REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET 15 16 17 18 19 REV STATUS REV OF SHEETS SHEET PMIC N/A PREPARED BY RICK OFFICER STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A 1 2 3 4 5 DRAWING APPROVAL DATE 08-04-22 REVISION LEVEL 8 9 10 11 12 13 MICROCIRCUIT, DIGITAL-LINEAR, 14-BIT, 105 MSPS, ANALOG-TO-DIGITAL CONVERTER, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 7 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY RAJESH PITHADIA APPROVED BY ROBERT M. HEBER 6 1 OF 5962-07206 19 5962-E013-08 14 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 07206 Federal stock class designator \ RHA designator (see 1.2.1) 01 V X C Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 Generic number Circuit function ADS5424M 14 bit, 105 MSPS, analog to digital converter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Descriptive designator Terminals See figure 1 52 Package style Quad flat pack with non-conductive tie bar 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 2 1.3 Absolute maximum ratings. 1/ Supply voltage : AVDD to GND ........................................................................................................ 6 V DRVDD to GND ..................................................................................................... 5 V Analog input to GND .................................................................................................. -0.3 V to AVDD + 0.3 V Clock input to GND .................................................................................................... -0.3 V to AVDD + 0.3 V CLK to CLK .............................................................................................................. ±2.5 V Digital data output to GND ......................................................................................... -0.3 V to DRVDD + 0.3 V Maximum junction temperature (TJ) .......................................................................... +150°C Storage temperature range (TSTG) ........................................................................... -65°C to 150°C Thermal resistance, junction-to-ambient (θJA) ........................................................... 21.81°C/W 2/ Thermal resistance, junction-to-case (θJC) ................................................................ 0.849°C/W 3/ 1.4 Recommended operating conditions. Supplies: Analog supply voltage (AVDD) ............................................................................... 4.75 V to 5.25 V Output driver supply voltage (DRVDD) ................................................................... 3 V to 3.6 V Analog input: Differential input range ........................................................................................... 2.2 VPP Input common mode voltage (VCM) ....................................................................... 2.4 V Digital output: Maximum output load ............................................................................................ 10 pF Clock input: ADCLK input sample rate (sine wave) (1/tC) ......................................................... 30 MSPS to 105 MSPS Clock amplitude, sine wave, differential ................................................................. 3 VPP Clock duty cycle ..................................................................................................... 50 % Operating case temperature range (TC) .................................................................... -55°C to +125°C Estimated device life at elevated temperatures electromigration fail mode: ________ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Heat slug connected to printed circuit board (PCB) thermal plane. Airflow is at 0 LFM (no airflow). 3/ Specified with the thermal bond pad on the backside of the package soldered to a 2 ounce CU plate PCB thermal plane. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.2.3 Block diagram. The block diagram shall be as shown in figure 3. 