mounted
0.01
10−4
10−3
10−2
10−1
1
Square Wave Pulse Duration (sec)
Document Number: 72439
S-40842—Rev. B, 03-May-04
www.vishay.com
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