3.2.4 Timing waveforms. The timing waveforms shall be as shown in figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Unit Limits Min Max Internal reference voltages section Reference voltage VREF 1,2,3 01 2.38 2.41 V Dynamic accuracy section Differential linearity error DNL fIN = 10 MHz 4,5,6 01 -0.98 1.5 LSB Integral linearity error INL fIN = 10 MHz 4,5 01 -5.0 +5.0 LSB -6.9 +6.9 6 Offset error 4,5,6 01 -1.5 1.5 %FS Gain error 4,5,6 01 -5 5 %FS 1,2,3 01 410 mA 1,2,3 01 55 mA 1,2,3 01 2.3 W Power supply section Analog supply current IAVDD FS = 105 MSPS, VIN = full scale, fIN = 70 MHz Output buffer supply current IDRVDD FS = 105 MSPS, VIN = full scale, fIN = 70 MHz Power dissipation PD FS = 105 MSPS, fIN = 70 MHz, total power with 10 pF load on each digital output to ground See footnote at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Unit Limits Min Max Dynamic AC characteristics section Signal-to-noise ratio Spurious free dynamic range SNR SFDR 4,6 fIN = 10 MHz 71.0 fIN = 30 MHz 4,5,6 70.0 fIN = 70 MHz 4 68.2 5 67.0 6 68.0 4 fIN = 10 MHz fIN = 70 MHz SINAD 70.5 5 fIN = 30 MHz Signal-to-noise plus distortion 01 fIN = 30 MHz fIN = 70 MHz 72.0 5,6 71.0 4 77.0 5 69.0 6 75.0 4 68.0 5 69.0 6 67.0 4 fIN = 10 MHz 01 01 dBc dBc 68.6 5 68.3 6 68.2 4,6 69.4 5 67.0 4 65.8 5 64.6 6 65.0 dBc See footnote at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Unit Limits Min Max Dynamic AC characteristics section - continued. Second harmonic HD2 4 fIN = 10 MHz fIN = 30 MHz fIN = 70 MHz Third harmonic HD3 fIN = 70 MHz 72.0 5,6 71.0 4 77.0 5 69.0 6 75.0 4 68.0 5 69.0 6 67.0 4 fIN = 10 MHz fIN = 30 MHz Worst other harmonic / spur (other than HD2 and HD3) 01 01 72.0 5,6 71.0 4 77.0 5 69.0 6 75.0 4 68.0 5 69.0 6 67.0 fIN = 10 MHz 4,5,6 fIN = 30 MHz 4,6 80.0 5 74.0 4,6 74.0 5 72.0 fIN = 70 MHz 01 dBc dBc 75.0 dBc See footnote at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 7 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Unit Limits Min Max Dynamic AC characteristics section - continued. Total harmonic distortion THD 4 fIN = 10 MHz 70.0 4 75.0 5 68.0 6 73.8 4 67.4 5 67.2 6 66.4 fIN = 70 MHz ENOB 4 fIN = 10 MHz fIN = 30 MHz 71.0 5,6 fIN = 30 MHz Effective number of bits 01 01 11.1 5,6 11.0 4,6 11.2 5 10.8 4 10.6 5 10.4 6 10.5 fIN = 70 MHz dBc Bits See footnote at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 8 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Digital characteristics Unit Max 2/ Digital outputs section Low level output voltage High level output voltage Output data voltage midpoint VOL CLOAD = 10 pF 3/ 1,2,3 01 VOH CLOAD = 10 pF 3/ 1,2,3 01 2.6 1,2,3 01 1.65 1.8 V DMID 0.6 V V Timing characteristics Clock to data ready (DRY) section Clock rising 50% to data ready falling 50% tDR 9,10,11 01 2.2 4.7 ns Clock rising 50% to data ready rising 50% with 50% duty cycle clock tC_DR50% 9,10,11 01 7.0 9.5 ns Clock to DATA, over range (OVR) section 4/ Valid DATA 5/ to clock 50% with 50% duty cycle clock (setup time) tsu(C) 9,10,11 01 1.8 ns Clock 50% to invalid DATA 5/ (hold time) th(C) 9,10,11 01 2.6 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 9 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Unit Limits Min Max Timing characteristics - continued. Data ready (DRY) / DATA, over range (OVR) section 4/ Valid DATA 5/ to data ready 50% with 50% duty cycle clock (setup time) tsu(DR)_50% 9,10,11 01 0.9 ns Data ready 50% to invalid DATA 5/ with 50% duty cycle clock (hold time) th(DR)_50% 9,10,11 01 3.9 ns 1/ Unless otherwise specified, sampling rate = 105 MSPS, 50 % clock duty cycle, AVDD = 5 V, DRVDD = 3.3 V, -1 dBFS differential input, and 3 VPP differential sinusoidal clock. 2/ Unless otherwise specified, AVDD = 5 V and DRVDD = 3.3 V. 3/ Equivalent capacitance to ground of ( load + parasitics of transmission lines ). 4/ Data is updated with clock rising edge or data ready (DRY) falling edge. 5/ See VOH and VOL levels. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 57 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 10 Case X FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 11 Case X – continued. Dimensions Symbol Inches Min Max Min Max A1 --- 0.090 --- 2.29 A2 --- 0.115 --- 2.92 A3 0.002 0.014 0.05 0.36 A4 0.03 BSC 0.762 BSC b 0.005 0.011 0.127 0.28 c 0.004 0.008 0.10 0.20 D1/E1 0.740 0.760 18.8 D2/E2 D3/E3 0.300 BSC 1.198 D4/E4 19.3 7.62 BSC 1.222 30.43 0.630 BSC e 31.04 16.0 BSC 0.025 BSC 0.64 BSC F 0.175 0.225 4.44 5.72 J 0.029 0.042 0.75 1.05 K --- 0.020 --- 0.51 K1 --- 0.018 --- 0.46 L 1.980 2.024 50.29 51.40 N NOTES: 1. 2. 3. 4. 5. 6. Millimeters 52 Controlling dimensions are inches, millimeter dimensions are given for reference only. Ceramic quad flatpack with flat leads brazed to non-conductive tie bar carrier. This package is hermetically sealed with a metal lid. The leads are gold plated and can be solder dipped. All leads are not shown for clarity purposes. Lid and heat sink are connected to GND leads. FIGURE 1. Case outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 12 Device type 01 Case outline X Terminal number Terminal symbol Terminal number Terminal symbol 1 DRVDD 27 GND 2 GND 28 AVDD 3 VREF 29 GND 4 GND 30 AVDD 5 CLK 31 DNC 6 CLK 32 OVR 7 GND 33 DRVDD 8 AVDD 34 GND 9 AVDD 35 DMID 10 GND 36 D0 (LSB) 11 AIN 37 D1 12 AIN 38 D2 13 GND 39 D3 14 AVDD 40 D4 15 GND 41 D5 16 AVDD 42 GND 17 GND 43 DRVCC 18 AVDD 44 D6 19 GND 45 D7 20 C1 46 D8 21 GND 47 D9 22 AVDD 48 D10 23 GND 49 D11 24 C2 50 D12 25 GND 51 D13 (MSB) 26 AVDD 52 DRY FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 13 Terminal symbol DRVDD Description 3.3 V power supply, digital output stage only. GND Ground. VREF 2.4 V reference. Bypass to ground with 0.1 μF microwave chip capacitor. CLK Clock input. Conversion initiated on rising edge. CLK Complemented of CLK, differential input. AVDD 5 V analog power supply. AIN Analog input. AIN Complement of AIN, differential analog input. C1 Internal voltage reference. Bypass to ground with a 0.1 μF chip capacitor. C2 Internal voltage reference. Bypass to ground with a 0.1 μF chip capacitor. DNC Do not connect. OVR Over range bit. A logic level high indicates the analog input exceeds full scale. DMID Output data voltage midpoint. Approximately equal to (DVCC) / 2. D0 (LSB) Digital output bit (least significant bit); twos complement. D1 – D5, D6 – D12 Digital output bits in two’s complement. D13 (MSB) DRY Digital output bit (most significant bit); twos complement. Data ready output. FIGURE 2. Terminal connections – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 14 FIGURE 3. Block diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 15 FIGURE 4. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 16 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 17 TABLE IIA. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 1 1 1,2,3,4,5,6, 1/ 9,10,11 1,2,3,4,5,6, 9,10,11 1 1,2,3, 1/ 4,5,6,9,10,11 1,2,3,4,5,6, 9,10,11 1 1,2,3, 1/ 2/ 4,5,6,9,10,11 1,2,3,4,5,6, 9,10,11 1 2/ 1 1 1 Device class Q --- Device class V --- --- 1/ PDA applies to subgroup 1. 2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed with reference to the zero hour electrical parameters. TABLE IIB. Burn-in and operating life test. Delta parameters (+25°C). Parameters 1/ Reference voltage Output buffer supply current Symbol Delta limits VREF ±10 mV IDRVDD ±4 mA 1/ These parameters shall be recorded before and after the required burn-in and life test to determine delta limits. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 18 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-07206 A REVISION LEVEL SHEET 19 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 08-04-22 Approved sources of supply for SMD 5962-07206 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-0720601VXC 01295 ADS5424MHFG-V 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 01295 Vendor name and address Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.